JP2019047067A - Substrate work apparatus - Google Patents

Abstract

To provide a substrate work apparatus capable of suppressing an erroneous determination caused by a change in an application shape of a liquid material.SOLUTION: The substrate work apparatus includes: a dispense head 41 for applying a liquid material whose application shape changes with the lapse of time after application to a substrate B; and an inspection unit 8 that inspects at least one of the area or the shape of the liquid material applied on the substrate B in a plan view. At a timing on the basis of the change over time of the application shape of the liquid material applied to the substrate B, an inspection using the inspection unit 8 for the liquid material is performed.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a substrate working apparatus, and more particularly to a substrate working apparatus that applies a liquid material whose application shape changes with time after application to a substrate.

  Conventionally, there is known a substrate working apparatus which applies a liquid material whose application shape changes with the lapse of time after application onto a substrate (see, for example, Patent Document 1).

  In Patent Document 1 described above, a coating head (dispense head) for applying a paste to a substrate, a trial striking stage for trially striking the paste, and a state of application of the paste applied on the trial striking stage are inspected. A paste application device (substrate work device) including a camera (inspection unit) is disclosed. Here, the paste is a liquid material whose application shape changes with the passage of time after application by the application head.

  In the paste application device described in Patent Document 1, whenever the application pattern of the paste to be applied is changed, the inspection of the state of the paste to be applied on the trial strike stage is performed. Then, in the paste application device described in Patent Document 1, when the state of the paste on the trial shot stage is good, application of the paste onto the substrate by the application head is continuously performed until the application pattern is changed. To be done.

JP, 2011-200821, A

  As described above, in the paste application device described in Patent Document 1, the inspection of the state of the paste to be applied is not performed until the application pattern is changed, so the number of times of paste application performed continuously is In the case of many, the elapsed time from the application of the paste to the inspection becomes long. In this case, since the application shape of the paste changes with the passage of time, the paste application device described in Patent Document 1 has a disadvantage that the normal application is misjudged as a defect or the abnormal application is misjudged as good. There is. That is, in the paste application device described in Patent Document 1, there is a problem that an erroneous determination may occur due to a change in the application shape of the paste, as the elapsed time from the application of the paste to the inspection becomes long. is there.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate processing apparatus capable of suppressing an erroneous determination resulting from a change in the application shape of a liquid material.

  In order to achieve the above object, according to one aspect of the present invention, there is provided a substrate processing apparatus comprising: a dispense head for applying a liquid material whose application shape changes with time after application; and a liquid material applied on a substrate And an inspection unit for inspecting at least one of the area or the shape in a plan view of the liquid, and the inspection using the inspection unit for the liquid material is performed at a timing based on a change over time of the application shape of the liquid material applied It is configured to be done.

  In the substrate work apparatus according to one aspect of the present invention, as described above, the number of times of application performed continuously by performing inspection by the inspection unit at the timing based on the change with the elapse of time of the application shape of the liquid material. Even if there are many cases, it is possible to appropriately inspect the application shape before a significant change occurs in the application shape. Thereby, the erroneous determination resulting from the change of the application | coating shape of a liquid material can be suppressed.

  In the substrate work apparatus according to one aspect of the present invention, preferably, the inspection of the liquid material on the substrate by the inspection unit is performed by the change with time of the application shape of the liquid material applied to the substrate. It is configured to be performed at the timing based on the allowable time until the inspection result of the liquid material by the above is judged to be defective. According to this structure, since the inspection unit inspects the liquid material on the substrate within the allowable time, it is possible to reliably suppress the erroneous determination of the inspection by the inspection unit.

  In the substrate processing apparatus according to one aspect of the present invention, preferably, the inspection of the liquid material on the substrate by the inspection unit is performed over time of the application shape of the liquid material after applying the liquid material to the substrate multiple times by the dispense head. It is configured to be performed at a timing based on the accompanying change. According to this configuration, the inspection unit performs the inspection after applying the liquid material to the substrate a plurality of times by the dispense head, so the inspection by the inspection unit is performed more efficiently than in the case where the inspection is performed for each application. be able to. Thereby, the inspection by the inspection unit can be efficiently performed while suppressing the erroneous determination caused by the change in the application shape of the liquid material.

  In this case, preferably, the inspection of the liquid material on the substrate by the inspection unit is performed in the order of application from the liquid material applied to the substrate at the earliest time among untested liquid materials applied to the substrate. Is configured. According to this structure, since it is possible to inspect in order from the liquid material in which the application shape of the liquid material is most changed, it is possible to more reliably suppress the erroneous determination of the inspection by the inspection unit.

  In the substrate processing apparatus according to one aspect of the present invention, preferably, the inspection of the liquid material on the substrate by the inspection unit is based on the fact that the liquid material is applied by the dispense head at the locations corresponding to the predetermined number of parts. Are configured to be performed. According to this configuration, the timing at which the inspection of the liquid material is performed is set based on the predetermined number of parts. Therefore, according to the specification of the parts within the timing based on the change over time of the application shape of the liquid material. Therefore, it is possible to set the timing for inspecting the liquid material appropriately.

  In the substrate processing apparatus including the inspection unit for inspecting the liquid material on the substrate, preferably, the inspection of the liquid material on the substrate by the inspection unit is preferably performed based on the fact that the liquid material is applied a predetermined number of times by the dispense head. Are configured to be performed. According to this structure, the timing at which the inspection of the liquid material is performed is set based on the number of times of application of the liquid material on the substrate. Therefore, within the timing based on the change with time of the application shape of the liquid material. The timing for inspecting the liquid material can be set appropriately in accordance with the arrangement of the portion on the substrate to which the liquid material is applied.

  In the substrate processing apparatus configured to perform the inspection of the liquid material by the inspection unit at a timing based on the allowable time, preferably, the inspection of the liquid material on the substrate by the inspection unit is performed among the untested liquid materials The cumulative movement time which accumulated the movement time between each application position to the application position which applies the liquid material next to the application position of the liquid material applied to the earliest time, and the untested from the application position which applies the liquid material next The time which added the return time which it takes to move to the application position of the liquid material applied to the earliest of the liquid materials and the total inspection time which added the inspection time of the untested liquid material on the substrate It is configured to be performed when the time becomes larger than the allowable time or the time immediately before the allowable time elapses. According to this configuration, the timing of the inspection of the liquid material on the substrate by the inspection unit is set based on the total movement time, the return time, and the total inspection time, and thus the timing of the inspection of the liquid material on the substrate by the inspection unit Can be set to the timing based on the change over time of the application shape of the liquid material. Here, the time immediately before the allowable time elapses indicates a time less than the allowable time and in a range close to the allowable time (for example, within 10 seconds).

  In this case, preferably, the inspection of the liquid material on the substrate by the inspection unit is configured to be performed based on a change in the conditions for applying the liquid material to the substrate by the dispense head. According to this structure, even when the application condition of the liquid material on the substrate by the dispense head is changed, the inspection unit inspects the liquid material on the substrate. Therefore, the liquid material on the substrate by the inspection unit It can control that the time interval of inspection of 3 becomes too large.

