JPH0562028U - TFT substrate conductive adhesive coating device - Google Patents

Abstract

(57) [Summary] [Object] To spread and evenly stabilize a conductive adhesive applied on a TFT substrate in order to obtain electrical conduction between a thin film transistor (TFT) substrate and a counter substrate. [Structure] An adhesive application sponge 3 is provided at the tip of the adhesive cartridge 1, whereby the spread and thickness of the conductive adhesive 2 after application are made uniform and stable.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a thin film transistor (TFT) substrate conductive adhesive coating device.

[0002]

[Prior Art]

 Conventionally, as shown in FIG. 3, an adhesive applying device of this type is used for applying pressure air from the adhesive applying device after a conductive adhesive 2 is injected into a cartridge 1 having a thin discharge needle 10 at its tip. Air pressure is applied to the cartridge 1 through the nozzle 5, and the conductive adhesive 2 is discharged and applied to the TFT substrate 4.

In general, the conductive adhesive 2 ′ is electrically connected to the TFT substrate 4 and the counter substrate by being superposed on the counter substrate 4. When the conductive adhesive 2 is applied to the TFT substrate 4, the shape (spreading and thickness) of the conductive adhesive 2 ′ after application may be changed due to changes in the viscosity of the conductive adhesive 2 over time and variations in the applied air pressure. ) Sometimes became non-uniform.

[0004]

[Problems to be solved by the device]

 Conventionally, this type of adhesive applying device has a problem in that, when a conductive adhesive 2 such as a silver paste is applied, the adhesive 2 after application is affected by changes in the viscosity of the adhesive 2 with time and variations in the application pressure. The shape of ‘(spreading and thickness) was sometimes non-uniform.

For this reason, when the counter substrate and the TFT substrate coated with the adhesive 2'are superposed on each other, and when the thickness of the adhesive 2'after coating is about 100 μm or more, the contact is made. Since the adhesive 2'cannot be crushed, display unevenness is likely to occur especially in the peripheral portion coated with the adhesive 2 '.

In addition, when the spread of the adhesive 2 ′ becomes extremely small, the contact resistance between the TFT substrate and the counter substrate increases, and it becomes difficult to obtain electrical conduction between the TFT substrate and the counter substrate. It had drawbacks.

An object of the present invention is to provide a TFT substrate conductive adhesive coating device that makes the coating shape of the conductive adhesive uniform on the substrate.

[0008]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, in the TFT substrate conductive adhesive application device according to the present invention, a conductive adhesive for adhering electrical continuity between a thin film transistor (TFT) substrate and a counter substrate is attached on the substrate. In the device, a coating sponge is provided which makes the spread and thickness of the conductive adhesive adhered on the substrate uniform.

[0009]

[Action]

 Use a sponge to make the coating shape (spreading, thickness, etc.) of the conductive adhesive on the TFT substrate uniform.

[0010]

【Example】

 Hereinafter, the present invention will be described with reference to the drawings.

(Embodiment 1) FIG. 1 is a block diagram showing an embodiment of the present invention.

In FIG. 1, an adhesive cartridge 1 is supported by an arm 6, and a conductive adhesive 2 is filled in the inside thereof.

Further, a nozzle 5 for application pressure air is connected to the cartridge 1, and an adhesive application sponge 3 is attached to the ejection side thereof.

In the embodiment, the conductive adhesive 2 stored in the adhesive cartridge 1 is filled in the adhesive application sponge 3 by the air pressure sent from the application pressure air nozzle 5, and the arm 6 descends. As a result, the TFT substrate 4 is spread and spread uniformly. At this time, the adhesive application sponge 3 to be used is assumed to be able to pass through the particles according to the particle size (about 2 to 3 μm) of the conductive adhesive 2 such as silver paste to be filled, and the size thereof. Is about 1 mm × 2 mm depending on the application area of the TFT substrate 4 to be applied.

(Embodiment 2) FIG. 2 is a block diagram showing Embodiment 2 of the present invention.

As shown in FIG. 2, the adhesive transfer rod 7 is positioned by the movement of the arm 6 on the conductive adhesive 2 housed in the adhesive tray 9, and the same bonding as in the first embodiment is performed. The sponge 8 for agent transfer is inserted into the dish 9 for adhesive, the conductive adhesive 2 is attached to the sponge 8, and the spread and thickness of the conductive adhesive 2'are uniformly transferred and applied to the TFT substrate 4. be able to.

[0017]

[Effect of the device]

 As described above, according to the present invention, the spread and thickness of the conductive adhesive to be adhered to the TFT substrate are increased by providing the adhesive applying sponge or the adhesive transferring sponge in place of the ejection needle of the adhesive applying device. It has the effect that it can be stabilized uniformly.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a first embodiment of the present invention.

FIG. 2 is a configuration diagram showing a second embodiment of the present invention.

FIG. 3 is a configuration diagram showing a conventional example.

[Description of symbols] 1 cartridge for adhesive 2 conductive adhesive 2'conductive adhesive after application 3 sponge for applying adhesive 4 TFT substrate 5 nozzle for coating pressure air 6 arm 7 adhesive transfer rod 8 adhesive Transfer sponge 9 Adhesive dish 10 Discharge needle 11 Counter substrate

Claims (1)

[Scope of utility model registration request] 1. A device for depositing a conductive adhesive on a substrate for obtaining electrical continuity between a thin film transistor (TFT) substrate and a counter substrate, wherein the spread and thickness of the conductive adhesive deposited on the substrate are TF characterized by having a uniform coating sponge
T substrate conductive adhesive coating device.