JPH0548061A - Contact type linear sensor - Google Patents

Abstract

PURPOSE:To provide a contact type linear sensor in which the stress generating in a linear sensor chip due to the expansion difference caused by temperature change, etc., is eased even if the expansion coefficient of substrate differes from that of linear sensor chip, and two linear sensors are not out of position with respect to the substrate. CONSTITUTION:The first linear sensor chip 3 mounted on a substrate 2 is allowed to face oppositely one end 41 and the second linear sensor chip 4 is mounted approximately in parallel in lengthwise direction. Then the facing ends 31 and 41 of the first and second linear sensor chips are adhered to each other on the substrate 2 by the first resin, and each of other ends is respectively adhered to the substrate 2 by the second resin. An epoxy resin 5 is used as the first resin and a softer rubber-based adhesive 6 than the first resin is used as the second resin, respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact type linear sensor used as a reading device for office automation equipment and the like.

[0002]

2. Description of the Related Art Conventionally, there are mainly two types of linear sensors: a reduction type linear sensor and a contact type linear sensor. The former has a structure in which information from a subject is reduced through a lens system and read by a linear sensor chip. The latter is
This is a structure in which the information of the subject is read in a one-to-one manner without going through the lens system. As described above, this contact-type linear sensor reads the information of the subject on a one-to-one basis, so that a linear sensor chip having a length at least the width of the subject is required.
In order to form such one elongated linear sensor chip, a wafer having a diameter larger than this length is required. However, it is very difficult to obtain a wafer having such a large diameter. Therefore, a linear sensor chip having a predetermined length is formed by dividing the linear sensor chip into two parts and connecting and bonding the two sensor chips on a quartz substrate having a relatively large expansion coefficient. Among such contact type linear sensors, from the viewpoint of cost reduction, the contact is made by using a glass epoxy resin substrate instead of using an expensive quartz substrate as a substrate on which these two linear sensor chips are mounted. Type linear sensors have come into wide use.

[0003]

However, the contact type linear sensor in which the two linear sensor chips are bonded on the glass epoxy resin substrate has the following problems. That is, when a substrate and a linear sensor chip having a different expansion coefficient are bonded on the substrate, a stress is generated in the linear sensor chip due to a difference in expansion and contraction between the substrate and the linear sensor chip due to temperature change, etc. Peeling off and the like occur. Therefore, if the two linear sensor chips and the substrate are bonded with a soft resin, the stress due to this expansion / contraction difference can be relieved, but since the two linear sensor chips are displaced relative to the substrate, the information of the subject is accurate. Can not read. Therefore, the present invention is
Even if the expansion coefficient of the substrate and that of the linear sensor chip are different, the stress generated in the linear sensor chip due to the expansion / contraction difference due to temperature change, etc. is relaxed and the two linear sensor chips are displaced relative to the substrate. The object is to provide a non-contact type linear sensor.

[0004]

SUMMARY OF THE INVENTION The present invention is a contact type linear sensor made to solve these problems. That is, the first linear sensor chip provided on the substrate and the second linear sensor chip having one end facing the first linear sensor chip and provided substantially parallel to the long side direction of the first linear sensor chip. And the first
A first resin for adhering one end side of the linear sensor chip and one end side of the second linear sensor chip on the substrate,
The other end of each of the first and second linear sensor chips is composed of a second resin that is adhered onto a substrate, and the second resin is softer than the first resin. It consists of

[0005]

