JP7098642B2 - Coating device with repair function and component mounting system - Google Patents

Description

The present invention relates to a coating device with a repair function and a component mounting system, and more particularly to a coating device with a repair function and a component mounting system having a coating portion for applying a liquid material to a substrate.

Conventionally, as a coating device with a repair function provided with a coating portion for applying a liquid material to a substrate, for example, a cream solder (liquid material) on a land (predetermined location) of a substrate disclosed in Japanese Patent Application Laid-Open No. 8-204399. A mounting board production system (component mounting system) equipped with a cream solder printing machine for printing is known.

The mounting board production system in JP-A-8-20439 is configured to inspect the state of the cream solder printed on the land of the board by a machine and to confirm the inspection result of the machine inspection by the operator. ing. Then, when the solder inspection machine determines that the state of the cream solder on the substrate is defective based on the mechanical inspection and the inspection judgment, the solder inspection machine notifies the operator of the repair instruction for repairing the solder on the substrate. It is configured. Further, the solder inspection machine is configured to suspend (stop) the work on other boards until the work for the defect is manually performed by the operator based on the repair instruction.

Japanese Unexamined Patent Publication No. 8-204399

However, in the mounting board production system in JP-A-8-204399, when the repair instruction is notified by the solder inspection machine, the production is stopped until the operator manually performs the work for the defect, so that the repair is performed. Even when a substrate that requires the above is generated, there is a problem that the production efficiency is greatly reduced.

The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to prevent a large decrease in production efficiency even when a substrate requiring repair is generated. It is to provide a coating device with a repair function and a component mounting system.

In order to achieve the above object, the coating device with a repair function according to the first aspect of the present invention has a coating portion for applying the liquid material to the substrate and the amount of the liquid material applied or printed at a predetermined place on the substrate. When there is a shortage of the liquid material that is insufficient and the liquid material is not applied , the two-dimensional reference shape of the liquid material that is applied or printed at the specified location on the substrate and the predetermined location on the substrate Based on the amount of liquid material shortage and the liquid material shortage position obtained based on the comparison with the two-dimensional shape of the liquid material actually applied or printed in a plan view , the coating unit It is equipped with a control unit that controls the application of the liquid material to the insufficient portion of the liquid material on the substrate to repair it .

The coating device with a repair function according to the first aspect of the present invention applies the liquid material by the coating portion when the amount of the liquid material applied or printed on the predetermined portion on the substrate is insufficient as described above. It is equipped with a control unit that controls repairs. As a result, the repair is automatically performed without waiting for the operator to manually perform the work for the defect, so that the production can be continued without stopping the production. As a result, it is possible to prevent a large decrease in production efficiency when a substrate that requires repair is generated.

In the coating device with a repair function according to the first aspect, preferably, the control unit is the insufficient amount of the liquid material and the insufficient position of the liquid material obtained by the inspection of the liquid material applied or printed on the predetermined portion on the substrate. Based on the above, the coating unit is configured to apply and repair the liquid material. With this configuration, an amount based on the shortage amount of the liquid material can be applied to a predetermined place on the substrate for repair. Therefore, an appropriate amount of the liquid material is applied to the predetermined place on the substrate for repair. be able to.

In this case, preferably, the control unit is operated by the coating unit based on the insufficient position of the liquid material obtained by the inspection of the liquid material applied or printed on the predetermined portion on the substrate and the insufficient amount of the liquid material at the insufficient position. It is configured to control the repair of the shortage position at a predetermined position. With this configuration, an amount based on the shortage amount of the liquid material can be applied to the shortage position of the liquid material at a predetermined place on the substrate to repair it, so that it is appropriate at an appropriate position on the predetermined place on the substrate. An amount of liquid material can be applied. As a result, repair can be performed more appropriately.

In the coating device with a repair function according to the first aspect, preferably, in addition to the coating portion, an inspection unit for inspecting the shortage amount of the liquid material coated or printed on a predetermined place on the substrate and the shortage position of the liquid material is provided. Further, in addition to the coating unit, an inspection unit for inspecting the liquid material coated or printed on a predetermined place on the substrate is further provided, and the control unit inspects the liquid material by the inspection unit and the liquid material is inspected by the coating unit. It is configured to control the application and repair of the material. With this configuration, it is possible to inspect the liquid material applied to the predetermined location and repair the liquid material at the predetermined location in the same coating device, so that the repair by the coating portion at the predetermined location can be performed quickly. It can be carried out.

