JPH0550131B2 - - Google Patents
Info
- Publication number
- JPH0550131B2 JPH0550131B2 JP58156580A JP15658083A JPH0550131B2 JP H0550131 B2 JPH0550131 B2 JP H0550131B2 JP 58156580 A JP58156580 A JP 58156580A JP 15658083 A JP15658083 A JP 15658083A JP H0550131 B2 JPH0550131 B2 JP H0550131B2
- Authority
- JP
- Japan
- Prior art keywords
- tool
- arm
- tool shaft
- lever
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58156580A JPS6047431A (ja) | 1983-08-26 | 1983-08-26 | 部品マウント装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58156580A JPS6047431A (ja) | 1983-08-26 | 1983-08-26 | 部品マウント装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6047431A JPS6047431A (ja) | 1985-03-14 |
| JPH0550131B2 true JPH0550131B2 (enExample) | 1993-07-28 |
Family
ID=15630866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58156580A Granted JPS6047431A (ja) | 1983-08-26 | 1983-08-26 | 部品マウント装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6047431A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62295431A (ja) * | 1986-06-13 | 1987-12-22 | Nichiden Mach Ltd | ワ−クピツクアツプ装置 |
| US4799854A (en) * | 1987-07-20 | 1989-01-24 | Hughes Aircraft Company | Rotatable pick and place vacuum sense head for die bonding apparatus |
-
1983
- 1983-08-26 JP JP58156580A patent/JPS6047431A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6047431A (ja) | 1985-03-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |