JPH055789B2 - - Google Patents

Info

Publication number
JPH055789B2
JPH055789B2 JP25951988A JP25951988A JPH055789B2 JP H055789 B2 JPH055789 B2 JP H055789B2 JP 25951988 A JP25951988 A JP 25951988A JP 25951988 A JP25951988 A JP 25951988A JP H055789 B2 JPH055789 B2 JP H055789B2
Authority
JP
Japan
Prior art keywords
ceramic
joining
brazing material
layer
electroless plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP25951988A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02107579A (ja
Inventor
Michio Kobayashi
Hidekazu Henmi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yoshino Denka Kogyo Inc
Original Assignee
Yoshino Denka Kogyo Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yoshino Denka Kogyo Inc filed Critical Yoshino Denka Kogyo Inc
Priority to JP25951988A priority Critical patent/JPH02107579A/ja
Publication of JPH02107579A publication Critical patent/JPH02107579A/ja
Publication of JPH055789B2 publication Critical patent/JPH055789B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
JP25951988A 1988-10-17 1988-10-17 セラミックスの接合方法 Granted JPH02107579A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25951988A JPH02107579A (ja) 1988-10-17 1988-10-17 セラミックスの接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25951988A JPH02107579A (ja) 1988-10-17 1988-10-17 セラミックスの接合方法

Publications (2)

Publication Number Publication Date
JPH02107579A JPH02107579A (ja) 1990-04-19
JPH055789B2 true JPH055789B2 (en, 2012) 1993-01-25

Family

ID=17335225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25951988A Granted JPH02107579A (ja) 1988-10-17 1988-10-17 セラミックスの接合方法

Country Status (1)

Country Link
JP (1) JPH02107579A (en, 2012)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08177417A (ja) * 1994-12-28 1996-07-09 Sumitomo Electric Ind Ltd 摺動部品およびその製造方法
US20100258233A1 (en) 2007-11-06 2010-10-14 Mitsubishi Materials Corporation Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate
JP5309885B2 (ja) * 2008-10-21 2013-10-09 三菱マテリアル株式会社 パワーモジュール用基板のセラミックス基板の製造方法及びパワーモジュール用基板の製造方法
EP3666745B1 (fr) 2018-12-14 2025-06-18 Comadur SA Procede de brasage de composants en alliage de titane avec des composants en ceramique a base de zircone pour l'horlogerie ou la joaillerie

Also Published As

Publication number Publication date
JPH02107579A (ja) 1990-04-19

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees