JPH055173B2 - - Google Patents

Info

Publication number
JPH055173B2
JPH055173B2 JP59070616A JP7061684A JPH055173B2 JP H055173 B2 JPH055173 B2 JP H055173B2 JP 59070616 A JP59070616 A JP 59070616A JP 7061684 A JP7061684 A JP 7061684A JP H055173 B2 JPH055173 B2 JP H055173B2
Authority
JP
Japan
Prior art keywords
chip
dispenser
tape
bonding
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59070616A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60213036A (ja
Inventor
Yasuo Shimoda
Motohiko Kato
Takeshi Kimoto
Eiji Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP59070616A priority Critical patent/JPS60213036A/ja
Publication of JPS60213036A publication Critical patent/JPS60213036A/ja
Publication of JPH055173B2 publication Critical patent/JPH055173B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)
JP59070616A 1984-04-09 1984-04-09 チツプボンデイング装置 Granted JPS60213036A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59070616A JPS60213036A (ja) 1984-04-09 1984-04-09 チツプボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59070616A JPS60213036A (ja) 1984-04-09 1984-04-09 チツプボンデイング装置

Publications (2)

Publication Number Publication Date
JPS60213036A JPS60213036A (ja) 1985-10-25
JPH055173B2 true JPH055173B2 (mo) 1993-01-21

Family

ID=13436712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59070616A Granted JPS60213036A (ja) 1984-04-09 1984-04-09 チツプボンデイング装置

Country Status (1)

Country Link
JP (1) JPS60213036A (mo)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763835A (en) * 1980-10-04 1982-04-17 Shinkawa Ltd Die bonding apparatus
JPS588944U (ja) * 1981-07-08 1983-01-20 日本電気ホームエレクトロニクス株式会社 半導体製造装置

Also Published As

Publication number Publication date
JPS60213036A (ja) 1985-10-25

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