JPH0547733A - Cleaning method for wafer - Google Patents

Abstract

PURPOSE:To obtain a cleaning method in which dusts are not generated in a simple structure in the method for preventing generation of dusts from a wafer at the time of etching, cleaning in a semiconductor manufacturing step. CONSTITUTION:The cleaning method is so constituted as not to bring cleaning water 3 into contact with an inner wall of a carrier 2 containing a wafer 1, as to splash the wafer 3 from above the wafer 1, that, after the wafer 1 is placed on the carrier 2 and inserted into a washing tank, a shower valve 5 of a water feed tube 4 is moved over the wafer 1 or obliquely over the wafer to operate, that a mounting pitch of the valves 5 is the same as a containing pitch of the wafers 1 in the carrier 2, and further that a blow-off port of the valve 5 is formed in a slender slit shape.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for preventing dust generation from a wafer during etching and cleaning in a semiconductor manufacturing process.

Among the enching and cleaning processes, the dust generated from the wafer during the hydrofluoric acid treatment, and the dust as it is (Part
icle) adheres to the wafer, it is necessary to correct the current situation.

[0003]

2. Description of the Related Art FIG. 3 is an explanatory view of a conventional example. In the figure, 7 is a wafer, 8 is a carrier, 9 is cleaning water, 10 is a water supply pipe, and 11 is a shower valve.

Conventionally, shower rinsing was often not carried out in the rinsing of wafers after hydrofluoric acid treatment. Also, the figure
As shown in Fig. 3, even when washing with shower water, a large amount of dust was generated, and the effect of reducing the amount of dust adhering by the shower was not enhanced.

[0005]

The reason why dust is generated even when shower washing is performed is as follows.
After the cleaning water 9 ejected from the touching carrier 8 once,
Secondly, the shower valve 11 may not hit the wafer 7 evenly because the washing water 9 does not hit the wafer 7 evenly.
It is structurally unreasonable to add many outlets.

In view of the above points, the present invention is provided for the purpose of obtaining a cleaning method which does not generate dust with a simple structure.

[0007]

FIG. 1 illustrates the principle of the present invention. In the figure, 1 is a wafer, 2 is a carrier,
3 is washing water, 4 is a water supply pipe, 5 is a shower valve, and 6 is an outlet.

In order to solve the above-mentioned problems, in the present invention, the shower valve is made movable, the wafer is submerged in the tank and then the valve is moved, and the shower water is washed from a position where water does not hit the carrier.

The pitch of the shower outlet is set to be the same as the pitch of the wafer. That is, an object of the present invention is to wash a wafer from the upper portion of the wafer 1 in the shower type washing method so that the washing water 3 does not hit the inner wall of the carrier 2 accommodating the wafer 1 as shown in FIG. By sprinkling water 3 and after loading the wafer 1 on the carrier 2 and inserting it into the washing tank 4, the shower valve 5 of the water supply pipe 4 moves to the upper part of the wafer 1 or diagonally above, and operates. Alternatively, the mounting pitch of the shower valve 5 is the same as the storage pitch of the wafer 1 with respect to the carrier 2, and further, the outlet 6 of the shower valve 5 has an elongated slit shape. .

[0010]

With the above structure, the shower water hits only the wafer, and all the wafers are uniformly hit with water, so that dust generation from the wafer can be suppressed.

Further, by making the shape of the shower outlet a slit, the amount of water hitting the wafer becomes uniform.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory view of the principle of the present invention, and FIG. 2 is an explanatory view of an embodiment of the present invention. Regarding one embodiment of the present invention,
This will be described with reference to FIGS. Arrows indicate the flow of water.

In FIG. 1, the cleaning water 3 passes through a shower valve 5 of a water supply pipe 4, and the cleaning water 3 blows out on a wafer 1.
A more shower cleaning is shown. As shown in the figure, the outlets 6 of the shower valve 5 are provided one by one between the wafers 1.
If is attached, the wafer 1 is uniformly hit with water.

FIG. 2 (a) is an enlarged sectional view of one of the shower valves 5, and FIGS. 2 (b) and 2 (c) are sectional views of the shower valve 5 cut along the line AA '. Is.

The outlet 6 of the washing water 3 in the cross section of the shower valve 5 may be round or rectangular, and the washing water 3 is blown out from the portion surrounded by the diagonal lines. Table 1 shows a comparison of the number of adhered dust particles on the wafer 1.

[0016]

[Table 1]

The condition A is that the wafer is not shower-cleaned, the condition B is that the shower-cleaning is performed from the side of the carrier, and the condition C is that the shower-cleaning water does not touch the carrier by the method of the present invention. That is the case.

In the table, S is 0.3 μm to 0.5 μm and M is 0.5
μm to 2.0 μm, L is a particle size of dust of 2 μm or more. If you wash the shower without touching the carrier,
It can be seen that the dust generation amount is considerably reduced.

[0019]

As described above, according to the present invention,
The number of dust particles generated from the wafer and adhering to the wafer is reduced.

Also, by performing shower water washing, the efficiency of water washing is improved.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the present invention.

FIG. 2 is an explanatory diagram of an embodiment of the present invention.

FIG. 3 is an explanatory diagram of a conventional example.

[Explanation of symbols]

 1 Wafer 2 Carrier 3 Wash water 4 Water pipe 5 Shower valve 6 Blowout port

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Ken Yamazaki, Inventor Ken Yamazaki, Nakahara-ku, Kawasaki City, Kanagawa 1015, Fujitsu Ltd. Inside i Co., Ltd.

Claims (4)

[Claims] 1. A method of showering a wafer (1), wherein the inner wall of a carrier (2) accommodating the wafer (1) contains cleaning water.
A method for cleaning a wafer, characterized in that the cleaning water (3) is applied from above the wafer (1) so that the wafer (3) is not hit. 2. A shower valve for a water pipe (4) after the wafer (1) is mounted on a carrier (2) and inserted into a washing tank (4).
2. The method for cleaning a wafer according to claim 1, wherein the (5) is moved to operate above the wafer (1) or obliquely above. 3. The wafer cleaning method according to claim 1, wherein the mounting pitch of the shower valve (5) is the same as the storage pitch of the wafer (1) in the carrier (2). .. 4. The method for cleaning a wafer according to claim 1, wherein the outlet of the shower valve (5) has an elongated slit shape.