JPH0562612B2 - - Google Patents
Info
- Publication number
- JPH0562612B2 JPH0562612B2 JP60227779A JP22777985A JPH0562612B2 JP H0562612 B2 JPH0562612 B2 JP H0562612B2 JP 60227779 A JP60227779 A JP 60227779A JP 22777985 A JP22777985 A JP 22777985A JP H0562612 B2 JPH0562612 B2 JP H0562612B2
- Authority
- JP
- Japan
- Prior art keywords
- polyvinyl butyral
- resin
- resin composition
- type phenolic
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60227779A JPS6289721A (ja) | 1985-10-15 | 1985-10-15 | 封止用樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60227779A JPS6289721A (ja) | 1985-10-15 | 1985-10-15 | 封止用樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6289721A JPS6289721A (ja) | 1987-04-24 |
| JPH0562612B2 true JPH0562612B2 (cs) | 1993-09-08 |
Family
ID=16866247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60227779A Granted JPS6289721A (ja) | 1985-10-15 | 1985-10-15 | 封止用樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289721A (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112015004449T5 (de) * | 2014-09-29 | 2017-07-20 | SumiRiko Fine Elastomer, Ltd. | Silikonkautschukzusammensetzung und vernetzter Silikonkautschukkörper, und integrierter Formkörper und Verfahren zur Herstellung eines integrierten Formkörpers |
| JP6714613B2 (ja) | 2015-11-30 | 2020-06-24 | 住友理工株式会社 | 電子写真機器用弾性ロールおよびその製造方法 |
| JP6585535B2 (ja) | 2016-03-29 | 2019-10-02 | 住友理工株式会社 | シリコーンゴム組成物およびシリコーンゴム架橋体 |
-
1985
- 1985-10-15 JP JP60227779A patent/JPS6289721A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6289721A (ja) | 1987-04-24 |
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