In the coating device with a repair function according to the first aspect, preferably, the coating unit includes a nozzle for discharging the liquid material, and the control unit is a shortage amount of the liquid material coated or printed on a predetermined place on the substrate. It is configured to control the clearance between the tip of the nozzle and the substrate according to the above. With this configuration, the nozzle tip and the substrate are not in contact with each other due to the clearance (gap) between the nozzle tip and the substrate. It is possible to suppress deformation of the shape of the liquid material. Further, since the clearance between the tip of the nozzle and the substrate is adjusted according to the insufficient amount of the liquid material, it is possible to more appropriately repair the predetermined portion on the substrate.

In the component mounting system according to the second aspect of the present invention, the liquid material is not applied due to insufficient amounts of the coating portion for applying the liquid material to the substrate and the liquid material applied or printed at a predetermined position on the substrate. When there is a shortage of the liquid material , the two-dimensional reference shape of the liquid material applied or printed in a predetermined place on the substrate and the liquid material actually applied or printed in the predetermined place on the substrate Based on the amount of liquid material shortage and the liquid material shortage position of the liquid material shortage part obtained based on the comparison with the two-dimensional shape in the plan view, the liquid material is applied by the coating part to the liquid material shortage on the substrate. A coating device with a repair function that includes a control unit that controls coating and repairing to a part , and a component mounting that is located downstream of the coating device with a repair function and mounts parts on a board carried out from the coating device with a repair function. Equipped with a device.

As described above, the component mounting system according to the second aspect of the present invention includes a coating device with a repair function including a control unit that controls the application and repair of the liquid material by the coating unit. As a result, the repair is automatically performed without waiting for the operator to manually perform the work for the defect, so that the production can be continued without stopping the production. As a result, even when a substrate that requires repair is generated, it is possible to suppress a significant decrease in production efficiency.

According to the present invention, as described above, even when a substrate requiring repair is generated, it is possible to suppress a significant decrease in production efficiency.

It is a schematic block diagram which showed the structure of the component mounting system by 1st Embodiment of this invention. It is a schematic plan view which showed the whole structure of the coating apparatus by 1st Embodiment of this invention. It is a schematic side view which showed the structure of the coating apparatus by 1st Embodiment of this invention. It is a schematic block diagram which showed the control structure of the coating apparatus by 1st, 2nd Embodiment and 1st modification of this invention. It is a partially enlarged view which showed the state which inspected the solder applied to the predetermined place on the substrate by the coating apparatus by 1st Embodiment of this invention. Partial enlargement showing a state in which the first shortage amount of the solder applied to a predetermined position on the substrate and the second shortage amount of the second shortage position are acquired by the coating device according to the first embodiment of the present invention. It is a figure. It is a partially enlarged view which showed the state which repaired the solder applied to the predetermined place on the substrate by the coating apparatus by 1st Embodiment of this invention. It is a flowchart which showed the substrate work process of the coating apparatus by 1st Embodiment of this invention. It is a schematic block diagram which showed the structure of the component mounting system by 2nd Embodiment of this invention. It is a schematic diagram which showed the state which inspected the solder applied to the predetermined place on the substrate by the coating apparatus by 2nd Embodiment of this invention. It is a schematic diagram which showed the state which acquired the 3rd shortage amount of the 3rd shortage position of the solder applied to the predetermined place on the substrate by the coating apparatus by 2nd Embodiment of this invention. FIG. 12A is a schematic view showing a state in which the clearance between the tip of the nozzle and the substrate is large. FIG. 12B is a schematic view showing a state in which the clearance between the tip of the nozzle and the substrate is small. It is a schematic diagram which showed the state which repaired the solder applied to the predetermined place on the substrate by the coating apparatus by 2nd Embodiment of this invention. It is a flowchart which showed the substrate work process of the coating apparatus by 2nd Embodiment of this invention. It is a schematic block diagram which showed the structure of the component mounting system by 1st modification of 1st Embodiment of this invention. It is a flowchart which showed the substrate work process of the coating apparatus by 1st modification of 1st Embodiment of this invention. It is a partially enlarged view which showed the state which repaired the solder applied to the predetermined place on the substrate by the coating apparatus by the 2nd modification of 1st Embodiment of this invention.

Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

(First Embodiment)
First, the component mounting system 1 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 8. As shown in FIG. 1, the component mounting system 1 of the first embodiment includes a printing device 1a, a coating device 1b, and a component mounting device 1c. In the component mounting system 1, the printing device 1a, the coating device 1b, and the component mounting device 1c are arranged in this order from the upstream. The coating device 1b is an example of a "coating device with a repair function" within the scope of the claims.

The printing apparatus 1a is configured to print the solder S (cream solder) (see FIG. 5) on the substrate B at a predetermined position RA on the substrate B by printing the solder S (cream solder) (see FIG. 5) based on a predetermined pattern. There is. Here, the predetermined location RA is a location on the substrate B where the solder S is printed. As described above, a general printing device is appropriately used for the printing device 1a. The solder S is an example of a "liquid material" within the scope of the claims.

The component mounting device 1c is configured to mount electronic components on the substrate B carried out from the coating device 1b. As described above, a general component mounting device is appropriately used for the component mounting device 1c. Here, the electronic component is a component such as an IC, a transistor, a capacitor, and a resistor. Hereinafter, the coating device 1b will be described.

(Applying device)
In the conventional component mounting system, the printing device 1a prints the solder S on the predetermined location RA, but the solder S may be insufficient in the predetermined location RA, such as fading of the solder S or omission of the solder S. be. In this case, since the electronic component cannot be mounted on the substrate B in the component mounting device 1c arranged downstream, the substrate B in which the amount of solder S is insufficient is reprinted, removed, and printed. Measures such as skipping the component mounting process are usually performed. Therefore, in the component mounting system, when the amount of solder S is insufficient on the board B, the work on the board B in the component mounting system is stopped.

Therefore, in the component mounting system 1 of the first embodiment, when the amount of solder S printed on the predetermined portion RA on the substrate B is insufficient by the control unit 8 of the coating device 1b, the solder is soldered by the dispense head 41. It is configured to control the repair by newly applying S. Here, the application of the solder S by the dispense head 41 is a broad concept including the mode of spreading the solder S on the substrate B, discharging the solder S onto the substrate B, and injecting the solder S onto the substrate B. .. The dispense head 41 is an example of the "applied portion" in the claims.

Specifically, as shown in FIG. 2, the coating device 1b includes a base 2, a substrate transport portion 3, a head unit 4, a support portion 5, a pair of rail portions 6, and a substrate imaging unit 7. , And a control unit 8. Here, the direction in which the substrate B is conveyed by the pair of conveyors is the X direction, and the direction perpendicular to the X direction in the horizontal direction is the Y direction. Further, the direction perpendicular to the X direction and the Y direction is defined as the Z direction (vertical direction). The substrate imaging unit 7 is an example of an “inspection unit” within the scope of the claims.

<Base>
The base 2 is a base on which each component is arranged in the coating device 1b. A substrate transport portion 3 and a rail portion 6 are provided on the base 2 as each component. Further, a control unit 8 is provided in the base 2.

<Board transfer board>
The substrate transport unit 3 is configured to carry in the substrate B from the outside of the coating device 1b and transport the substrate B in the transport direction (X1 direction). The board transfer unit 3 includes a pair of conveyor units 30 and a drive motor 32. Each of the pair of conveyor portions 30 has a pulley (not shown) and a ring-shaped conveyor belt 31 hung around the pulley. The control unit 8 is configured to control the transfer speed of the substrate B mounted on the transfer belt 31 by controlling the drive motor 32.

<Head unit>
As shown in FIG. 3, the head unit 4 is a head unit 4 for solder coating, and is configured to apply solder S to a substrate B fixed at a predetermined position. Specifically, the head unit 4 includes a dispense head 41. The dispense head 41 is connected to a syringe (not shown) filled with solder S, and the solder S supplied from the syringe can be applied onto the substrate B from the tip of the nozzle 41a (see FIG. 3). Has been done. The dispense head 41 is configured to be movable in the vertical direction by a Z-axis motor 42 (see FIG. 4).

<Support part>
As shown in FIG. 2, the support portion 5 is configured to movably support the head unit 4 in the transport direction (X1 direction) and in the direction opposite to the transport direction (X2 direction). Specifically, the support portion 5 includes a ball screw shaft 51 extending in the transport direction and an X-axis motor 52 for rotating the ball screw shaft 51. The head unit 4 is provided with a ball nut (not shown) that engages with the ball screw shaft 51 of the support portion 5. The head unit 4 is configured to be movable in the transport direction along the support portion 5 together with the ball nut that engages with the ball screw shaft 51 by rotating the ball screw shaft 51 by the X-axis motor 52.

<Rail part>
The pair of rail portions 6 are configured to support the support portions 5 so as to be movable in the Y direction. Specifically, the rail portion 6 includes a ball screw shaft 61 extending in the Y direction and a Y-axis motor 62 for rotating the ball screw shaft 61. The support portion 5 is provided with a ball nut (not shown) that engages with the ball screw shaft 61 of the rail portion 6. The support portion 5 is configured to be movable in the Y direction along the pair of rail portions 6 together with the ball nut that engages with the ball screw shaft 61 by rotating the ball screw shaft 61 by the Y-axis motor 62. There is.

With such a configuration, the head unit 4 is configured to be movable on the base 2 in a horizontal plane (in the X direction and the Y direction). That is, the head unit 4 is configured to be relatively movable with respect to the substrate B on the substrate transport unit 3. As a result, the head unit 4 can move above the substrate B fixed at a predetermined position, and the solder S supplied from the dispense head 41 can be applied onto the substrate B.

<Board image pickup unit>
As shown in FIG. 3, the substrate imaging unit 7 is attached to the head unit 4, and is attached to the upper surface of the substrate B prior to mounting electronic components on the substrate B. )) Is a camera for mark recognition that captures images. The FI mark is a mark for confirming the position of the substrate B. Further, the substrate imaging unit 7 is a camera for solder inspection that images the solder S printed on the predetermined portion RA on the substrate B. Here, the substrate imaging unit 7 captures a two-dimensional (planar view) image of the solder S printed on the substrate B.

<Control unit>
As shown in FIG. 4, the control unit 8 is a control circuit that includes a CPU 81 (Central Processing Unit), a memory 82, and the like, and controls the operation of the coating device 1b. The control unit 8 is electrically connected to a substrate transport unit 3, a head unit 4, a support unit 5, a rail unit 6, a substrate imaging unit 7, an X-axis motor 52, and a Y-axis motor 62.

The substrate 82 includes a work of applying and repairing the solder S by the dispense head 41 based on the shortage amount SQ of the solder S obtained by the inspection of the solder S printed on the predetermined portion RA on the substrate B. The board work program BP based on the work process is stored. The control unit 8 was printed at a predetermined location RA by controlling the head unit 4, the support unit 5, the rail unit 6, the substrate imaging unit 7, the X-axis motor 52, and the Y-axis motor 62 according to the substrate work program BP. It is configured to repair the solder S.

<Board work processing>
Next, by exemplifying the solder S printed on the predetermined location RA in the region TP in FIG. 2, the substrate work processing by executing the substrate work program BP of the control unit 8 of the coating device 1b is shown in FIGS. 5 to 5 to FIG. This will be described based on 7.

The control unit 8 is configured to take an image of the solder S by the substrate imaging unit 7 and control the solder S to be applied and repaired by the dispense head 41. Specifically, the control unit 8 is based on the shortage position SP of the solder S and the shortage amount SQ of the solder S in the shortage position SP acquired by the image pickup result of the solder S printed on the predetermined position RA on the substrate B. , The dispense head 41 is configured to control the repair of the insufficient position SP in the predetermined position RA.

For example, as shown in FIG. 5, when the substrate imaging unit 7 of the coating device 1b images a predetermined location RA to which the third solder S is applied from one side (X2 side), the control unit 8 captures the plane of the solder S. The shape CS (two-dimensional shape CS) in the visual sense is recognized. Then, as shown in FIG. 6, the control unit 8 of the coating device 1b is applied to the third predetermined position RA from one side (X2 side) when the position of the FI mark on the substrate B is used as a reference position. Acquires the reference shape DS of the solder S. The control unit 8 determines whether the inspection result of the solder S at the predetermined location RA is good or bad based on the comparison between the reference shape DS of the solder S and the shape CS of the solder S.

When the inspection result is defective, the control unit 8 of the coating device 1b is positioned in the plane (XY plane) of the first shortage portion R1 based on the reference shape DS of the solder S (first shortage position SP1). ). Further, the control unit 8 of the coating device 1b acquires a position (second shortage position SP2) in the plane (in the XY plane) of the second shortage portion R2 based on the reference shape DS of the solder S. The first deficiency position SP1 and the second deficiency position SP2 are examples of "deficiency positions" in the claims.