  According to the present invention, as described above, it is possible to suppress an erroneous determination caused by a change in the application shape of the liquid material.

It is the top view which showed the outline of the component mounting apparatus by 1st-4th embodiment of this invention. It is the side view which showed the outline of the component mounting apparatus by 1st Embodiment of this invention. FIG. 10 is a block diagram showing a control configuration of the component mounting device according to the first to fourth embodiments and the first modification of the present invention. FIG. 4A is a side view schematically showing a state in which the flux is applied to the first application position by the dispense head. FIG. 4 (B) is a plan view schematically showing a state where the flux is applied to the first application position by the dispense head. FIG. 5A is a side view schematically showing a state in which the flux is applied to the second application position by the dispense head. FIG. 5 (B) is a plan view schematically showing a state in which the flux is applied to the second application position by the dispense head. FIG. 6A is a side view schematically showing a state where the flux is applied to the third application position by the dispense head. FIG. 6 (B) is a plan view showing an outline of a state where the flux is applied to the third application position by the dispense head. FIG. 7A is a side view schematically showing a state where the flux is applied to the fourth application position by the dispense head. FIG. 7B is a plan view schematically showing a state where the flux is applied to the fourth application position by the dispense head. FIG. 8A is a side view schematically showing a state in which the flux is applied to the fifth application position by the dispense head. FIG. 8B is a plan view schematically showing a state where the flux is applied to the fifth application position by the dispense head. FIG. 9A is a side view schematically showing a state where the flux is applied to the sixth application position by the dispense head. FIG. 9 (B) is a plan view schematically showing a state where the flux is applied to the sixth application position by the dispense head. It is the flowchart which showed the inspection process implemented by the control part of the component mounting apparatus by 1st Embodiment of this invention. FIG. 11A is a plan view showing an outline of a state in which the coating 1 is coated with a flux by the dispense head. FIG. 11 (B) is a plan view showing an outline of a state in which flux is applied to coating 1 to coating 4 by the dispense head. FIG. 11C is a plan view schematically showing a state in which the flux applied to application 1 to application 4 is inspected by the dispense head. FIG. 12A is a plan view showing an outline of a state in which the coating 5 is coated with a flux by the dispense head. FIG. 12 (B) is a plan view showing an outline of a state in which flux is applied to coating 5 to coating 8 by the dispense head. FIG. 12C is a plan view showing an outline of a state in which the flux applied to the application 5 to the application 8 is inspected by the dispense head. It is the flowchart which showed the inspection process implemented by the control part of the component mounting apparatus by 2nd Embodiment of this invention. FIG. 14A is a plan view showing an outline of a state in which the coating 1 is coated with the flux by the dispense head. FIG. 14 (B) is a plan view showing an outline of a state in which flux is applied to coating 1 to coating 4 by the dispense head. FIG. 14C is a plan view showing an outline of a state in which the flux applied to the coating 1 to coating 4 is inspected by the dispense head. FIG. 15A is a plan view showing an outline of a state in which the coating 5 is coated with a flux by the dispense head. FIG. 15 (B) is a plan view showing an outline of a state in which flux is applied to coating 5 to coating 8 by the dispense head. FIG. 15C is a plan view showing an outline of a state in which the flux applied to the application 5 to application 8 is inspected by the dispense head. It is the flowchart which showed the inspection processing which is executed by the control section of the component mounting device due to the 3rd execution form of this invention. FIG. 17A is a plan view showing an outline of a state in which the coating 1 is coated with the flux by the dispense head. FIG. 17B is a plan view showing an outline of a state in which flux is applied to coating 1 to coating 4 by the dispense head. FIG. 17C is a plan view showing an outline of a state in which the flux applied to application 1 to application 4 is inspected by the dispense head. FIG. 18A is a plan view showing an outline of a state in which the coating 5 is coated with a flux by the dispense head. FIG. 18B is a plan view showing an outline of a state in which flux is applied to coating 5 to coating 8 by the dispense head. FIG. 18C is a plan view showing an outline of a state in which the flux applied to the coating 5 to the coating 8 is inspected by the dispense head. It is the flowchart which showed the inspection process implemented by the control part of the component mounting apparatus by 4th Embodiment of this invention. FIG. 20A is a plan view showing an outline of a state in which flux is applied to coating 1 to coating 3 by the dispense head. FIG. 20 (B) is a plan view showing an outline of a state in which the flux applied to Coating 1 to Coating 3 is inspected by the dispense head. It is the flow chart which showed the inspection processing carried out by the control part of the component mounting apparatus by the 1st modification of a 4th embodiment of the present invention.

  Hereinafter, an embodiment of the present invention will be described based on the drawings.

First Embodiment
A component mounting apparatus 1 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 12.

(Configuration of component mounting device)
First, the configuration of the component mounting apparatus 1 according to the first embodiment of the present invention will be described.

  As shown in FIG. 1, a component mounting apparatus 1 for mounting an electronic component E such as an IC, a transistor, a capacitor, and a resistor on a substrate B such as a printed circuit board will be described as an example of a substrate work apparatus. Here, in the component mounting apparatus 1, the transport direction for transporting the substrate B is X1, the reverse direction of the transport direction for transporting the substrate B is X2, and the direction orthogonal to the X direction in the horizontal direction is Y. . Further, in the component mounting apparatus 1, the vertical direction orthogonal to the X direction and the Y direction is taken as the Z direction. The electronic component E is an example of the “component” in the claims.

  The component mounting apparatus 1 includes a base 2, a substrate conveyance unit 3, a head unit 4, a support unit 5, a rail unit 6, a component imaging unit 7, a substrate imaging unit 8, and a control unit 9. ing. The substrate imaging unit 8 is an example of the “inspection unit” in the claims.

<Base>
The base 2 is a base on which the components are arranged in the component mounting apparatus 1. On the base 2, a substrate transfer unit 3, a rail unit 6, and a component imaging unit 7 are provided as components. Further, in the base 2, a control unit 9 is provided. Further, on the base 2, feeder arranging portions 11 a capable of arranging a plurality of tape feeders 11 are provided on both sides in the Y direction (Y1 direction side and Y2 direction side).

<Tape feeder>
The tape feeder 11 is a device for supplying an electronic component E mounted on the substrate B. The tape feeder 11 holds a reel (not shown) around which a tape (not shown) holding a plurality of electronic components E is wound. Further, the tape feeder 11 supplies the electronic component E by rotating the held reel to send out the tape in accordance with the component holding operation for taking out the electronic component E by the head unit 4.

