JPH0563109A - Mold type ic package - Google Patents

Abstract

PURPOSE:To provide an IC package, in which there is no possibility, in which a connecting section with a circuit board is deformed and flashing is generated, and which can be thinned and a mounting area of which can be reduced, because there is trouble, in which deformation is easy to be generated because an outer lead is used as the connecting section, defective connection is easy to be generated, the adhesion of a flash at the time of molding is not avoided and thinning and the decrease of the mounting area are difficult, in a conventional mold type IC package. CONSTITUTION:A contact hole 6 communicating with the top face or rear of a package from an inner lead 4 is formed into package, and the contact hole 6 is filled with a conductive material such as solder, copper, etc., thus forming a contact 7 section for external connection.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold type IC package which is free from deformation of external connection terminals and requires a small mounting area on a circuit board.

[0002]

2. Description of the Related Art FIG. 3 is a perspective view showing a part of a conventional mold type IC package for explaining the structure thereof, and FIG.
Is also a side view thereof. Hereinafter, the same reference numerals in the drawings indicate the same or corresponding ones. The IC chip 1 includes a component part of the lead portion and a tab 3 which is a part of the lead frame.
Is stuck to. The IC chip 1 has a plurality of chip terminal connection portions called bonding pads, and these pads and a plurality of inner leads (portions inside the package of the leads) 4 corresponding to these pads are connected by a metal wire 2 such as a gold wire. Connected and electrically conducting. The IC chip 1, the metal wire 2, the tab 3, and the inner lead 4 are embedded in the mold resin portion 8. The outer leads 5 extending from the inner leads 4 to the outside of the package are
Solder plated and used as an external connection terminal.
At the time of mounting, the tip of the outer lead is usually placed on a wiring or the like on the circuit board, heated, and then mounted by soldering.

[0003]

In the conventional IC package, the outer lead 5, which is a connecting portion with the circuit board, is generally thin and elongated, so that the outer lead 5 is likely to be deformed during transportation. However, there is a problem that is likely to occur. Further, during molding, it is unavoidable that flash attaches to the outer leads themselves or between adjacent outer leads, and it is necessary to provide a special step for removing the flash. In addition, there is a problem that it is difficult to reduce the mounting area due to the presence of the outer leads. Further, in the flat type IC package, it is difficult to reduce the thickness of the package due to the presence of the outer leads.

The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a mold type IC package which can be thinned and the mounting area can be reduced without fear of deformation and adhesion of flash. To aim.

[0005]

In order to achieve the above object, the present invention provides a mold type IC package in which a contact hole communicating from an inner lead to an upper surface or a back surface of the package is provided in a mold resin portion. A contact portion for external connection is formed by filling a conductive material such as solder or copper.

[0006]

To use the IC package constructed as described above, the IC package is placed on the wiring of the circuit board, heated and mounted in the same manner as in the prior art. As a result, the IC chip is electrically connected to the wiring on the circuit board through the contact hole.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a sectional view of an embodiment of the IC package of the present invention, and FIG. 2 is a bottom view thereof. In these drawings, reference numeral 5 is a lead in the package (mold resin), and a through hole (hereinafter referred to as a "contact hole") communicating from the inner lead 4 to the upper surface or the back surface of the package. The contact hole 5 is formed at the time of molding by a molding die. Although the lead frame used in this package does not have an outer lead portion, a tie bar that connects the tab 3 and the inner lead 4 is provided as usual, and these are cut and removed after molding as usual. The characteristic test in this state is performed by mounting the package on the sword-shaped socket and electrically connecting it to the inner lead 4 through the pin of the socket in the contact hole 5.

Next, the contact hole 5 is filled with solder or a copper wire, a copper ball, or another conductive material solder-plated, or a copper wire, copper ball, or conductive adhesive is filled and then solder-plated. Then, the contact portion 6 for external connection is formed, and the present IC package is completed.

To mount this IC package, it is placed on the wiring provided on the circuit board and heated in the same manner as in the prior art. As a result, the IC chip is soldered and electrically connected to the wiring on the circuit board through the conductive material in the contact hole.

[0010]

As described above, in the mold type IC package of the present invention, the contact portion in which the circuit board is connected is not the outer lead which is easily deformed, but the contact hole in the mold resin is filled with the conductive material. Since it is composed of parts, problems of molding defects, connection failure due to deformation during transportation, and removal man-hours due to flash adhesion are solved. Further, since it does not have outer leads, it can be three-dimensionally downsized, and the package can be made thinner and the mounting area can be reduced.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of an IC package of the present invention.

FIG. 2 is a bottom view of the embodiment.

FIG. 3 is a perspective view in which a part of a conventional IC package is viewed.

FIG. 4 is a side view of the same.

[Explanation of reference numerals] 1: IC chip, 2: metal wire, 3: tab, 4: inner lead, 5: outer lead, 6: contact hole, 7: contact portion, 8: molded resin portion.

Claims (1)

[Claims] 1. In a mold type IC package, a contact hole communicating from an inner lead to an upper surface or a back surface of the package is provided in a mold resin portion, and the contact hole is filled with a conductive material such as solder or copper for external connection. A mold type IC package characterized by being a contact portion.