The control unit 8 of the coating device 1b acquires the ratio of the first shortage portion R1 to the reference shape DS of the solder S. As a result, the control unit 8 of the coating device 1b is based on the amount of solder S required to form the reference shape DS of the solder S and the ratio of the first shortage portion R1 to the reference shape DS of the solder S. The amount of solder S to be applied to the first shortage portion R1 (first shortage amount SQ1) is acquired. The first deficiency amount SQ1 is an example of the "deficiency amount" in the claims.

Further, the control unit 8 of the coating device 1b acquires the ratio of the second shortage portion R2 to the reference shape DS of the solder S. As a result, the control unit 8 of the coating device 1b is based on the amount of solder S required to form the reference shape DS of the solder S and the ratio of the second shortage portion R2 to the reference shape DS of the solder S. The amount of solder S to be applied to the second shortage portion R2 (second shortage amount SQ2) is acquired. The second deficiency amount SQ2 is an example of the "deficiency amount" in the claims.

As shown in FIG. 7, the control unit 8 of the coating device 1b causes the dispense head 41 to apply the solder S to the first shortage portion R1 based on the first shortage position SP1 and the first shortage amount SQ1. Further, the control unit 8 of the coating device 1b causes the dispense head 41 to apply the solder S to the second shortage portion R2 based on the second shortage position SP2 and the second shortage amount SQ2. In this way, the coating device 1b repairs the repaired portion in the predetermined portion RA to which the solder S is applied. Here, the repaired portion in the predetermined portion RA is repaired by applying (dotting) the solder S from the dispense head 41 so as to have a substantially circular shape in a plan view.

<Flow chart of board work processing>
The board work processing flow carried out by the board work program BP will be described with reference to FIG.

First, in step S1, the control unit 8 inspects the solder S at the predetermined position RA on the substrate B printed by the printing device 1a. That is, the control unit 8 recognizes the solder S on the substrate B by the imaging of the substrate imaging unit 7, and compares the imaging result of the solder S on the substrate B with the reference shape DS, whereby the solder S on the substrate B is compared. To inspect. In step S2, the control unit 8 determines whether or not the inspection result of the solder S on the substrate B is good. The control unit 8 proceeds to step S3 when the inspection of the solder S on the substrate B is defective. The control unit 8 ends the board work process when the inspection of the solder S on the board B is good.

In step S3, the control unit 8 sets the shortage position SP and the shortage amount SQ of the solder S to be applied by the dispense head 41. In step S4, the control unit 8 uses the dispense head 41 to apply the solder S for the insufficient amount SQ to the insufficient position SP, and returns to step S1. As a result, repair is performed until the inspection of the solder S is judged to be good.

(Effect of the first embodiment)
In the first embodiment, the following effects can be obtained.

In the first embodiment, as described above, when the amount of the solder S printed on the predetermined portion RA on the substrate B is insufficient, the coating device 1b is repaired by applying the solder S by the dispense head 41. A control unit 8 for controlling the operation is provided. As a result, the repair is automatically performed without waiting for the operator to manually perform the work for the defect, so that the production can be continued without stopping the production. As a result, even when the substrate B that needs to be repaired is generated, it is possible to suppress a large decrease in production efficiency.

Further, in the first embodiment, as described above, the control unit 8 has the dispense head 41 based on the shortage amount SQ of the solder S obtained by the inspection of the solder S printed on the predetermined portion RA on the substrate B. It is configured to control the coating and repair of the solder S. As a result, an amount based on the insufficient amount SQ of the solder S can be applied to the predetermined portion RA on the substrate B for repair. Therefore, an appropriate amount of the solder S can be applied to the predetermined portion RA on the substrate B for repair. can do.

Further, in the first embodiment, as described above, the control unit 8 inspects the solder S printed on the predetermined position RA on the substrate B, and as a result, the solder S is insufficient at the insufficient position SP and the insufficient position SP. It is configured to acquire the quantity SQ. Further, the control unit 8 is configured to perform control to repair the shortage position SP in the predetermined position RA by the dispense head 41 based on the shortage position SP and the shortage amount SQ. As a result, an amount based on the shortage amount SQ of the solder S can be applied to the shortage position SP of the solder S in the predetermined place RA on the substrate B to repair it, so that the amount can be repaired at an appropriate position of the predetermined place RA on the board B. An appropriate amount of solder S can be applied. As a result, repair can be performed more appropriately.

