JPH0555226B2 - - Google Patents

Info

Publication number
JPH0555226B2
JPH0555226B2 JP63257429A JP25742988A JPH0555226B2 JP H0555226 B2 JPH0555226 B2 JP H0555226B2 JP 63257429 A JP63257429 A JP 63257429A JP 25742988 A JP25742988 A JP 25742988A JP H0555226 B2 JPH0555226 B2 JP H0555226B2
Authority
JP
Japan
Prior art keywords
brazing
zone
reflow oven
conveyor belt
electrical components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63257429A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01138059A (ja
Inventor
Mitsuterusutetsuto Noruberuto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Schott Quarzschmelze GmbH
Original Assignee
Heraeus Schott Quarzschmelze GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Schott Quarzschmelze GmbH filed Critical Heraeus Schott Quarzschmelze GmbH
Publication of JPH01138059A publication Critical patent/JPH01138059A/ja
Publication of JPH0555226B2 publication Critical patent/JPH0555226B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Tunnel Furnaces (AREA)
JP63257429A 1987-11-07 1988-10-14 電気的構成部材のロウ付けのためのリフロー炉 Granted JPH01138059A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3738136.9 1987-11-07
DE3738136A DE3738136C1 (de) 1987-11-07 1987-11-07 Durchlaufofen zum Anloeten von elektronischen Bauteilen

Publications (2)

Publication Number Publication Date
JPH01138059A JPH01138059A (ja) 1989-05-30
JPH0555226B2 true JPH0555226B2 (en:Method) 1993-08-16

Family

ID=6340188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63257429A Granted JPH01138059A (ja) 1987-11-07 1988-10-14 電気的構成部材のロウ付けのためのリフロー炉

Country Status (6)

Country Link
US (1) US4915624A (en:Method)
EP (1) EP0315762B1 (en:Method)
JP (1) JPH01138059A (en:Method)
AT (1) ATE78739T1 (en:Method)
DE (2) DE3738136C1 (en:Method)
ES (1) ES2034086T3 (en:Method)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3808073C2 (de) * 1988-03-11 1994-01-13 Lothar Himmelreich Infrarot-Lötofen zum Aufschmelzlöten von elektronischen Bauelementen auf Leiterplatten
DE3841447C1 (en:Method) * 1988-12-09 1990-08-02 Heraeus Quarzschmelze Gmbh, 6450 Hanau, De
JPH0377772A (ja) * 1989-08-18 1991-04-03 Aiwa Co Ltd 赤外線加熱式リフローハンダ付け方法および赤外線加熱式リフローハンダ付け装置
DE4016366C2 (de) * 1990-05-21 1994-04-28 Siemens Nixdorf Inf Syst Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte
DE4126597A1 (de) * 1991-08-10 1993-02-11 Heraeus Quarzglas Verfahren und vorrichtung zur waermebehandlung von werkstuecken mit elektrischen und elektronischen bauteilen
DE4302976A1 (de) * 1992-07-22 1994-01-27 Bosch Gmbh Robert Vorrichtung und Verfahren zum Auflöten von Bauelementen auf Platinen
US5868564A (en) * 1992-07-28 1999-02-09 International Business Machines Corporation Sequential step belt furnace with individual concentric heating elements
BE1007867A3 (nl) * 1993-12-10 1995-11-07 Koninkl Philips Electronics Nv Werkwijze voor het verwarmen van een strookvormige drager in een oven en inrichting voor het bevestigen van tenminste een component op een strookvormige drager.
US5421723A (en) * 1994-03-25 1995-06-06 International Business Machines Corporation Sequential step belt furnace with individual concentric cooling elements
DE29617213U1 (de) * 1996-10-02 1997-01-09 SMT Maschinengesellschaft mbH, 97877 Wertheim Reflowlötanlage
US6039236A (en) * 1997-06-11 2000-03-21 Soltec B.V. Reflow soldering apparatus with improved cooling
US6768083B2 (en) * 2002-09-19 2004-07-27 Speedline Technologies, Inc. Reflow soldering apparatus and method for selective infrared heating
US8728831B2 (en) * 2010-12-30 2014-05-20 Stmicroelectronics Pte. Ltd. Reconstituted wafer warpage adjustment
DE102011009693A1 (de) * 2011-01-28 2012-08-02 Centrotherm Thermal Solutions Gmbh & Co. Kg Kühlmodul und Vorrichtung zum thermischen Behandeln von Substraten
DE102011056444C5 (de) * 2011-12-14 2015-10-15 Voestalpine Metal Forming Gmbh Verfahren und Vorrichtung zum partiellen Härten von Blechbauteilen
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
CN118951217B (zh) * 2024-08-13 2025-02-14 无锡固翌智能科技有限公司 半导体器件真空焊接自动化设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2254769C3 (de) * 1972-11-09 1985-06-05 Vereinigte Aluminium-Werke AG, 1000 Berlin und 5300 Bonn Durchlaufofen zum flußmittellosen Löten von Aluminiumwerkstoffen unter Schutzgas
FR2405448B1 (fr) * 1977-10-07 1985-06-28 Welko Ind Spa Installation pour le controle de la conduite des fours a rouleaux pour la cuisson de matieres ceramiques ou similaires
JPS5897480A (ja) * 1981-12-07 1983-06-09 Matsushita Electric Ind Co Ltd パイプ材のろう付け方法
FR2536160A1 (fr) * 1982-11-17 1984-05-18 Piezo Ceram Electronique Four continu de brasure de composants electroniques
US4565917B1 (en) * 1984-01-18 1999-06-08 Vitronics Corp Multi-zone thermal process system utilizing nonfocused infared panel emitters
JPS6127485A (ja) * 1984-07-17 1986-02-06 中外炉工業株式会社 連続式雰囲気熱処理炉
JPH0828569B2 (ja) * 1985-06-18 1996-03-21 松下電器産業株式会社 リフロー装置
IT1205512B (it) * 1986-12-30 1989-03-23 Mauro Poppi Forno per la cottura di materiali ceramici quali piastrelle e simili

Also Published As

Publication number Publication date
EP0315762A3 (en) 1990-01-03
EP0315762B1 (de) 1992-07-29
DE3873266D1 (de) 1992-09-03
ATE78739T1 (de) 1992-08-15
ES2034086T3 (es) 1993-04-01
US4915624A (en) 1990-04-10
DE3738136C1 (de) 1989-01-26
EP0315762A2 (de) 1989-05-17
JPH01138059A (ja) 1989-05-30

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