JPH0546042U - Semiconductor manufacturing equipment - Google Patents

Abstract

(57) [Summary] [Purpose] To reliably remove dust after dicing at low cost and improve the reliability and productivity of semiconductor chips. [Structure] After dicing a wafer attached to a stretching sheet 21, the chips are separated into chips 22a by stretching the stretching sheet, and the chips 22a are put into an apparatus main body 11 and air is ejected from a high-pressure air nozzle 13. Chip 22a
The dust on the surface was blown off and discharged from the exhaust duct 15. Therefore, efficient dust removal can be performed without using a conventional adhesive sheet for dust removal or the like. Also, dust between the chips can be removed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a dust removing means after dicing a semiconductor wafer.

[0002]

[Prior Art]

 Conventionally, when a semiconductor wafer is cut along a scribe line into semiconductor chips, first, as shown in FIG. 5, a wafer 1 is attached to a plastic film 2 which is a stretching sheet with an adhesive, and a thin diamond that rotates at a high speed. A grindstone (dicing saw) 3 is used to make a kerf along the scribe line 1a of the wafer 1. Next, the stretched ring composed of the inner ring and the outer ring 56 is used from above and below to sandwich the plastic film 2 and separate the wafer 1 having the kerf into the chips 4. This separation occurs because the plastic film 2 is stretched in all directions by mounting the stretch ring on the plastic film 2, so that the wafer is broken at the kerf. Thus, semiconductor dust is generated by the wafer dicing step and the drawing step, and the dust is attached to the surface of each chip 4. As a method of removing such semiconductor dust, as shown in FIG. 7, an operator attaches the adhesive sheet 6 to the surfaces of the chips 4 to 4 and then peels it off.

[0003]

[Problems to be solved by the device]

 However, conventionally, there is a problem in that static electricity is generated due to the peeling off of the pressure-sensitive adhesive sheet 6 and possibly electrostatic breakdown of the chip. In addition, there is a problem that the adhesive of the adhesive sheet 6 adheres to the surface of the chip to contaminate the chip and reduce the reliability of the product. Further, with such an adhesive sheet 6, the dust removal rate on the chip surface was low, and especially the dust present in the dicing groove could not be removed.

On the other hand, in the dicing method, a kerf having a depth of about half the thickness is formed in the wafer, but there is a method called full dicing in which the wafer is completely cut slightly beyond the thickness of the wafer. .. However, if this full dicing method is performed, the generation of dust can be suppressed because there is no step for breaking the wafer, but the adhesive of the plastic sheet 2 causes clogging and the consumption of the dicing saw is 5 to 10 times. In addition to accelerating, the problem arises that it becomes very difficult to control the sheet thickness and maintain the accuracy of the equipment. For this reason, the full dicing method is not preferable in terms of cost because the number of steps is increased.

The present invention has been made in view of such conventional problems, and avoids the use of consumable materials such as an adhesive sheet to reduce the cost, and has a high reliability in chip products. The purpose is to obtain a semiconductor manufacturing apparatus that improves productivity, productivity, and yield.

[0006]

[Means for Solving the Problems]

 Therefore, the present invention provides a means for supporting a semiconductor wafer which is attached on a stretching sheet and diced into a plurality of semiconductor chips, a means for stretching the stretching sheet, and high-pressure air is blown between the chips. Means and means for exhausting dust generated when the high-pressure air is blown are provided as means for solving the problem.

[0007]

[Action]

 By stretching the stretching sheet, the semiconductor wafer is separated into the respective semiconductor chips at the diced portions, and the high pressure air is blown to blow off the dust adhering to the chip surface, and the dust is removed by the exhaust means.

[0008]

【Example】

 Hereinafter, details of a semiconductor manufacturing apparatus according to the present invention will be described based on embodiments shown in the drawings.

As shown in FIG. 1, the apparatus according to the present embodiment is roughly composed of a container-shaped apparatus main body 11 having an open top and a lid 12 for sealing the opening of the apparatus main body 11. ..

A high-pressure air nozzle 13 is provided in the apparatus body 11 so as to be rotatable by a rotation driving means (motor) 14. An exhaust duct 15 is connected to the side wall of the apparatus main body 11 so that the inside of the main body 11 can be exhausted. Further, a flange portion 15 protruding inward is formed on the inner wall of the opening of the apparatus body 11 so as to circulate.