The first linear sensor chip and one end of the second linear sensor chip are bonded to the substrate.
Of the resin and the second resin in which the other ends of the first and second linear sensor chips are respectively adhered to the substrate, the second resin is softer than the first resin. The stress generated by the difference in expansion coefficient from the chip is not applied to the linear sensor chip itself, and there is no displacement of the first and second linear sensor chips from the substrate.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view for explaining the present invention, and FIG. 2 is a first and a second.
FIG. 3 is an enlarged view of one end where the linear sensor chip of FIG. As shown in FIG. 1, one end of the first linear sensor chip 3 is opposed to the substrate 2 and the second linear sensor chip 4 is bonded in a state of being substantially parallel to the long side direction of the first linear sensor chip 3. Has been done. These first,
The opposing ends 31, 41 of the second linear sensor chips 3, 4 are bonded on the substrate 2 with a first resin, for example, an epoxy resin 5. Further, the other ends 32 and 42 of the first and second linear sensor chips 3 and 4 are bonded on the substrate 2 with a second resin, for example, a rubber adhesive 6. Then, the first and second linear sensor chips 3, 4
Are connected to the printed wiring on the substrate 2 (not shown) by the bonding wires 7. This rubber adhesive 6
Is softer than the epoxy resin 5, so expansion and contraction occurring in the first and second linear sensor chips 3 and 4 due to the difference in expansion coefficient between the substrate 2 and the first and second linear sensor chips 3 and 4 is different from each other. Only the ends 32, 42 will be displaced.

As shown in FIG. 2, pixels 33 and 43 are formed on the first and second linear sensor chips 3 and 4 substantially parallel to the long-side direction up to one ends 31 and 41, respectively. And the first linear sensor chip 3 on the substrate 2
End 31 of the second linear sensor chip 4 and one end 41 of the second linear sensor chip 4
Are opposed to each other, and the linear sensor chips 3 and 4 are positioned so that the pitches of the pixels 33 and the pixels 43 are continuous, and the linear sensor chips 3 and 4 are bonded by the epoxy resin 5. As a result, the two linear sensor chips have the same shape as one elongated linear sensor chip.

FIG. 3 is a diagram for explaining another embodiment of the present invention. As shown in FIG. 3, the pixels 33 and 43 on the first and second linear sensor chips 3 and 4 have ends 31 and 4 respectively.
1 is not formed. Therefore, after the second linear sensor chip 4 is displaced in the short side direction of the first linear sensor chip 3, the pitch between the pixel 33 of the first linear sensor chip 3 and the pixel 43 of the second linear sensor chip 4 The first linear sensor chip 3 is moved in the long side direction and positioned so that the two are aligned, and then the first linear sensor chip 3 is bonded onto the substrate 2 with an epoxy resin 5. In this state, the pixel 33 of the first linear sensor chip 3 and the pixel 43 of the second linear sensor chip 4 are displaced in the short side direction, but if this displacement amount is corrected by signal processing, Each of the pixels of the linear sensor chip 3 and the second linear sensor chip 4 of FIG.

Further, since the present invention is composed of two linear sensor chips, it can be used as a longer contact type linear sensor by connecting a plurality of these structures.

[0010]

As described above, according to the contact type linear sensor of the present invention, even if the expansion coefficient of the substrate is different from that of the two linear sensor chips, the linear sensor is affected by expansion / contraction difference due to temperature change or the like. The stress generated in the chip can be relieved, and the linear sensor chip is not deformed, cracked, or the adhesive portion is peeled off. Further, since the two linear sensor chips are not displaced with respect to the substrate, the information of the subject can be read accurately. Therefore, the contact type linear sensor can be designed without considering the difference in expansion coefficient between the substrate and the linear sensor chip. Further, since the linear sensor chip can be manufactured using a wafer of a normal size, cost reduction and yield improvement can be achieved.

[Brief description of drawings]

FIG. 1 is a plan view illustrating the present invention.

FIG. 2 is an enlarged view of opposite ends of the first and second linear sensor chips.

FIG. 3 is a diagram illustrating another embodiment of the present invention.

[Explanation of symbols]

 1 Contact type linear sensor 2 Substrate 3 First linear sensor chip 4 Second linear sensor chip 5 Epoxy resin 6 Rubber adhesive

Claims (1)

[Claims] 1. A first linear sensor chip provided on a substrate, and a second linear sensor chip whose one end faces the first linear sensor chip and which is provided substantially parallel to a long side direction of the first linear sensor chip. Linear sensor chip, a first resin for bonding one end side of the first linear sensor chip and one end side of the second linear sensor chip onto the substrate, and the first and second linear sensors A contact type linear sensor comprising a second resin for adhering each of the other ends of the chips to the substrate, the second resin being softer than the first resin. ..