Further, in the first embodiment, as described above, the coating device 1b further includes, in addition to the dispense head 41, a substrate imaging unit 7 for inspecting the solder S printed on the predetermined portion RA on the substrate B. .. The control unit 8 is configured to inspect the solder S by the substrate imaging unit 7 and control the solder S to be applied and repaired by the dispense head 41. As a result, it is possible to inspect the solder S applied to the predetermined location RA and repair the solder S of the predetermined location RA on the substrate B in the same coating device 1b, so that the repair by the dispense head 41 of the predetermined location RA can be performed. It can be done quickly.

Further, in the first embodiment, as described above, the coating device 1b including the control unit 8 that controls the coating and repair of the solder S by the dispense head 41 is provided. As a result, it is possible to suppress the supply of the substrate B in which the amount of the solder S applied to the predetermined portion RA is insufficient to the component mounting device 1c, so that the work on the substrate B is stopped in the component mounting system 1. It is possible to suppress this. As a result, when the substrate B that needs to be repaired is generated, it is possible to suppress a large decrease in production efficiency.

(Second Embodiment)
Next, the configuration of the component mounting system 201 according to the second embodiment of the present invention will be described with reference to FIGS. 4 and 9 to 14. In the second embodiment, unlike the first embodiment, an example in which the coating device 201b is configured to also have the function of the printing device 1a of the first embodiment will be described. In the second embodiment, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

In the component mounting system 201, the coating device 201b and the component mounting device 1c are arranged in this order from the upstream. The coating device 201b applies the solder S to the predetermined location RA, and when it is determined that the coating amount of the solder S is too small or the coating is missed at the predetermined location RA, the coating device 201b repairs the predetermined location RA. It is configured to perform control. That is, the coating device 201b also has the function of the printing device 1a of the first embodiment in addition to the function of the coating device 1b of the first embodiment. The component mounting device 1c is configured to mount electronic components on the substrate B carried out from the coating device 201b.

<Board work processing>
The substrate work program BP carried out by the control unit 208 of the coating apparatus 201b will be described with reference to FIGS. 10 to 13.

For example, as shown in FIG. 10, when the substrate imaging unit 7 of the coating device 201b images a predetermined location RA to which the second solder S is applied from one side (X2 side), the control unit 208 uses the control unit 208 to image the plane of the solder S. The shape CS (two-dimensional shape CS) in the visual sense is recognized. Then, as shown in FIG. 11, the control unit 208 of the coating device 201b is applied to the second predetermined position RA from one side (X2 side) when the position of the FI mark on the substrate B is used as a reference position. Acquires the reference shape DS of the solder S. The control unit 208 determines whether the inspection result of the solder S at the predetermined location RA is good or bad based on the comparison between the reference shape DS of the solder S and the shape CS of the solder S.

The control unit 208 of the coating device 201b acquires a position (third shortage position SP3) in the plane (in the XY plane) of the third shortage portion R3 based on the reference shape DS of the solder S. The control unit 208 of the coating device 201b acquires the ratio of the third shortage portion R3 to the reference shape DS of the solder S. As a result, the control unit 208 of the coating device 201b is based on the amount of solder S required to form the reference shape DS of the solder S and the ratio of the third shortage portion R3 to the reference shape DS of the solder S. The amount of solder S to be applied to the third shortage portion R3 (third shortage amount SQ3) is acquired. The third deficiency position SP3 and the third deficiency amount SQ3 are examples of the "deficiency position" and the "deficiency amount" in the claims, respectively.

The control unit 208 of the coating device 201b controls to adjust the clearance CR between the tip of the nozzle 241a and the substrate B according to the third shortage amount SQ3 of the solder S applied to the predetermined portion RA on the substrate B. It is configured as follows. Specifically, as shown in FIG. 12A, when the third shortage amount SQ3 is large, the amount of solder S applied from the dispense head 41 is large, so that the control unit 208 uses the nozzle 241a. Increase the clearance CR between the tip and the substrate B. Further, as shown in FIG. 12B, when the third shortage amount SQ3 is small, the amount of solder S applied from the dispense head 41 is small, so that the control unit 208 is connected to the tip portion of the nozzle 241a. The clearance CR with the substrate B is reduced.

Further, the control unit 208 keeps the tip portion of the nozzle 241a and the substrate B in a non-contact state when the clearance CR between the tip portion of the nozzle 241a and the substrate B is reduced. The control unit 208 is configured to keep the tip of the nozzle 241a and the substrate B in a non-contact state, and to apply the solder S to the third shortage portion R3. This makes it possible to separate an accurate amount of solder S from the nozzle 241a into the third shortage portion R3.