A piston rod 16 a of a lift drive cylinder 16 is attached to one end of the lid 12, and the lid 12 is lifted and lowered along a guide rod 17 which is vertically erected. A sealing member 18 is arranged around the lower surface of the lid portion 12 so that the sealing member 18 abuts the upper end surface of the apparatus main body 11 to maintain airtightness when the lid is closed. ing. A support projecting ridge 12A projecting downward is formed inside the seal member 18 so as to come into contact with a dicing frame 22 (described later) mounted on the flange portion 15 of the apparatus body 11. Is becoming Further, a cylindrical protrusion 12B is formed in the center of the lower surface of the lid 12, and a continuous porous disc 19 is embedded in the lower end surface of the protrusion 12B. An intake passage 12C is communicated with the back surface of the supporting jetty 12A and the disk 19, and the intake passage 12C is connected to a vacuum pump (not shown) via a tube 20.

Here, a chip processed by this apparatus and its jig will be described with reference to FIGS. 2 to 4. First, as shown in FIG. 2, a wafer 22 is attached onto a stretching sheet 21 made of a plastic sheet with an adhesive, and the sheet 21 is fixed to a ring-shaped dicing frame 23. Next, the wafer 22 is half-diced along the scribe line with the dicing saw 24.

Next, as shown in FIG. 3, the inner stretching ring 25 a is pressed from the lower surface side of the stretching sheet 21, and the outer stretching ring 25 b is internally stretched from the upper surface side of the sheet 21 via the sheet 21. By externally fitting the rings 25a, the sheets 21 in these rings are extended outward, and the half-diced wafer 22 is separated into the chips 22a, as shown in FIG.

With the chip 22a thus separated attached, as shown in FIG. 1A, the dicing frame 23 is placed on the flange portion 15 of the apparatus main body 11 with the chip 22a facing downward, and the lid portion 12 is lowered by the operation of the lifting drive cylinder 16 and the apparatus main body 11 is covered.

Next, as shown in FIG. 1 (B), by operating the vacuum pump on the tube 20 side, the supporting jetty 12A on the lid 12 side is brought into close contact with the dicing frame and is also continuous porous. The disk 19 entirely adsorbs the back surface of the stretched sheet 21 to which the chips 22a to 22a are adhered.

Next, while rotating the high-pressure air nozzle 13 by the rotation driving means 14, air from a pneumatic feeder is separately ejected from the nozzle 13 to blow off the dust on the surface of the chip 22a and remove dust from the exhaust dust. Discharge with air. At this time, since the stretched sheet 21 is adsorbed and supported by the disc 19, vibration due to discharge air is prevented.

In this embodiment, the dust can be removed by air even between the chips 22a.

Although the embodiment has been described above, the present invention is not limited to this, and various design changes accompanying the gist of the configuration can be made. For example, in the above embodiment, the stretch ring After the chips 22a were separated by stretching with the use of 25a and 25b, dust was removed with this device. An inner stretching ring 25a was provided on the lower surface of the lid 12 and an outer stretching ring 25b was provided inside the mounting body 11. The lid 12 may be closed and the inner and outer extension rings may be fitted together.

Further, the XY table may be used to drive the high-pressure air nozzle to remove dust while operating in the X and Y directions.

Further, the high-pressure air nozzle may have a disk shape, and the entire chip may be blown uniformly without driving.

[0021]

[Effect of the device]

 As is clear from the above description, according to the present invention, it is possible to reduce the amount of wear material used in the conventional technique and to reduce the number of man-hours.

Further, since the dust can be removed from the chip surface, it is possible to prevent deterioration of reliability due to scratches on the chip surface and surface damage that occur during die bonding, and it is effective in improving the yield of products.

[Brief description of drawings]

FIG. 1A is a sectional view of an embodiment of the present invention in a state where a lid is open, and FIG. 1B is a sectional view in which a lid is closed.

FIG. 2 is a perspective view showing a dicing process.

FIG. 3 is a perspective view showing a stretching process.

FIG. 4 is a perspective view showing a state after stretching.

FIG. 5 is a perspective view of a conventional example.

FIG. 6 is a perspective view of a conventional example.

FIG. 7 is a perspective view of a conventional example.

[Explanation of symbols]

11 ... Device main body, 12 ... Lid part, 13 ... High pressure air nozzle, 15 ... Exhaust dust, 21 ... Stretching sheet, 22a ...
Chips.

Claims (1)

[Scope of utility model registration request] 1. A means for supporting a semiconductor wafer attached on a stretching sheet and diced into a plurality of semiconductor chips, a means for stretching the stretching sheet, and a means for blowing high-pressure air between the chips. A semiconductor manufacturing apparatus comprising means for exhausting dust generated when the high-pressure air is blown.