JPH0555209A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To improve reliability against the disconnection of a wiring in a semiconductor integrated circuit device. CONSTITUTION:Wirings 4, 5 connecting a plurality of elements such as the bonding pads 1 of a semiconductor integrated circuit device and first and second resistors 2, 3 are composed of a plurality of wirings 4A, 4B, 5A, 5B connected in parallel. Accordingly, even when one wiring is disconnected, connection among the elements is ensured by the remaining wirings.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device having excellent reliability.

[0002]

2. Description of the Related Art Generally, in a semiconductor integrated circuit device, a plurality of circuit elements formed on a semiconductor substrate are interconnected by wiring such as aluminum to form a required circuit. For example, as shown in FIG. 2 as an example, the bonding pad 1 and the first and second resistors 2 and 3 are connected to each other by wirings 7 and 8 made of aluminum or polycrystalline silicon to form a circuit. ing. Reference numeral 6 is a contact between the wirings 7 and 8 and the resistors 2 and 3.

[0003]

As described above, in the conventional semiconductor integrated circuit device, each circuit element is connected by one wiring. For this reason, when a wiring is formed and foreign matter adheres to the wiring during the lithography to cause a chipping of the wiring and the wiring is in a disconnected state, or even when the wiring is initially electrically connected, the wiring is disconnected due to metal migration while the current continues to flow. In the case of occurrence of such a problem, conduction between circuit elements is impaired, a malfunction of the semiconductor integrated circuit device is caused, and reliability is lowered. An object of the present invention is to provide a semiconductor integrated circuit device having improved reliability against disconnection of wiring.

[0004]

In a semiconductor integrated circuit device according to the present invention, a wiring connecting a plurality of elements is composed of a plurality of wirings connected in parallel.

[0005]

According to the present invention, even if one wiring is broken, the remaining wiring ensures the connection between the elements.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a main part of an embodiment of a semiconductor integrated circuit device of the present invention. In the figure, 1 is a bonding pad, and 2 and 3 are first and second resistors, respectively. The bonding pad 1 and the first and second resistors 2 and 3 are connected by aluminum wirings 4 and 5, respectively. Here, the wiring 4 connecting the bonding pad 1 and the first resistor 2 is composed of two aluminum wirings 4A and 4B connected in parallel. Similarly, the wiring 5 connecting between the first resistor 2 and the second resistor 3
Is composed of two aluminum wirings 5A and 5B connected in parallel. Reference numeral 6 is a contact between the aluminum wirings 4 and 5 and the resistors 2 and 3. In this case, the aluminum wirings 4A, 4B, 5A and 5B connected in parallel are formed so that the two wirings are not close to each other as long as the layout of the semiconductor integrated circuit device permits. Further, in the semiconductor integrated circuit device adopting the multilayer wiring structure, the aluminum wirings connected in parallel are composed of wirings in different layers.

According to this structure, the bonding pad 1 and the first and second resistors 2 and 3 are electrically connected to each other by the two aluminum wirings 4A, 4B, 5A and 5B. Even if a defect occurs in one of the aluminum wirings and the wiring is broken, the connection of each element is secured by the other aluminum wiring. In this case, since the aluminum wirings connected in parallel are formed as far apart as possible and are formed as different wiring layers, the probability that the aluminum wirings will be disconnected at the same time becomes extremely small, and The probability of securing the connection is extremely high. As a result, the reliability of the semiconductor integrated circuit device can be improved.

By connecting two aluminum wirings in parallel, it is possible to reduce the electric resistance between the respective elements. Further, although the above embodiment shows an example in which the wiring is made of aluminum, the same applies to the case where the wiring is made of polycrystalline silicon or refractory metal. Furthermore, if there is a layout margin, three or more wirings may be connected in parallel.

Incidentally, assuming that the defect rate when the number of wirings between the elements is one is 100 ppm, the rate of failure when the number of wirings between the elements is two is (10 ⁻⁴ ) ² = 0.01 ppm. In addition, the defect rate when the number of wires between elements is 3 is (10 ^-4 ) ³ = 0.000001ppm
Becomes

[0010]

As described above, according to the present invention, since a plurality of elements are connected by a plurality of wirings connected in parallel,
Even if one wiring is broken, there is an effect that the connection between the elements can be secured by the remaining wiring and the reliability of the semiconductor integrated circuit device can be improved.

[Brief description of drawings]

FIG. 1 is a plan view of an essential part of an embodiment of a semiconductor integrated circuit device of the present invention.

FIG. 2 is a plan view of a part of a conventional semiconductor integrated circuit device.

[Explanation of symbols]

1 Bonding Pad 2 First Resistor 3 Second Resistor 4 (4A, 4B), 5 (5A, 5B) Aluminum Wiring

Claims (1)

[Claims] 1. A semiconductor integrated circuit device, wherein a wiring connecting a plurality of elements formed in the semiconductor integrated circuit device is composed of a plurality of wirings connected in parallel.