JPH0547506Y2 - - Google Patents

Info

Publication number

JPH0547506Y2

JPH0547506Y2 JP800089U JP800089U JPH0547506Y2 JP H0547506 Y2 JPH0547506 Y2 JP H0547506Y2 JP 800089 U JP800089 U JP 800089U JP 800089 U JP800089 U JP 800089U JP H0547506 Y2 JPH0547506 Y2 JP H0547506Y2

Authority

JP

Japan

Prior art keywords

wiring board

printed wiring

main body

body case

molded product

Prior art date

1989-01-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

Links

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• 239000011347 resin Substances 0.000 claims description 13
• 229920005989 resin Polymers 0.000 claims description 13
• 125000006850 spacer group Chemical group 0.000 claims description 8
• 229910052751 metal Inorganic materials 0.000 claims description 7
• 239000002184 metal Substances 0.000 claims description 7
• 230000000452 restraining effect Effects 0.000 claims description 4
• 230000000694 effects Effects 0.000 description 4
• 229910052782 aluminium Inorganic materials 0.000 description 2
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
• 238000005452 bending Methods 0.000 description 1
• 239000003990 capacitor Substances 0.000 description 1
• 210000000078 claw Anatomy 0.000 description 1
• 239000004020 conductor Substances 0.000 description 1
• 239000011810 insulating material Substances 0.000 description 1
• 238000009413 insulation Methods 0.000 description 1
• 239000012212 insulator Substances 0.000 description 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 150000002739 metals Chemical class 0.000 description 1
• 238000000034 method Methods 0.000 description 1