<Substrate transfer unit>
The substrate transport unit 3 is configured to carry the substrate B from the outside of the component mounting apparatus 1 and transport the substrate B in the transport direction (direction X1). The substrate transport unit 3 includes a pair of conveyors 3a and a drive motor 3b for rotating the pair of conveyors 3a. Each of the pair of conveyors 3a has a pulley (not shown) and a ring-shaped conveyor belt 31a wound around the pulley. The control unit 9 is configured to control the transport speed of the substrate B placed on the pair of conveyor units 3a by controlling the drive motor 3b.

<Head unit>
As shown in FIG. 2, the head unit 4 is a head unit 4 for component mounting, and is configured to mount an electronic component E on a substrate B fixed at a mounting position. Specifically, the head unit 4 includes a plurality (two) of dispensing heads 41 and a plurality (four) of mounting heads 42.

  Each of the plurality of dispense heads 41 is connected to a syringe (not shown) filled with flux F so that flux F (see FIG. 4) supplied from the syringe can be applied onto the substrate B from the tip end It is configured. Each dispense head 41 is configured to be vertically movable by a Z-axis motor 41a (see FIG. 3). In each of the plurality of dispense heads 41, the application condition of the flux F is set differently. Here, the application condition of the flux F is the size of the diameter of the flux F applied on the substrate B. The size of the diameter of the flux F applied on the substrate B changes with the time for discharging the flux F from the dispense head 41. The flux F is an example of the “liquid material” in the claims.

  Each of the plurality of mounting heads 42 is connected to a vacuum generating device (not shown), and the electronic component E is held (adsorbed) by the nozzle 42 a attached to the tip by negative pressure supplied from the vacuum generating device. It is configured to be possible. Each mounting head 42 is configured to be movable in the vertical direction by the Z-axis motor 43. In addition, each mounting head 42 is configured to be rotatable around a rotation axis by an R-axis motor 44 (see FIG. 3).

<Support part>
As shown in FIG. 1, the support portion 5 is configured to support the head unit 4 so as to be movable in the transport direction (X1 direction) and in the direction (X2 direction) opposite to the transport direction. Specifically, the support portion 5 includes a ball screw shaft 5a extending in the transport direction and an X-axis motor 5b that rotates the ball screw shaft 5a. The head unit 4 is provided with a ball nut (not shown) engaged with the ball screw shaft 5 a of the support portion 5. The head unit 4 is configured to be movable in the transport direction along the support portion 5 together with a ball nut engaged with the ball screw shaft 5a by rotating the ball screw shaft 5a by the X-axis motor 5b.

<Rail section>
The pair of rail portions 6 is configured to support the support portion 5 so as to be movable in the Y direction. Specifically, the rail portion 6 includes a ball screw shaft 6a extending in the Y direction and a Y-axis motor 6b that rotates the ball screw shaft 6a. The support portion 5 is provided with a ball nut (not shown) engaged with the ball screw shaft 6 a of the rail portion 6. The support portion 5 is configured to be movable in the Y direction along the pair of rail portions 6 together with the ball nut engaged with the ball screw shaft 6a by rotating the ball screw shaft 6a by the Y-axis motor 6b. There is.

  With such a configuration, the head unit 4 is configured to be movable on the base 2 in the horizontal plane (in the X direction and in the Y direction). That is, the head unit 4 is configured to be movable relative to the substrate B on the substrate transport unit 3. As a result, the head unit 4 can move above the fixed substrate B at the mounting position, and apply the flux F supplied from the dispense head 41 to a predetermined location (coating position N) on the substrate B. It is.

<Parts imaging unit>
The component imaging unit 7 is a camera for component recognition that captures an image of the electronic component E held (sucked) by the mounting head 42 prior to the mounting of the electronic component E on the substrate B, as shown in FIG. The component imaging unit 7 is fixed on the base 2 and configured to image the electronic component E held (sucked) by the mounting head 42 from below (in the Z2 direction) the electronic component E. The control unit 9 is configured to acquire (recognize) the suctioned state (rotational attitude and suction position with respect to the mounting head 42) of the electronic component E based on a captured image of the electronic component E by the component imaging unit 7.

<Board imaging unit>
The substrate imaging unit 8 is attached to the head unit 4 and prior to mounting of the electronic component E on the substrate B, an FI mark (Fiducial Mark) attached to the upper surface of the substrate B (not shown) Mark recognition camera for imaging the The FI mark is a mark for confirming the position of the substrate B. Also, the substrate imaging unit 8 is a camera for liquid material inspection that images the flux F applied on the substrate B. Here, the substrate imaging unit 8 captures a two-dimensional image of the flux F applied on the substrate B.

<Control unit>
As shown in FIG. 3, the control unit 9 is a control circuit that includes a CPU 91 (Central Processing Unit), a memory 92, and the like, and controls the operation of the component mounting apparatus 1. The control unit 9 is electrically connected to the substrate conveyance unit 3, the head unit 4, the support unit 5, the rail unit 6, the component imaging unit 7, the substrate imaging unit 8, the tape feeder 11, the X axis motor 5 b and the Y axis motor 6 b It is done.

  The memory 92 stores an inspection program CP based on an inspection process which is a process for inspecting the area of the flux F applied on the substrate B. Furthermore, in the memory 92, a setting value S necessary to execute the inspection process is stored. The control unit 9 controls the head unit 4, the support unit 5, the rail unit 6, the substrate imaging unit 8, the X-axis motor 5b, and the Y-axis motor 6b according to the inspection program CP to apply the flux coated on the substrate B. It is configured to perform an inspection of F.

(Inspection processing)
In the component mounting apparatus 1, the control unit 9 recognizes the application area on the basis of the two-dimensional (plan view) image of the flux F captured by the substrate imaging unit 8. The control unit 9 acquires the application area of the flux F based on the total number of pixels corresponding to the flux F in the two-dimensional image. In the component mounting apparatus 1, if the inspection of the application area of the flux F on the substrate B is good, the substrate B proceeds to the next operation process, and if it is defective, the substrate B is removed.

  Here, it is assumed that after the flux F is continuously applied by the dispense head 41 to all the locations on the substrate B where the application conditions of the flux F are the same, the application area of all the continuously applied flux F is inspected. In this case, if a large number of portions having the same application condition of the flux F are provided on the substrate B, the timing at which it is determined that a defect occurs even if a defect in the application of the flux F by the dispense head 41 occurs halfway. It will be delayed and loss will occur in the flux F and time.

  Further, as shown in FIG. 4 to FIG. 9, depending on the type of paste-like liquid material such as flux F, the application shape changes with the passage of time after application by the dispense head 41, and the application area as viewed from above There is something that changes. The state of the flux F applied on the substrate B first by the dispense head 41 is shown in FIG. 4A, and the application area as viewed from above the flux F is shown in FIG. 4B. Then, as shown in FIG. 5 to FIG. 9, when the flux F is applied to a plurality of predetermined places on the substrate B, the application area of the flux F applied on the substrate B in plan view with the passage of time is It will change. Here, the change in the application area in plan view of the flux F on the substrate B within a predetermined time shown in FIGS. 5 and 6 is minute. However, the application area as viewed from above the flux F on the substrate B shown in FIGS. 7 to 9 is rapidly increased. For this reason, in the inspection of the flux F on the substrate B, the normal application is judged as defective or the abnormal application is judged as good by the difference in the elapsed time from the application of the flux F to the substrate B to the inspection. The case will occur.