As shown in FIG. 13, the control unit 208 of the coating device 201b causes the dispense head 41 to apply the solder S to the third shortage portion R3 based on the third shortage position SP3 and the third shortage amount SQ3. In this way, the coating device 201b repairs the repaired portion in the predetermined portion RA to which the solder S is applied. The other configurations of the second embodiment are the same as the configurations of the first embodiment.

<Flow chart of board work processing>
A substrate work processing flow carried out by the substrate work program BP will be described with reference to FIG.

In step S11, the control unit 208 applies the solder S to the predetermined portion RA on the substrate B by the dispense head 41. Then, in each of steps S12 to S15, the control unit 208 performs a process corresponding to each of steps S1 to S4 of the inspection process of the first embodiment.

(Effect of the second embodiment)
In the second embodiment, the following effects can be obtained.

In the second embodiment, as described above, the dispense head 41 includes a nozzle 241a into which the solder S is discharged. The control unit 208 is configured to control the clearance CR between the tip portion of the nozzle 241a and the substrate B according to the third shortage amount SQ3 of the solder S applied to the predetermined portion RA on the substrate B. ing. As a result, the clearance CR between the tip of the nozzle 241a and the substrate B causes the tip of the nozzle 241a and the substrate B to be in non-contact, so that the coating is applied to a predetermined portion on the substrate B due to the contact of the tip of the nozzle 241a. Deformation of the shape of the solder S can be suppressed.

Further, in the second embodiment, as described above, the clearance CR between the tip portion of the nozzle 241a and the substrate B is adjusted according to the insufficient amount of the solder S, so that the predetermined portion RA on the substrate B can be repaired. It can be done more appropriately.

(Modification example)
It should be noted that the embodiments disclosed this time are exemplary in all respects and are not considered to be restrictive. The scope of the present invention is shown by the scope of claims rather than the description of the above-described embodiment, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims.

For example, in the first and second embodiments, the substrate imaging unit 7 attached to the head unit 4 has shown an example in which an inspection based on imaging of the solder S at a predetermined location RA on the substrate B is performed. , The present invention is not limited to this. In the present invention, as in the first modification shown in FIGS. 4, 15 and 16, the inspection of solder at a predetermined position on the substrate is performed by the printing inspection device 301d arranged downstream of the printing device 1a. May be good. In this case, the control unit 308 of the coating device 301b is configured to perform repair by the dispense head based on the inspection result of the solder printing inspection device 301d on the substrate printed at a predetermined position. Further, the substrate work processing flow by the control unit 308 is as shown in FIG. First, in step S21, the control unit 308 acquires the shortage position and the shortage amount of solder based on the inspection result of the print inspection device 301d. In step S22, the control unit 308 sets the shortage position and the shortage amount of the solder to be applied by the dispense head. In step S23, the control unit 308 applies the insufficient amount of solder to the insufficient position by the dispense head, and ends the substrate work process.

Further, in the first and second embodiments, the inspection of the solder S at the predetermined location RA on the substrate B is performed based on the imaging result of the solder S at the predetermined location RA on the substrate B by the substrate imaging unit 7. However, the present invention is not limited to this. In the present invention, the coating device 1b may include a volume measuring unit capable of measuring the volume of the solder S. In this case, the control unit 8 is configured to acquire the shortage amount SQ of the solder S based on the volume of the solder S measured by the volume measuring unit. As a result, the amount of solder S applied or printed on the predetermined portion RA can be accurately obtained. Therefore, the insufficient amount SQ can be accurately acquired and an appropriate amount of solder S can be obtained from the predetermined portion RA on the substrate B. Can be applied. Further, the print inspection device 301d shown in the first modification may include a volume measuring unit. The volume measuring unit includes a camera capable of capturing the three-dimensional shape of the solder S, a laser measuring unit capable of measuring the three-dimensional shape of the solder S, and the like.

Further, in the first, second embodiment and the first modification, the example in which the solder S is repaired at the predetermined position RA on the substrate B is shown, but the present invention is not limited to this. In the present invention, the adhesive such as flux may be repaired at a predetermined position on the substrate.

Further, in the first and second embodiments and the first modification, the control unit 8 (208, 308) is configured to apply the solder S to the insufficient position SP of the solder S by the amount of the insufficient amount SQ. However, the present invention is not limited to this. In the present invention, the control unit may be configured to apply an insufficient amount of solder to the entire predetermined portion.

