JPH056142A - Numeral display device and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide a numeral display device capable of simply manufacturing, face-packaging on a wiring base plate, and having efficient solderability, and manufacture thereof. CONSTITUTION:The numeral display device is featured that it is constituted of a body main part 1 provided with segment parts 5, a flat-plate-like common electrode 2 internally provided in the body main part 1 and connected to the base end part of a common lead frame 41a, LED chips for segments provided on the common electrode 2 by die bonding, and individual lead frames 41 of which the pad parts 42 of base end parts are connected to the individual electrodes of the LED chips 3 by wire bonding and the extreme end parts are projected in parallel with the screen 5a of the body main part 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a numerical display which can be reflow-connected or surface-mounted to a wiring board and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIG. 3 is a partially sectional side view showing a conventional numeral display. This numeral display is a so-called lead frame type display, and an LED chip 73 is attached to a lead frame 72 in a case body (resin body) 71.
Die bonding and wire bonding,
A portion corresponding to the LED chip 73 is filled with a transparent resin 75 to form a segment portion 74. This LED
The surface of the transparent resin 75 portion corresponding to the chip 73 is shown in FIG.
As shown in, the segment portion (in the illustrated example, 8 segments with a few decimal points) is a 74.

When connecting this numerical indicator to a wiring board, the lead frame projecting outward from the case body is cut to an appropriate length, bent, and inserted into the through hole of the wiring board to connect the wiring. Dip or hand solder to the board pattern.

[0004]

The conventional numeral display is,
As shown in FIG. 3, all are dip type (lead frame type). That is, the lead frame vertically projects downward with respect to the display surface of the case body (resin body). Therefore, when connecting the numeral display to the wiring board, dip or hand soldering is used.
For this reason, the work of cutting the lead frame (lead leg) protruding to the outside of the case, the bending work, and the fitting work into the through hole are troublesome.

By the way, on the wiring board on which the numerical display is mounted, various electronic parts (chips such as semiconductors, resistors, condensers) are usually mounted in addition to the numerical display. If these electronic components are of surface mount type (reflow solder type) and the numerical display is of dip type, it is necessary to perform soldering work twice by separate methods, which is a hassle. However, there were disadvantages such as poor efficiency of solder connection work.

The present invention solves the above problems, and provides a numerical display which can be easily manufactured, can be surface-mounted on a wiring board, and has good soldering and connection work efficiency, and a manufacturing method thereof. With the goal.

[0007]

In order to achieve this object, the numeral display according to the first aspect of the present invention (Claim 1) has the following construction. The number display unit includes a body body having a segment portion, a plate-shaped common electrode built in the body body, in which a common lead frame is continuous, and a segment LED chip die-bonded on the common electrode. L
The pad portion of the base end portion is wire-bonded to the individual electrode of the ED chip, and the tip portion is composed of an individual lead frame protruding parallel to the display surface of the body body.

In the numerical display device having such a structure,
The tip of the lead frame (individual lead frame and common lead frame) protruding outward from the body is
It is set parallel to the display surface (segment display surface) of the body. Therefore, the tip end portion of each lead frame corresponds to the horizontal pattern portion of the wiring board in parallel, and reflow soldering (surface mounting) is possible. Therefore, it is possible to eliminate the conventional dip-type defects (such as fitting into a through hole) in which the lead legs project downward in a direction orthogonal to the bottom surface of the body. Also, when electrically connecting to the wiring board, one reflow soldering work is required together with other electronic components (surface mounting type components) to be mounted on the wiring board.
Solder work becomes extremely simple.

Further, claim 2 (claim 2)
In the manufacturing method of the numerical display described, a plurality of lead frames are projected from a tie bar, one of the plurality of lead frames is connected to a flat plate-shaped common electrode, and a segment LED chip is provided on the upper surface of the common electrode. Die-bonding, wire bonding the individual electrodes of each LED chip to the corresponding pad part of the lead frame, and resin filling to form the body body except for the tip part of the lead frame and the space for the segment corresponding to the LED chip. And the step of filling the space for the segment in the body body with a transparent resin to form the segment portion, cutting the continuous portion of the tie bar and the lead frame, and freeing the lead frame tip portion in the free state of the body body. And a step of setting the display surface parallel to the display surface.

In such a manufacturing method, the LED chip is mounted on the upper surface of the common electrode which is continuously held and fixed to the tie bar via one lead frame (common lead frame), and the vicinity of each LED chip is mounted. After wire-bonding the pads of each lead frame (individual lead frame) and the individual electrodes arranged in the above, the resin is filled to form the body main body having the segment portions, and the tie bar and the lead frame are cut. Then, the leading end of the lead frame protruding outward from the body is bent so as to be parallel to the display surface of the body. As a result, the lead frame of the display is parallel to the horizontal pattern of the wiring board. Therefore, with a simple manufacturing process,
A surface mountable numeric display can be obtained.

[0011]

FIG. 2 is a side view showing a specific embodiment of the numerical display device according to the first aspect of the present invention (claim 1).