  Therefore, the control unit 9 according to the first embodiment performs the inspection program CP to inspect the flux F using the substrate imaging unit 8 at a timing based on the temporal change of the shape of the flux F applied to the substrate B. Is configured to be performed. Here, the control unit 9 is configured to perform the inspection by the substrate imaging unit 8 after applying the flux F a plurality of times by the dispense head 41. Further, the control unit 9 controls the flux on the substrate B by the substrate imaging unit 8 in the order in which the flux F applied on the substrate B is applied earliest among the untested fluxes F applied to the substrate B. It is configured to perform an inspection of F.

  That is, in the component mounting apparatus 1, the inspection of the area of the flux F in plan view is automatically performed at the timing based on the number of the electronic components E. That is, the control unit 9 controls the flux on the substrate B by the substrate imaging unit 8 based on the application of the flux F by the dispensing head 41 to the location corresponding to the predetermined number of electronic components PE by the inspection program CP. The inspection of F is configured to be performed. Here, the number of the predetermined number of electronic components PE is set by the user and stored in the memory 92. The number of the predetermined number of electronic components PE is a user based on the time taken from application of the flux F to inspection at the predetermined application position N and the time until the applied flux F is determined to be defective. Set by

  The inspection process performed by the control unit 9 in the component mounting apparatus 1 will be described with reference to FIG.

  First, steps S1 to S5 are steps for the control unit 9 to obtain the inspection start position M of the flux F on the substrate B by the substrate imaging unit 8.

  As shown in FIG. 10, in step S1, the control unit 9 acquires a predetermined number of electronic components PE which are set values S stored in the memory 92. In step S2, the control unit 9 acquires the first application position N of the flux F on the substrate B as the application position N = 1. In step S 3, the control unit 9 starts application of the flux F to the application position N by the dispense head 41. In step S4, the controller 9 ends the application of the flux F to the application position N. In step S5, the control unit 9 sets the inspection start position M = the application position N.

  Next, steps S6 to S11 and step S16 are steps for the controller 9 to apply the flux F to the application position N corresponding to the predetermined number of electronic components PE by the dispense head 41.

  In step S6, the control unit 9 determines whether the application position N is the last application position N on the substrate B or not. If the application position N is the last application position N on the substrate B (if the application position N is one), the process proceeds to step S12. If the application position N is not the last application position N on the substrate B, the process proceeds to step S7. In step S7, the control unit 9 sets the application position N = N + 1. In step S8, the control unit 9 starts application of the flux F to the application position N by the dispense head 41. In step S9, the control unit 9 ends the application of the flux F to the application position N by the dispense head 41.

  In step S10, based on the application position N, the control unit 9 obtains the number of electronic components E for which application of the flux F has been completed. In step S11, the control unit 9 determines whether the number of electronic components E for which the application of the flux F has been completed is larger than a predetermined number of electronic components PE. If the number of electronic components E is equal to or less than the predetermined number of electronic components PE, the process proceeds to step S16, and application of the flux F is repeated until the number of electronic components E exceeds the predetermined number of electronic components PE. If the number of electronic components E is larger than the predetermined number of electronic components PE, the process proceeds to step S12.

  In step S16, the control unit 9 determines whether the application position N is the last application position N on the substrate B or not. If the application position N is the last application position N on the substrate B, the process proceeds to step S12. If the application position N is not the last application position N on the substrate B, the process returns to step S7.

  Next, in steps S12 to S15 and step S17, the control unit 9 causes the substrate imaging unit 8 to inspect the flux F applied to a plurality of application positions N corresponding to a predetermined number of electronic components PE. It is.

  In step S12, the control unit 9 sets the inspection position C to the inspection start position M. In step S13, the control unit 9 determines whether the inspection position C is less than or equal to the application position N. If the inspection position C exceeds the application position N, it is determined that the inspection of the flux F applied to the plurality of application positions N corresponding to the predetermined number of electronic components PE is completed, and the process proceeds to step S17. If the inspection position C is less than or equal to the application position N, the process proceeds to step S14.

  In step S17, the control unit 9 determines whether the application position N is the last application position N on the substrate B or not. When the application position N is the last application position N on the substrate B, the inspection process is ended. If the application position N is not the last application position N on the substrate B, the process returns to step S7.

  In step S14, the control unit 9 inspects the area of the flux F at the inspection position C by the dispense head 41. Thereby, the quality of the application shape of the flux F at the inspection position C is determined. If the application shape of the flux F at the inspection position C is defective, the inspection processing is interrupted and the operator takes out the substrate B. In step S15, the control unit 9 sets the inspection position C = C + 1, and returns to step S13.

  Next, the inspection process described above will be schematically described with reference to FIGS. 11 (A) to 11 (C) and FIGS. 12 (A) to 12 (C). In FIGS. 11A to 11C and FIGS. 12A to 12C, the flux F before the inspection is outlined and the flux F after the inspection is shaded. Further, it is assumed that there are two application positions N for each electronic component E.

  First, as shown in FIG. 11A, the controller 9 applies the flux F to the coating 1 at the coating position N by the dispense head 41. At this time, the control unit 9 sets the application 1 to the inspection start position M. As shown in FIG. 11B, the controller 9 applies the flux F to the application 2 to the application 4 at the application position N corresponding to a predetermined number of electronic components PE (for example, 2 components) by the dispense head 41 Do. Then, as shown in FIG. 11C, the control unit 9 inspects the area of the flux F from the application 1 to the application 4 sequentially by the substrate imaging unit 8.

  Next, as shown in FIG. 12A, the controller 9 applies the flux F to the coating 5 at the coating position N by the dispense head 41. At this time, the control unit 9 sets the application 5 to the inspection start position M. The controller 9 applies the flux F to the application 5 to the application 8 at the application position N corresponding to the predetermined number of electronic components PE (for example, 2 components) by the dispense head 41 as shown in FIG. Do. Then, as shown in FIG. 12C, the control unit 9 inspects the area of the flux F from the application 5 to the application 8 sequentially by the substrate imaging unit 8.

(Effect of the first embodiment)
In the first embodiment, the following effects can be obtained.

  In the first embodiment, as described above, the control unit 9 is configured to perform the inspection by the substrate imaging unit 8 at the timing based on the change with the elapse of time of the application shape of the flux F. As a result, even when the number of times of application performed continuously is large, it is possible to appropriately inspect the application shape before significant change occurs in the application shape. As a result, it is possible to suppress an erroneous determination caused by a change in the application shape of the flux F.

