JPH0562464B2 - - Google Patents
Info
- Publication number
- JPH0562464B2 JPH0562464B2 JP58243817A JP24381783A JPH0562464B2 JP H0562464 B2 JPH0562464 B2 JP H0562464B2 JP 58243817 A JP58243817 A JP 58243817A JP 24381783 A JP24381783 A JP 24381783A JP H0562464 B2 JPH0562464 B2 JP H0562464B2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- trench
- depression
- polysilicon
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24381783A JPS60136328A (ja) | 1983-12-26 | 1983-12-26 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24381783A JPS60136328A (ja) | 1983-12-26 | 1983-12-26 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60136328A JPS60136328A (ja) | 1985-07-19 |
| JPH0562464B2 true JPH0562464B2 (cs) | 1993-09-08 |
Family
ID=17109365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24381783A Granted JPS60136328A (ja) | 1983-12-26 | 1983-12-26 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60136328A (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5094973A (en) * | 1987-11-23 | 1992-03-10 | Texas Instrument Incorporated | Trench pillar for wafer processing |
| EP0317786A3 (en) * | 1987-11-23 | 1991-01-16 | Texas Instruments Incorporated | Constant width trench for wafer processing |
| US5448102A (en) * | 1993-06-24 | 1995-09-05 | Harris Corporation | Trench isolation stress relief |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5384692A (en) * | 1976-12-29 | 1978-07-26 | Fujitsu Ltd | Semiconductor device |
| JPS5643171U (cs) * | 1979-09-10 | 1981-04-20 | ||
| JPS58168256A (ja) * | 1982-03-30 | 1983-10-04 | Fujitsu Ltd | 半導体装置 |
-
1983
- 1983-12-26 JP JP24381783A patent/JPS60136328A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60136328A (ja) | 1985-07-19 |
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