The numeral display is a body body 1 having a segment portion 5 in its plane, and a flat plate-shaped common electrode 2 built in the body body 1 and having a common lead frame 41a continuous thereto.
A segment LED chip 3 die-bonded onto the common electrode 2; and a pad portion 42 at the base end is wire-bonded to the individual electrode of the LED chip 3;
The distal end portion is composed of an individual lead frame 41 protruding in parallel with the display surface 5a of the body body 1.

This numerical indicator is formed by the following steps. As shown in FIG. 1, a plurality of lead frames 41 (five in each example) are integrally projected in the opposite direction from the tie bars 4 and 4 facing each other in parallel to form a single lead frame (common lead frame). 41a is continuous with the flat plate-shaped common electrode 2. On the upper surface of the common electrode 2, segment LED chips (8, with a few decimal points in the embodiment) 3 are die-bonded. Furthermore, this LE
The individual electrode of the D chip 3 is wire-bonded to the base end pad portion 42 of the lead frame 41 extending to the vicinity.

After that, the body main body 1 is formed by filling resin with the exception of the tip portions of the lead frames 41 and 41a and the space for the segment corresponding to the LED chip 3. That is, except for the segment forming portion, a black epoxy resin is filled with a mold and resin-molded in a box shape so that the tip portions of the lead frames 41 and 41a project. Next, the segment space in the body 1 is filled with a transparent resin to form the segment 5. That is, a transparent epoxy resin is filled in the space for the segment with a mold to form each segment 5 corresponding to each LED chip 3 in the surface of the body 1.

Further, the tie bar 4 and the lead frame 41,
The lead frame 41, 4 is cut by cutting the continuous portion with 41a.
The tip of 1a is in a free state. Then, the free end portions of the lead frames 41 and 41a are bent in parallel to the display surface 5a of the body 1 of the body. As a result, FIG.
As shown in, the lead frames (lead legs) 41 and 41 a protruding from both ends of the body 1 are parallel to the horizontal pattern portion 61 of the wiring board 6.

In the numeral display having such a structure,
The lead frames 41, 41 a projecting outward from both ends of the body 1 are parallel to the display surface 5 a of the body 1. Therefore, each lead frame 41, 4
1a corresponds to each pattern portion 61 of the wiring board 6 in parallel, and reflow soldering (surface mounting) is possible.

Further, claim 2 (claim 2)
According to the manufacturing method of the described number display device, after the LED chip 3 on the common electrode 2 and the lead frames 41, 41a are wire-bonded, resin molding is performed to form the body main body 1 having the segment portion 5, Lead frame 4
By simply bending the tip portions of the reference numerals 1 and 41a in parallel with the display surface 5a, the horizontal patterns 61 of the wiring board are parallel. Therefore, it is possible to obtain the surface mountable numeric display at a low cost with an extremely easy manufacturing process.

[0018]

As described above, according to the present invention, the segment LED chip is mounted on the common electrode built in the body having the segment portion, and the LED chip is electrically connected to the lead frame. Since the tip of the lead frame is projected in parallel with the display surface of the body, surface mounting becomes possible. Therefore,
Unlike the conventional method, the work of inserting the lead leg into the through hole is not required, and it is processed with one reflow solder at the same time as other surface mount type electronic components mounted on the wiring board. This improves the efficiency of solder work.

Further, in the method of manufacturing a numeral display device, a lead frame parallel to the display surface of the body can be formed in a protruding manner by an extremely simple manufacturing process, and a numerical display device which can be surface-mounted easily and inexpensively is obtained. It has an excellent effect of achieving the object of the invention.

[Brief description of drawings]

FIG. 1 is an explanatory plan view showing a state during manufacturing of a numerical display device according to an embodiment.

FIG. 2 is a side view showing an example numeral display device.

FIG. 3 is a partial cross-sectional side view showing a conventional numeral display.

FIG. 4 is an explanatory diagram showing an example of a segment of a numeral display device.

[Explanation of symbols]

1 body 2 common electrode LED chip for 3 segments 4 tie bar 5 segment section 41 lead frame

Claims (2)

[Claims] 1. A body main body having a segment portion, a flat plate-shaped common electrode built in the body main body and having a base end portion of a common lead frame continuous, and a segment LED die-bonded onto the common electrode. Chip and this L
A numerical indicator comprising a pad portion at a base end portion of which is wire-bonded to an individual electrode of an ED chip, and an individual lead frame having a tip portion protruding in parallel with a display surface of a body body. 2. A plurality of lead frames are projected from a tie bar, one of the plurality of lead frames is connected to a plate-shaped common electrode, and a segment LED chip is die-bonded to the upper surface of the common electrode, A step of wire-bonding the individual electrodes of the LED chip to a corresponding pad portion of the lead frame; a step of forming a body body by resin-filling except the tip portion of the lead frame and the space for the segment corresponding to the LED chip; The process of filling the space for the segment in the main body with transparent resin to form the segment, and cutting the continuous part of the tie bar and the lead frame so that the free end of the lead frame is parallel to the display surface of the body A method of manufacturing a numeral display device, which comprises the steps of: