JPH0550142B2 - - Google Patents

Info

Publication number
JPH0550142B2
JPH0550142B2 JP58221251A JP22125183A JPH0550142B2 JP H0550142 B2 JPH0550142 B2 JP H0550142B2 JP 58221251 A JP58221251 A JP 58221251A JP 22125183 A JP22125183 A JP 22125183A JP H0550142 B2 JPH0550142 B2 JP H0550142B2
Authority
JP
Japan
Prior art keywords
alloy
brazing
lead pin
lead
difficult
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58221251A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60113449A (ja
Inventor
Katsuyuki Takarasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP22125183A priority Critical patent/JPS60113449A/ja
Publication of JPS60113449A publication Critical patent/JPS60113449A/ja
Publication of JPH0550142B2 publication Critical patent/JPH0550142B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP22125183A 1983-11-24 1983-11-24 難加工性ろう材付リ−ドピンの製造方法 Granted JPS60113449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22125183A JPS60113449A (ja) 1983-11-24 1983-11-24 難加工性ろう材付リ−ドピンの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22125183A JPS60113449A (ja) 1983-11-24 1983-11-24 難加工性ろう材付リ−ドピンの製造方法

Publications (2)

Publication Number Publication Date
JPS60113449A JPS60113449A (ja) 1985-06-19
JPH0550142B2 true JPH0550142B2 (enrdf_load_stackoverflow) 1993-07-28

Family

ID=16763838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22125183A Granted JPS60113449A (ja) 1983-11-24 1983-11-24 難加工性ろう材付リ−ドピンの製造方法

Country Status (1)

Country Link
JP (1) JPS60113449A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2678247B2 (ja) * 1986-12-24 1997-11-17 田中貴金属工業 株式会社 Ｉｃパッケージの製造方法
JP2685559B2 (ja) * 1988-12-28 1997-12-03 株式会社徳力本店 ろう材付リードピンの製造方法およびその製造装置
KR100499321B1 (ko) * 2002-04-26 2005-07-04 정일조 귀고리핀 전기저항 용접장치
CN107813090B (zh) * 2016-09-13 2021-08-31 富鼎电子科技(嘉善)有限公司 一种探针制备方法及制备该探针的焊接治具

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5823466A (ja) * 1981-08-04 1983-02-12 Tanaka Kikinzoku Kogyo Kk 集積回路装置用リ−ドピン
JPS5835093A (ja) * 1981-08-25 1983-03-01 Tanaka Kikinzoku Kogyo Kk 複合ろう材

Also Published As

Publication number Publication date
JPS60113449A (ja) 1985-06-19

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