  Further, in the first embodiment, as described above, the control unit 9 performs the timing based on the change with time of the application shape of the flux F after applying the flux F to the substrate B multiple times by the dispense head 41. The substrate imaging unit 8 is configured to perform an inspection. As a result, since the inspection by the substrate imaging unit 8 is performed after applying the flux F to the substrate B a plurality of times by the dispense head 41, the inspection by the substrate imaging unit 8 is more efficient than the case where the inspection is performed for each application. Can be done. As a result, the inspection by the substrate imaging unit 8 can be efficiently performed while suppressing the erroneous determination caused by the change in the application shape of the flux F.

  Further, in the first embodiment, as described above, the control unit 9 sequentially applies the flux F applied to the substrate B at the earliest time among the untested flux F applied to the substrate B. The substrate imaging unit 8 is configured to inspect the flux F on the substrate B. As a result, since the inspection can be performed in order from the flux F in which the application shape of the flux F is most changed, it is possible to more reliably suppress the erroneous determination of the inspection by the substrate imaging unit 8.

  In the first embodiment, as described above, the control unit 9 performs the substrate imaging unit 8 based on the application of the flux F by the dispensing head 41 to the location corresponding to the predetermined number of electronic components PE. It is comprised so that the inspection of the flux F on the board | substrate B by may be performed. Thus, the timing at which the inspection of the flux F is performed is set based on the predetermined number of electronic components PE, so that the specification of the electronic component E is made within the timing based on the change with time of the application shape of the flux F. It is possible to set the timing for performing the inspection of the flux F appropriately.

  In the first embodiment, as described above, the control unit 9 performs the substrate imaging unit 8 based on the application of the flux F by the dispensing head 41 to the location corresponding to the predetermined number of electronic components PE. It is comprised so that the inspection of the flux F on the board | substrate B by may be performed. As a result, even when a defect in the application of the flux F occurs halfway through the application of the flux F onto the substrate B, it is possible to quickly detect a defect in the application of the flux F. As a result, it is possible to suppress the loss of the flux F and the loss of time until finding a defect in the application.

  In the first embodiment, as described above, the control unit 9 uses the substrate imaging unit 8 for the flux F at the timing based on the change with time of the application shape of the flux F applied to the substrate B. It is configured to perform an inspection. Thus, the inspection by the substrate imaging unit 8 is performed not every time the flux F is applied to the substrate B, but at a timing based on the change with time of the application shape of the flux F, so that the increase of the working time can be suppressed. It is possible. In addition, even if a defect in the application of the flux F occurs halfway, the inspection of the flux F can be performed quickly, so it is possible to suppress the loss of the flux F and time due to the delay of the inspection timing. .

Second Embodiment
Next, the configuration of the component mounting apparatus 201 according to the second embodiment of the present invention will be described with reference to FIGS. 1, 3 and 13 to 15. In the second embodiment, unlike the first embodiment, the control unit 209 applies the substrate when the number of times K of application of the flux F onto the substrate B by the dispense head 41 is larger than the predetermined number of times of application PN. An example configured to inspect the shape of the flux F on B will be described. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

(Inspection processing)
The control unit 209 according to the second embodiment executes the inspection program CP so that the flux on the substrate B by the substrate imaging unit 8 is applied based on the fact that the application of the flux F by the dispense head 41 is performed a predetermined number of times PN. It is configured to perform an inspection of F. Here, the predetermined application number PN is set by the user and stored in the memory 92. The predetermined number of times of application PN is set by the user based on the time taken from application of the flux F to inspection at the predetermined application position N and the time until the applied flux F is determined to be defective. . The predetermined number of times of application PN is an example of the “predetermined number of times” in the claims. Further, the other configuration of the second embodiment is the same as the configuration of the first embodiment.

  Next, with reference to FIG. 13, an inspection process performed by the control unit 209 in the component mounting apparatus 201 of the second embodiment will be described.

  First, steps S21 to S26 are steps for the control unit 209 to obtain the inspection start position M of the flux F on the substrate B by the substrate imaging unit 8.

  As shown in FIG. 13, in step S21, the control unit 209 acquires a predetermined number of times of application PN, which is the setting value S stored in the memory 92, and proceeds to step S22. Here, since each of step S22 to step S25 corresponds to each of step S2 to step S5 of the inspection process of the first embodiment, the description will be omitted. In step S26, the control unit 209 sets the number of times of application K = K + 1, and then the process proceeds to step S27.

  Next, step S27 to step S32 and step S37 are steps for the controller 209 to apply the flux F to the application position N corresponding to the predetermined application number PN by the dispense head 41.

  Here, since each of step S27 to step S30 corresponds to each of step S6 to step S9 of the inspection process of the first embodiment, the description will be omitted. After step S <b> 30, in step S <b> 31, the control unit 209 sets the number of times of application K = K + 1. In step S32, the control unit 209 determines whether the number of times of application K is larger than the predetermined number of times of application PN. If the number of times of application K is smaller than the predetermined number of times of application PN, the process proceeds to step S37. When the number of times of application K is larger than the predetermined number of times of application PN, the process proceeds to step S33. Here, since step S37 corresponds to step S16 of the inspection process of the first embodiment, the description will be omitted.

  Next, step S33 to step S36 and step S38 are steps for the control unit 209 to inspect the flux F applied to the plurality of application positions N corresponding to the predetermined number of application times PN by the substrate imaging unit 8 .

  Here, since each of step S33 to step S36 corresponds to each of step S12 to step S15 of the inspection process of the first embodiment, the description will be omitted. Moreover, since step S38 respond | corresponds to step S17 of the test | inspection process of 1st Embodiment, description is abbreviate | omitted.

  Next, the inspection process described above will be schematically described with reference to FIGS. 14 (A) to 14 (C) and FIGS. 15 (A) to 15 (C). In FIGS. 14A to 14C and FIGS. 15A to 15C, the flux F before the inspection is outlined and the flux F after the inspection is shaded.

  First, as shown in FIG. 14A, the control unit 209 applies the flux F to the coating 1 at the coating position N by the dispense head 41. At this time, the control unit 209 sets the application 1 to the inspection start position M. As shown in FIG. 14B, the control unit 209 applies the flux F to the application 2 to the application 4 at the application position N by the dispense head 41 corresponding to the predetermined number of times of application PN (for example, 4 times). Do. Then, as shown in FIG. 14C, the control unit 209 inspects the area of the flux F from application 1 to application 4 sequentially by the substrate imaging unit 8.

  Next, as shown in FIG. 15A, the control unit 209 applies the flux F to the coating 5 at the coating position N by the dispense head 41. At this time, the control unit 209 sets the application 5 to the inspection start position M. As shown in FIG. 15B, the control unit 209 applies the flux F to the application 5 to the application 8 at the application position N by the dispense head 41 corresponding to the predetermined number of times of application PN (for example, 4 times). Do. Then, as illustrated in FIG. 15C, the control unit 209 inspects the shape of the flux F from the application 5 to the application 8 sequentially by the substrate imaging unit 8.

