JPS62213870A - Apparatus for supplying die bonding resin in semiconductor manufacturing apparatus - Google Patents

Abstract

PURPOSE:To make it possible to apply a resin over a wide area without waste by providing a resin coating head having an area wider than the diameter of the needle of a dispensing system to the leading end of the needle. CONSTITUTION:A die bonding resin 1 is received in a syringe 2 and a coating head 9 is mounted to the leading end part of the syringe 2 through a needle 3. Because the under surface of the coating head 9 has an area wider than the cross-sectional area of the needle and is formed into a shape capable of obtaining a desired emitting state, the resin is applied over a wide area of a die pad part 8 in a proper amount and shape. A resin containing a volatile component can also be used and the application of the resin to an uneven coating part becomes possible.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a resin supply device in a semiconductor manufacturing apparatus for supplying die bonding resin to a die pad portion.

[Conventional technology]

Figures 2 (a), (c), and (d) show the conventional die bonding resin (1) used in the die pad portion (8).
1 is a configuration diagram showing three main methods of supplying data to Here, FIG. 2(a) shows a dispensing system, which consists of a syringe (2) containing resin (1) and a discharge needle (3) attached to its tip. here,
The needle (3) also includes a multi-point needle (31) as shown in FIG. 3(b). Next, Figure 2 (C) shows the stamping method, in which a plate (4) for spreading the resin (1), a squeegee (5), and a spool for transferring the resin (1) onto the die pad part (8) are used. stamping head (6
). Figure 2(d) shows the printing method, in which a hole is made in the shape to which resin (1) is applied, then a mask (7) and resin (1) are applied to the die pad l! S (8)
It consists of a squeegee (5) for pushing out.

Next, we will explain the operation of each of the above methods.
The dispensing method shown in Figure (a) applies pressure to the resin (1) in the syringe + 21 and extrudes the resin (1) from the tip of the needle (3) to the die pad section (8). If the area of
! +1) can be used. This dispensing method also improves resin usage efficiency! can be made close to 100%. Next, the stamping method shown in Fig. 2 (C) is as follows.
Spread the entire resin (1) on the plate (4) to an appropriate thickness using the squeegee (5), then press the stamping head (6).
Move in the direction of the arrow -9 (n) and apply the resin (1) to the die butt part (8). In this case, the plate (
4) It is difficult to completely use up the above resin (1)'. Finally, the printing method shown in Figure 2(d) is to place resin (1) on the mask (7), pierce the mask with a squeegee (5), and apply the resin (1) to the die pad (8) according to the shape of the nine people. This is a coating method. This printing method has a problem in that it is difficult to completely use up the resin mk, and it is difficult to apply it to the die pad portion (8) of the uneven substrate.

[Problems to be Solved by the Invention] Conventional Guibond resin supply devices include the six main systems mentioned above, but in the case of the dispensing system, the resin is supplied to the die pad portion (8) with a large area. (1) Multi-point discharge is required to fully supply the semiconductor chip, and if a semiconductor chip is placed there, air will be drawn in, which will cause voids in the side fat layer, further reducing thermal conductivity. This will have a negative impact on your friends. In addition, in the stamping method and printing method, the plate (
4) and the mask (7).
) It is difficult to completely use up Th, especially in the case of resins containing volatile components, it is impossible to use this method, and the latter method has the problem that it cannot be used on uneven semiconductor substrates. .

This invention was made in order to solve the above-mentioned problems, and it is possible to apply resin to a die pad part with a wide area at -If, the use efficiency of these resins is high, and furthermore, volatile components can be It is an object of the present invention to provide a supply device for a resin for Guibond in a semiconductor manufacturing device, which can be used even for resins containing .

[Means for resolving intervening points]

The resin supply device for Guibond according to the present invention has a head for resin application at the tip of a dispense-type needle. [Function] The coating head in this invention is attached to the tip of the needle. The extruded resin is then spread over a suitable large area.

[Embodiments of the invention]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A resin supply device according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1(a) is a schematic diagram and a discharge state diagram showing an embodiment of the present invention, in which resin (1) is stored in a syringe (2), and a needle (3) is attached to the tip of the syringe (2). ) is attached to the coating head (9). Here, the lower surface of the application head (9) is a surface Wi? wider than the cross-sectional area of the needle (3)? Then, the resin (1) is discharged onto the die pad part (8) as shown in the discharge state diagram in Figure (a).
It is applied over a large area on the top. By making the coating head (9) as described above, pressure is applied to the resin (1) housed in the syringe (2) and the resin (1) is extruded from the tip of the needle (3). ) and the die pad part (8), the resin (1) is poured into the space (91) formed by the die pad part (8) in an appropriate amount and shape.
8). As a precaution, the resin (1) extruded from the needle (3) may be spread by the coating head (9) like a system stamping method, and then applied to the die pad portion (8).

In addition, in the above embodiment, the application head (9) is attached to the tip of the needle (3).
) may be directly attached to the coating head (9). However, the coating head is (9) in Figure 1 (b) and (C).
2).

As shown in (93), (94), and (95), the shape does not matter.

〔Effect of the invention〕

As described above, according to the present invention, by attaching the coating head (9) to the tip of the e-needle (3), the resin (1
) It can be easily coated in any suitable shape, and it is also possible to use resins containing volatile components. Furthermore, the resin usage efficiency can approach 100%, and it is also possible to apply the resin to the die pad portion (8) on the uneven semiconductor substrate. In addition, air entrainment when the semiconductor chip is attached is also suppressed, thereby suppressing voids and preventing a decrease in thermal conductivity.

[Brief explanation of drawings]

Nos. 111(a) to (C) are a schematic diagram of a resin supply device for Guibond showing one embodiment of the present invention, a diagram showing a state of resin application, and a diagram showing an example of the shape of a coating head, and Nos. 21N(aJ to (C))
d) is a configuration diagram showing six conventional die bonding resin supply systems. In the figure, (1) is resin, (2) is syringe, (3) is needle, (4) is spray), (5) is squeegee, (6) is stamping head, (7) is mask, (8) (9) is a coating head. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Patent Attorney Masatoshi Sato (a) (b) 2 Niji Linda 9.92-95: Introduction to 〒-y' Part 2 (a) (C) (d)

Claims (1)

[Claims] A dispense-type resin supply device for resin die bonding in semiconductor manufacturing equipment, characterized in that a coating head having an area larger than the diameter of the needle is attached to the tip of the needle.