JPH0557240A - Method for applying adhesive - Google Patents

Abstract

PURPOSE:To uniformly discharge an adhesive from plural coating nozzles and to accurately apply the adhesive even on a subminiature chip at the time of applying the adhesive for sticking an electronic part to the printed board, etc. CONSTITUTION:An adhesive is temporarily applied from coating nozzles 1, 2 and 3 before the adhesive is actually applied, a recognition camera 4 is moved onto the temporarily applied adhesive, the picture of adhesive is taken by the camera 5 after the waiting time preset for the respective nozzles 1, 2 and 3, and the area of the adhesive is obtained from the recognized picture to set the actual coating time. Consequently, the time from the application of the adhesive until the picture is taken is made constant, and the adhesive is uniformly discharged.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive application method for applying a fixing adhesive to an electronic component to be fixed to a printed circuit board or the like.

[0002]

2. Description of the Related Art In recent years, with the spread of ultra-small chip electronic components (hereinafter referred to as "chip components"), the spacing between mounted components and the spacing between soldered joints have been reduced,
Even when changing the conditions for applying an adhesive for fixing electronic components for fixing these chip components, there is a strong demand for higher coating accuracy and higher reliability without variations.

A conventional method of applying an adhesive will be described below. As shown in FIG. 3, the adhesive applying device for fixing electronic components is provided with tanks 1, 2 and 3 filled with the adhesive for fixing electronic components and a recognition camera 4 made of CCD for recognizing the adhesive. An X robot 6 for positioning the applied coating head part 5 in a predetermined X direction, and a printed circuit board 7 for applying an adhesive.
Is configured by a Y robot 8 which positions the robot in a predetermined Y direction.

A method of applying an adhesive by the application device configured as described above will be described with reference to FIGS. 3 and 4.

First, based on preset data, a nozzle for applying an adhesive for fixing electronic parts to the printed circuit board 7 is selected from a plurality of coating nozzles 1, 2, 3 and a predetermined nozzle is preset. The robot is moved by the X robot 6 and the Y robot 8 so as to come to the coating position and discharged for a predetermined coating time, then the recognition camera 4 for the adhesive is moved to the temporary coating position, the adhesive area is measured, and the adhesive is discharged. It is fed back to the time to control the amount of adhesive during actual application.

[0006]

However, in the above-mentioned conventional adhesive coating method, the gaps between the coating nozzles 1, 2 and 3 and the adhesive recognition camera 4 are different, and after the provisional coating, the recognition camera 4 of the recognition camera 4 is removed. Since the moving time to the temporary coating position is different for each coating nozzle, the timing of image capture is also different. On the other hand, the area of the temporarily applied adhesive expands after the application is completed due to the viscosity of the adhesive itself. In particular, the area changes remarkably immediately after the end of coating. Therefore,
There is a problem in that the measured value of the area of the adhesive changes depending on the timing of image recognition, and the feedback amount of the ejection time differs for each of the coating nozzles 1, 2, and 3.

The present invention solves the above-mentioned conventional problems and provides an adhesive which can make the amount of adhesive discharged from each coating nozzle uniform and can accurately apply the adhesive to even ultra-small chip components. It is intended to provide a coating method.

[0008]

In order to achieve this object, the adhesive coating method of the present invention is such that temporary coating is performed by each coating nozzle before actual coating, and a recognition camera is mounted on the temporarily coated adhesive. By moving the coating nozzle, the image of the adhesive applied by the recognition camera is taken after the preset wait time for each coating nozzle, the area of the adhesive is calculated from the recognition image, and the coating time for actual coating is set. is there.

[0009]

According to this method, the time from the application of the adhesive to the capturing of the image is the same even in different coating nozzles, and the area of the adhesive at the time of capturing the image is the same.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

The fixing adhesive applying device of the adhesive applying method according to one embodiment of the present invention includes a timer (not shown) for the applying nozzle 2 and the applying nozzle 3 of the conventional applying device described with reference to FIG. The description is omitted because it is the same except for the arrangement of the above.

A method of applying an adhesive by the application device having the above-described configuration will be described with reference to FIGS. 1 and 2.

First, based on preset data, a plurality of coating nozzles 1, 2 and 3 are used to select a nozzle for applying an adhesive for fixing electronic components to the printed circuit board 7, and a predetermined nozzle is preset. The X robot 6 and the Y robot 8 are moved to the temporary coating position, the adhesive is discharged for a predetermined coating time, and then the adhesive recognition camera 4 is moved to the temporary coating position. After the movement is completed, set a preset timer for each coating nozzle, capture the image when the timer is up, calculate the adhesive area, feed it back to the ejection time, and set the amount of adhesive during actual coating. Control. That is, by using a weight timer at the time of image capturing for the coating nozzles 2 and 3 in which the moving time of the adhesive recognition camera 4 is shorter than that of the coating nozzle 1, the image capturing time is set to the same time as the coating nozzle 1. The image capturing timing is the same regardless of the position of the coating nozzle, and the influence of the area change of the adhesive can be made constant for each nozzle, so that quantitative coating can be realized.

Further, the present invention is not limited to the above-mentioned embodiment. For example, in the present embodiment, a timer is used to adjust the timing of image capturing, but the adhesive recognition camera is moved onto the adhesive. The moving speed at that time may be changed depending on each coating nozzle to have the same function.

As described above, according to this embodiment, the application nozzles 1, 2, and 3 are picked up by the method of capturing the image of the area of the adhesive after application by the recognition camera 4 after the wait time set for each application nozzle. Regardless of the distance of the adhesive recognition camera 4, the image capturing timing after applying the adhesive is made constant, the area of the recognized adhesive becomes the same, and the amount of feedback to the ejection time of the actual application is constant. Therefore, the discharge amount of the adhesive can be made uniform irrespective of the application nozzles 1, 2 and 3, and a highly reliable predetermined amount of the adhesive can be applied corresponding to a micro chip component.

[0016]

As is apparent from the above description of the embodiments, the present invention performs temporary coating with each coating nozzle before actual coating,
The recognition camera is moved onto the temporarily applied adhesive, the image of the applied adhesive is taken in by the recognition camera after a preset wait time for each application nozzle, and the area of the adhesive is calculated from the recognized image. An excellent adhesive application method that can even out the amount of adhesive ejected from each application nozzle by setting the application time during actual application, and can apply accurate adhesive even to ultra-small chip parts. Can be realized.

[Brief description of drawings]

FIG. 1 is a flowchart of an adhesive application method according to an embodiment of the present invention.

FIG. 2 is a timing chart of each coating nozzle in the adhesive coating method.

FIG. 3 is a perspective view showing the concept of a fixing adhesive applying device.

FIG. 4 is a flowchart of a conventional adhesive applying method.

[Explanation of symbols]

 1, 2 and 3 coating nozzle 4 recognition camera 5 coating head 6 X robot 8 Y robot

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tomoyuki Nakano 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] 1. An application head unit having a plurality of adhesive application nozzles and a recognition camera for measuring the area of the adhesive, an X robot for moving the application head unit in the X direction, and a printed circuit board mounted thereon. An adhesive application device for fixing an electronic component, comprising a Y robot that moves in the Y direction, wherein provisional application is performed by the application nozzle before actual application, and the recognition camera is moved onto the provisionally applied adhesive. Then, after the preset wait time for each application nozzle, the image of the temporarily applied adhesive is taken in by the recognition camera, the area of the adhesive is obtained from the recognition image, and the actual application time is set. How to apply adhesive.