(Effect of the second embodiment)
In the second embodiment, as described above, the control unit 209 inspects the flux F on the substrate B by the substrate imaging unit 8 based on the fact that the application of the flux F by the dispensing head 41 has been performed a predetermined number of times PN. Is configured to do. Thus, the timing at which the inspection of the flux F is performed is set based on the number of times of application of the flux F onto the substrate B, so that the substrate B is within the timing based on the change with time of the application shape of the flux F. The timing at which the inspection of the flux F is appropriately performed can be set in accordance with the arrangement of the portion to which the upper flux F is applied. The remaining effects of the second embodiment are similar to those of the first embodiment.

Third Embodiment
Next, the configuration of a component mounting apparatus 301 according to a third embodiment of the present invention will be described with reference to FIGS. 1, 3 and 16 to 18. In the third embodiment, unlike the first embodiment, when the operation time by the dispensing head 41 is longer than the designated time PT designated by the user, the control unit 309 sets the flux F on the coated substrate B. An example configured to perform shape inspection will be described. In the third embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted. The remaining structure of the third embodiment is similar to that of the first embodiment.

(Inspection processing)
The control unit 309 according to the third embodiment executes the inspection program CP so that the operation time for applying the flux F by the dispense head 41 is longer than the designated time PT. An inspection of the flux F on the substrate B is performed. Here, the designated time PT is set by the user and stored in the memory 92. The designated time PT is set by the user based on the time taken from application of the flux F to inspection at a predetermined application position N and the time until the applied flux F is determined to be defective.

  The inspection processing performed by the control unit 309 in the component mounting device 301 of the third embodiment will be described with reference to FIG.

  First, steps S41 to S46 are steps for the control unit 309 to obtain the inspection start position M of the flux F on the substrate B by the substrate imaging unit 8.

  As shown in FIG. 16, in step S41, the control unit 309 acquires a designated time PT which is the set value S stored in the memory 92, and proceeds to step S42. Here, since each of step S42-step S45 respond | corresponds to each of step S2-step S5 of the test | inspection process of 1st Embodiment, description is abbreviate | omitted. Thereafter, in step S46, the control unit 309 acquires the application end time of the flux F as the start time, and proceeds to step S47.

  Next, steps S47 to S52 and step S57 are steps for the controller 309 to apply the flux F to the plurality of application positions N by the dispense head 41 for the designated time PT.

  Here, since each of step S47-step S50 respond | corresponds to each of step S6-step S9 of the test | inspection process of 1st Embodiment, description is abbreviate | omitted. After step S <b> 50, in step S <b> 51, the control unit 309 acquires the working time based on the working time = current time−starting time. In step S52, the control unit 309 determines whether the working time is longer than the designated time PT. If the working time is equal to or less than the designated time PT, the process proceeds to step S57. If the working time is longer than the designated time PT, the process proceeds to step S53. Here, since step S57 corresponds to step S16 of the inspection process of the first embodiment, the description will be omitted.

  Next, in steps S53 to S56, the control unit 309 causes the substrate imaging unit 8 to inspect the flux F at the plurality of application positions N to which the flux F has been applied by the dispense head 41 for the designated time PT. It is a step.

  Here, since each of step S53 to step S56 corresponds to each of step S12 to step S15 of the inspection process of the first embodiment, the description will be omitted. Further, step S58 corresponds to step S17 of the inspection process of the first embodiment, and thus the description thereof is omitted.

  Next, the inspection process described above will be schematically described with reference to FIGS. 17A to 17C and FIGS. 18A to 18C. In FIG. 17A to FIG. 17C and FIG. 18A to FIG. 18C, the flux F before the inspection is outlined and the flux F after the inspection is shaded.

  First, as shown in FIG. 17A, the control unit 309 applies the flux F to the coating 1 at the coating position N with the dispense head 41. At this time, the control unit 309 sets the application 1 to the inspection start position M. As shown in FIG. 17B, the control unit 309 applies the flux F onto the substrate B by the dispense head 41 for a designated time PT (for example, about 10 seconds). At this time, the control unit 309 applies the flux F to the application 2 to the application 4 at the application position N. Then, as shown in FIG. 17C, the control unit 309 inspects the area of the flux F from the application 1 to the application 4 sequentially by the substrate imaging unit 8.

  Next, as shown in FIG. 18A, the control unit 309 applies the flux F to the coating 5 at the coating position N by the dispense head 41. At this time, the control unit 309 sets the application 5 to the inspection start position M. As shown in FIG. 18B, the control unit 309 applies the flux F onto the substrate B by the dispense head 41 for a designated time PT (for example, about 10 seconds). At this time, the control unit 309 applies the flux F to the application 5 to the application 8 which is the application position N. Then, as shown in FIG. 18C, the control unit 309 inspects the area of the flux F from the application 5 to the application 8 sequentially by the substrate imaging unit 8.

(Effect of the third embodiment)
In the third embodiment, as described above, the control unit 309 controls the application of the flux F by the dispense head 41 for the designated time PT, based on the fact that the flux of the flux F on the substrate B by the substrate imaging unit 8 is It is configured to perform an inspection. Thus, the timing at which the inspection of the flux F is performed is set based on the designated time PT set by the user, so the inspection of the flux F is performed within the timing based on the change with time of the application shape of the flux F. It is possible to set the timing to perform appropriately. The remaining effects of the third embodiment are similar to those of the first embodiment.

Fourth Embodiment
Next, the configuration of a component mounting apparatus 401 according to a fourth embodiment of the present invention will be described with reference to FIGS. 1, 3 and 19 to 20. In the fourth embodiment, unlike the first embodiment, the control unit 409 determines that the inspection result of the flux F by the substrate imaging unit 8 is defective due to the temporal change of the shape of the flux F applied to the substrate B. An example configured to inspect the flux F on the substrate B at a timing based on the allowable time T4 will be described. In the fourth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted. The remaining structure of the fourth embodiment is similar to that of the first embodiment.

  Specifically, in the component mounting apparatus 401, when the time obtained by adding the accumulated movement time T1, the return time T2, and the total inspection time TC by the control unit 409 is longer than the allowable time T4, the board imaging unit It is comprised so that the test | inspection of the untested flux F on the board | substrate B by 8 may be performed. Here, the cumulative transfer time T1 is the transfer time between each application position N from the application position N of the flux F applied earliest to the application position N to which the flux F is applied next among the untested flux F It is the accumulated time. The return time T2 is the time taken to move from the application position N where the flux F is applied next to the application position N of the flux F applied earliest among the untested flux F. The total inspection time TC is a time obtained by adding the inspection imaging time T3 of the uninspected flux F on the substrate B by the substrate imaging unit 8, and when the uninspected flux F corresponds to the number of times of application K The total inspection time TC is the inspection imaging time T3 × the number of applications K.

