JPH0558273B2 - - Google Patents

Info

Publication number
JPH0558273B2
JPH0558273B2 JP12795784A JP12795784A JPH0558273B2 JP H0558273 B2 JPH0558273 B2 JP H0558273B2 JP 12795784 A JP12795784 A JP 12795784A JP 12795784 A JP12795784 A JP 12795784A JP H0558273 B2 JPH0558273 B2 JP H0558273B2
Authority
JP
Japan
Prior art keywords
leads
lead
lead frame
thin metal
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP12795784A
Other languages
English (en)
Japanese (ja)
Other versions
JPS617673A (ja
Inventor
Shizuo Tsuru
Kazufumi Isomichi
Takashi Nishimoto
Shuichi Kitano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59127957A priority Critical patent/JPS617673A/ja
Publication of JPS617673A publication Critical patent/JPS617673A/ja
Publication of JPH0558273B2 publication Critical patent/JPH0558273B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP59127957A 1984-06-21 1984-06-21 リ−ドフレ−ム Granted JPS617673A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59127957A JPS617673A (ja) 1984-06-21 1984-06-21 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59127957A JPS617673A (ja) 1984-06-21 1984-06-21 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS617673A JPS617673A (ja) 1986-01-14
JPH0558273B2 true JPH0558273B2 (enExample) 1993-08-26

Family

ID=14972836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59127957A Granted JPS617673A (ja) 1984-06-21 1984-06-21 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS617673A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0217082A1 (de) * 1985-09-30 1987-04-08 Siemens Aktiengesellschaft Bauelementeträger und Verfahren zur Herstellung eines Bauelements mit einem solchen Bauelementeträger
JP2535651B2 (ja) * 1990-07-24 1996-09-18 株式会社東芝 半導体装置
JPH056142A (ja) * 1991-06-27 1993-01-14 Rohm Co Ltd 数字表示器及びその製造方法
JP2009016794A (ja) * 2007-06-05 2009-01-22 Mitsubishi Electric Corp キャップレスパッケージ及びその製造方法
US9748164B2 (en) 2013-03-05 2017-08-29 Nichia Corporation Semiconductor device
JP7704323B1 (ja) * 2024-11-18 2025-07-08 三菱電機株式会社 リードフレーム、半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
JPS617673A (ja) 1986-01-14

Similar Documents

Publication Publication Date Title
EP0424530B1 (en) Resin-sealed semiconductor device
US3413713A (en) Plastic encapsulated transistor and method of making same
US3444441A (en) Semiconductor devices including lead and plastic housing structure suitable for automated process construction
US5309018A (en) Lead frame having deformable supports
JPH0558273B2 (enExample)
JPH07221243A (ja) 半導体製造方法
US4893169A (en) Lead frame and a process for the production of a lead with this lead frame
US11037866B2 (en) Semiconductor device and method of manufacturing the same
JP3602238B2 (ja) 半導体圧力センサおよびその製造方法
JP2629853B2 (ja) 半導体装置
JPH088385A (ja) 樹脂封止型半導体装置
JP2002076234A (ja) 樹脂封止型半導体装置
JP2678696B2 (ja) 半導体装置の製造方法
JP3781926B2 (ja) 光結合半導体装置
JPH0355989B2 (enExample)
JP2005135938A (ja) 半導体装置およびその製造方法
JP2697743B2 (ja) 樹脂封止型半導体装置
JPH09138172A (ja) 半導体圧力センサおよびその製造方法
JPS6252463B2 (enExample)
EP0242962A1 (en) Offset pad semiconductor lead frame
JP4018595B2 (ja) 半導体装置、半導体装置に用いるリードフレーム及びその製造方法
JP3015458B2 (ja) リードフレームを用いた半導体装置の製造方法
JP4455011B2 (ja) プリモールドパッケージ及びこれを用いた半導体装置
JPS58123747A (ja) 半導体装置の製造方法
JPH07122580A (ja) 半導体装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term