Further, in the first and second embodiments and the first modification, the control unit 8 (208, 308) has shown an example in which the solder S is configured to be applied by the amount of the insufficient amount SQ. The present invention is not limited to this. In the present invention, the control unit may be configured to apply a certain amount of solder to a predetermined place.

Further, in the first to second embodiments and the first modification, for convenience of explanation, a flow-driven flowchart in which the control processes of the control units 8 (208, 308) are sequentially processed along the processing flow is shown. Although the examples described using the present invention have been shown, the present invention is not limited to this. In the present invention, the control process of the control unit may be performed by an event-driven type (event-driven type) process in which the process is executed in event units. In this case, it may be completely event-driven, or it may be a combination of event-driven and flow-driven.

Further, in the first embodiment, as shown in FIG. 7, the solder S is applied (dotted) from the dispense head 41 so as to have a substantially circular shape in a plan view for the repair of the repaired portion in the predetermined portion RA. However, the present invention is not limited to this. In the present invention, the repair of the repaired portion at a predetermined portion is performed by applying solder from the dispense head so as to have a substantially rectangular shape in a plan view, depending on the shape of the repaired portion, as in the second modification shown in FIG. ) May be done.

1,201,301 Parts mounting system 1b, 201b, 301b Coating device (coating device with repair function)
1c Component mounting device 7 Board imaging unit (inspection unit)
8, 208, 308 Control unit 41 Dispense head (coating unit)
41a, 241a Nozzle B Board CR Clearance RA Predetermined location S Solder (liquid material)
SP shortage position SQ shortage amount

Claims (6)

The coating part that applies the liquid material to the substrate, and
When the amount of the liquid material applied or printed on the predetermined portion on the substrate is insufficient and there is a shortage portion of the liquid material on which the liquid material is not applied, the liquid material is applied or printed on the predetermined portion on the substrate. The said to be obtained based on the comparison between the two-dimensional reference shape of the liquid material in a plan view and the two-dimensional shape of the liquid material actually applied or printed on a predetermined place on the substrate. Based on the shortage amount of the liquid material and the shortage position of the liquid material in the shortage portion of the liquid material, the coating unit controls to apply the liquid material to the shortage portion of the liquid material on the substrate and repair it. A coating device with a repair function equipped with a control unit. The control unit is subjected to the liquid material by the coating unit based on the shortage amount of the liquid material and the shortage position of the liquid material obtained by the inspection of the liquid material applied or printed on the predetermined portion on the substrate. The coating device with a repair function according to claim 1, which is configured to control the coating and repair of a material. The control unit applies the liquid material based on the shortage position of the liquid material obtained by the inspection of the liquid material applied or printed on the predetermined portion on the substrate and the shortage amount of the liquid material at the shortage position. The coating device with a repair function according to claim 2, wherein the unit is configured to control the repair of the shortage position at the predetermined position. In addition to the coating unit, an inspection unit for inspecting the shortage amount of the liquid material coated or printed on the predetermined portion on the substrate and the shortage position of the liquid material is further provided.
Any one of claims 1 to 3, wherein the control unit is configured to inspect the liquid material by the inspection unit and control the liquid material to be applied and repaired by the coating unit. The coating device with the repair function described in the section. The coating portion includes a nozzle from which the liquid material is discharged.
The control unit is configured to control the clearance between the tip of the nozzle and the substrate according to the shortage of the liquid material applied or printed on the predetermined portion on the substrate. The coating device with a repair function according to any one of claims 1 to 4. When there is a coating portion for applying the liquid material to the substrate and a shortage portion of the liquid material to which the liquid material is not applied due to insufficient amount of the liquid material applied or printed at a predetermined position on the substrate. , A two-dimensional reference shape of the liquid material applied or printed on a predetermined place on the substrate in a plan view and a two-dimensional view of the liquid material actually applied or printed on a predetermined place on the substrate. Based on the shortage amount of the liquid material and the shortage position of the liquid material in the shortage portion of the liquid material acquired based on the comparison with the shape, the liquid material is applied to the liquid material on the substrate by the coating portion. A coating device with a repair function that includes a control unit that controls coating and repairing the missing part,
A component mounting system including a component mounting device that is arranged downstream of the coating device with a repair function and mounts a component on the substrate carried out from the coating device with a repair function.

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