(Inspection processing)
The control unit 409 of the fourth embodiment is configured to inspect the flux F on the substrate B by the substrate imaging unit 8 based on the allowable time T4 by executing the inspection program CP. Here, the allowable time T4 is set by the user and stored in the memory 92. The permissible time T4 is a time obtained in advance by a preliminary test. For example, after a plurality of fluxes F are applied on a test member (roll paper or the like) by the dispense head 41 for a permissible time T4, the substrate imaging unit 8 inspects the plurality of fluxes F on the test member. It is the time taken from the inspection of F to the flux F of which the inspection result is judged to be defective.

  The inspection process performed by the control unit 409 in the component mounting device 401 of the fourth embodiment will be described with reference to FIG.

  First, steps S61 to S66 are steps for the control unit 409 to obtain the inspection start position M of the flux F on the substrate B by the substrate imaging unit 8.

  As shown in FIG. 19, in step S61, the control unit 409 acquires an inspection imaging time T3 that is the setting value S stored in the memory 92. In step S62, the control unit 409 sets the first application position N of the flux F on the substrate B to the application position N = 1. In step S63, the control unit 409 acquires an allowable time T4, which is the set value S stored in the memory 92. In step S64, the control unit 409 sets the number of times of application K = 0. In step S65, the control unit 409 sets the total movement time T1 = 0. In step S66, the control unit 409 sets inspection position C = application position N.

  Next, steps S67 to S75 are steps for the controller 409 to apply the flux F to the plurality of application positions N by the dispense head 41 for the allowable time T4.

  In step S <b> 67, the control unit 409 starts application of the flux F to the application position N by the dispense head 41. In step S68, the control unit 409 ends the application of the flux F to the application position N. In step S69, the control unit 409 sets the number of times of application K = K + 1. In step S70, the control unit 409 determines whether the application position N is the last application position N on the substrate B or not. If the application position N is the last application position N on the substrate B, the process proceeds to step S76. If the application position N is not the last application position N on the substrate B, the process proceeds to step S71.

  In step S71, the control unit 409 adds the moving time from the coating position N to the coating position N + 1 to the cumulative moving time T1, and sets the cumulative moving time T1. In step S72, the control unit 409 acquires a return time T2 from the application position N + 1 to the inspection position C. In step S73, the application position N is set to N = N + 1. In step S74, the control unit 409 determines whether T1 + T2 + T3 × K> T4. That is, the control unit 409 determines whether the time obtained by adding the total movement time T1, the return time T2, and the inspection imaging time T3 × the number of times of application K (total inspection time TC) is greater than the allowable time T4. Do. If the added time is larger than the allowable time T4, the process proceeds to step S76. When the added time is equal to or less than the allowable time T4, the process proceeds to step S75. In step S75, the control unit 409 moves the dispense head 41 to the application position N, and returns to step S67.

  Next, in steps S76 to S80, the control unit 409 causes the substrate imaging unit 8 to inspect the flux F at the plurality of application positions N to which the flux F has been applied by the dispense head 41 for the allowable time T4. It is a step.

  In step S76, the control unit 409 moves the substrate imaging unit 8 to the inspection position C. In step S77, the control unit 409 causes the substrate imaging unit 8 to perform an inspection at the inspection position C. In step 78, the control unit 409 determines whether the inspection position C is the last inspection position on the substrate B. If the inspection position C is the last inspection position on the substrate B, the inspection process is ended. If the inspection position C is not the last inspection position on the substrate B, the process proceeds to step S79. In step S79, the control unit 409 determines whether the inspection position C + 1 is the same as the application position N. If the inspection position C is the same as the application position N, the process returns to step S64. If the inspection position C is different from the application position N, the process proceeds to step S80. In step S80, the control unit 409 sets the inspection position C = C + 1, and returns to step S76.

  Next, the inspection process described above will be schematically described with reference to FIGS. 20 (A) and 20 (B). In FIG. 20 (A) and FIG. 20 (B), the flux F before the inspection is outlined and the flux F after the inspection is shaded.

  First, as shown in FIG. 20A, the control unit 409 applies the flux F to the application 1 to application 3 at the application position N by the dispense head 41. In the control unit 409, the application 1 is set at the inspection position C. The control unit 409 acquires a total movement time T1 obtained by adding the movement time from application 1 to application 2, the movement time from application 2 to application 3, and the movement time from application 3 to application 4. The control unit 409 acquires a return time T2 from application 4 to return to application 1. The control unit 409 obtains the total inspection time TC by multiplying the number of times of application K (for example, three times) based on the application 1, the application 2 and the application 3 by the inspection imaging time T3. Then, the control unit 409 compares the allowable time T4 (for example, about 30 seconds) with the total movement time T1, the return time T2 and the total inspection time TC. When the added time is longer than the allowable time T4, as shown in FIG. 20B, the area of the flux F is inspected from the application 1 to the application 3 sequentially by the substrate imaging unit 8.

(Effect of the fourth embodiment)
In the fourth embodiment, as described above, the inspection by the substrate imaging unit 8 is the inspection of the flux F by the substrate imaging unit 8 due to the change with time of the application shape of the flux F applied to the substrate B It is configured to be performed at a timing based on an allowable time T4 until the result is judged to be bad. As a result, since the inspection of the flux F on the substrate B by the substrate imaging unit 8 is performed within the allowable time T4, an erroneous determination of the inspection by the substrate imaging unit 8 can be reliably suppressed.

  In the fourth embodiment, as described above, the control unit 409 determines that the sum of the total movement time T1, the return time T2, and the total inspection time TC is longer than the allowable time T4. The inspection of the flux F on the substrate B by the substrate imaging unit 8 is performed. Thus, the timing of the inspection of the flux F on the substrate B by the substrate imaging unit 8 is set based on the total movement time T1, the return time T2 and the total inspection time TC, so that the flux on the substrate B by the substrate imaging unit 8 The timing of the inspection of F can be set more reliably to the timing based on the change over time of the application shape of the flux F. In addition, among the movement times of the substrate imaging unit 8 changing depending on the application position N and the inspection position C, the increase of the working time is suppressed compared to the case where the inspection timing of the flux F is uniformly determined based on the longest movement time. It is possible. The remaining effects of the fourth embodiment are similar to those of the first embodiment.

(Modification)
It should be understood that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is indicated not by the description of the embodiments described above but by the claims, and further includes all modifications (modifications) within the meaning and scope equivalent to the claims.

  For example, although the example which does not consider about the change of application | coating conditions was shown in said 1st-4th embodiment, this invention is not limited to this. In the present invention, changes in application conditions may be considered. Specifically, as in the first modified example shown in FIG. 21, the control unit 509 causes the substrate imaging unit 8 to change the application condition of the flux F to the substrate B by the dispense head 41. It is configured to have a function (step S100) for inspecting the flux F on the substrate B. Here, changing the application condition of the flux F to the substrate B by the dispense head 41 means changing the application time of the flux F to the substrate B (for example, about 0.3 seconds to about 0.2 seconds). To change the size (diameter) of the flux F on the substrate B. The remaining structure of the first modification is similar to that of the fourth embodiment.

  In the first modification, as described above, the control unit 509 causes the flux F on the substrate B by the substrate imaging unit 8 to be changed based on the change in the conditions for applying the flux F to the substrate B by the dispense head 41. It is configured to perform an examination of Thereby, even when the application condition of the flux F on the substrate B by the dispense head 41 is changed, the inspection of the flux F on the substrate B by the substrate imaging unit 8 is performed, so the substrate B by the substrate imaging unit 8 It can suppress that the time interval of the inspection of the above-mentioned flux F becomes large too much. The remaining effects of the first modification are similar to those of the fourth embodiment.

  In the first modification, changing the application condition of the flux F to the substrate B by the dispense head 41 indicates changing the application time of the flux F to the substrate B. The invention is not limited to this. In the present invention, the change of the condition of the application of the flux to the substrate by the dispense head may be the change of the diameter of the discharge port by the replacement of the nozzle of the dispense head.

  In the first to fourth embodiments and the first modification, the example in which the "substrate work apparatus" in the claims is the component mounting apparatus 1 (201, 301, 401) has been described. It is not restricted to this. In the present invention, the substrate operation device may be a substrate inspection device or a liquid material application device.

  In the first to fourth embodiments and the first modification, the example in which the liquid material is the flux F is shown, but the present invention is not limited to this. In the present invention, the liquid material may be an adhesive having viscosity other than flux.

  In the first to fourth embodiments and the first modification, the memory 92 stores an inspection program CP based on an inspection process which is a process for inspecting the area of the flux F applied on the substrate B. An example is shown, but the present invention is not limited to this. In the present invention, the memory may store an inspection program based on an inspection process, which is a process for inspecting the shape of the flux applied on the substrate. Here, the inspection of the shape of the flux applied on the substrate is, for example, an inspection based on the roundness of the flux imaged by the substrate imaging unit.

  In the first modification, the application of the flux F to the substrate B is changed by changing the application time of the flux F to the substrate B from about 0.3 seconds to about 0.2 seconds. Although an example is shown, the present invention is not limited to this. In the present invention, the change of the application time of the flux to the substrate is not limited to about 0.3 seconds to about 0.2 seconds, and may be another value.

  Moreover, in the said 1st Embodiment, although the electronic component PE of predetermined number showed the example which is two components, this invention is not limited to this. In the present invention, the predetermined number of electronic components may be three or more.

  Further, although the example in which the predetermined number of times of application PN is four is shown in the second embodiment, the present invention is not limited to this. In the present invention, the predetermined number of times of application may be 1 to 3 times, or 5 times or more.

  In the third embodiment, the designated time PT is about 10 seconds. However, the present invention is not limited to this. In the present invention, the designated time may be less than 10 seconds or more than 10 seconds.

  In the fourth embodiment, the allowable time T4 is about 30 seconds. However, the present invention is not limited to this. In the present invention, the tolerance time may be less than about 30 seconds, or more than about 30 seconds.

  Moreover, in the said 1st-4th embodiment, although the head unit 4 has shown the example which has the two dispense head 41, this invention is not limited to this. The head unit may have one dispense head or may have three or more dispense heads.

  In the first to fourth embodiments and the first modification, for convenience of explanation, the flow drive for performing the control processing of the control unit 9 (209, 309, 409, 509) in order along the processing flow Although the example described using the flowchart of the type is shown, the present invention is not limited to this. In the present invention, control processing of the control unit may be performed by event-driven (event-driven) processing that executes processing on an event-by-event basis. In this case, the operation may be completely event driven, or the combination of event driving and flow driving may be performed.

  In the fourth embodiment, it is determined whether or not the time in which the control unit 409 adds the total movement time T1, the return time T2, and the inspection imaging time T3 × the number of times of application K is larger than the allowable time T4. Although the example which is judged is shown, the present invention is not limited to this. In the present invention, the control unit may determine whether or not the time obtained by adding the total movement time, the return time, and the inspection imaging time × the number of times of application is the time immediately before the allowable time passes.

1, 201, 301, 401 Component mounting apparatus (substrate work apparatus)
8 Substrate imaging unit (inspection unit)
9, 209, 309, 409, 509 Control part 41 Dispensing head B substrate F flux (liquid material)
K number of times of application N application position PE predetermined number of parts PN predetermined number of times of application (predetermined number of times)
T1 accumulated movement time T2 return time T3 examination imaging time (examination time)
T4 Allowable time TC Total inspection time

Claims (8)

A dispense head for applying to a substrate a liquid material whose application shape changes as time passes after application;
And an inspection unit for inspecting at least one of the area or the shape of the liquid material applied on the substrate in a plan view,
The board | substrate operation | work apparatus comprised so that the test using the said test | inspection part with respect to the said liquid material may be performed at the timing based on the change over time of the said application | coating shape of the said liquid material apply | coated to the said board | substrate.   In the inspection of the liquid material on the substrate by the inspection unit, the inspection result of the liquid material by the inspection unit is due to a change with time of the application shape of the liquid material applied to the substrate. The substrate working apparatus according to claim 1, which is configured to be performed at a timing based on an allowable time until it is determined to be defective.   The inspection of the liquid material on the substrate by the inspection unit is performed at a timing based on a change with time of the application shape of the liquid material after the liquid material is applied to the substrate a plurality of times by the dispense head. The substrate working apparatus according to claim 1 or 2, which is configured to be operated.   The inspection of the liquid material on the substrate by the inspection unit is performed in the order of application from the liquid material applied to the substrate at the earliest stage among the liquid materials applied to the substrate but not inspected. The substrate processing apparatus according to claim 3, wherein the substrate processing apparatus is configured to perform.   The inspection of the liquid material on the substrate by the inspection unit is configured to be performed based on the application of the liquid material by the dispense head to a location corresponding to a predetermined number of parts. The board | substrate working apparatus of any one of Claims 1-4.   The inspection of the liquid material on the substrate by the inspection unit is configured to be performed based on the fact that the application of the liquid material by the dispensing head is performed a predetermined number of times. The board | substrate working apparatus of any one of-.   In the inspection of the liquid material on the substrate by the inspection unit, each application from the application position of the liquid material applied at the earliest stage among the uninspected liquid materials to the application position where the liquid material is applied next In order to move from the application position where the liquid material is applied next to the application position where the liquid material is applied to the earliest one of the untested liquid materials to the application position where the liquid material is applied, The time obtained by adding this return time and the total inspection time obtained by adding the inspection time of the uninspected liquid material on the substrate is greater than the allowable time or the time immediately before the allowable time elapses The substrate work apparatus according to claim 2, which is configured to be performed in the above case.   The inspection of the liquid material on the substrate by the inspection unit is configured to be performed based on a change in a condition of application of the liquid material to the substrate by the dispensing head. The board | substrate working apparatus as described in.

Images