JPH0544449U - Wire type cutting device - Google Patents

Abstract

(57) [Summary] [Purpose] The cutting fluid is constantly supplied to the cutting edge from below to improve the cutting accuracy and cutting efficiency. [Composition] In a wire-type cutting device for cutting by cutting a work piece by pressing it against a running wire and sliding it, and supplying a working solution containing free abrasive grains to a wire pressing part for cutting. On the other hand, it is sprayed from below and is supplied to the cut portion almost parallel to the wire.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a wire-type cutting device for cutting brittle materials such as semiconductor materials, magnetic materials, and ceramics with a working liquid containing loose abrasive grains and a wire, and more particularly to a cutting device having a feature of supplying the working liquid. It is related.

[0002]

[Prior Art]

 FIGS. 6 and 7 show an example of a conventional apparatus (Japanese Patent Laid-Open No. 61-121870) for cutting brittle materials such as semiconductor materials, magnetic materials and ceramics with a wire-type cutting apparatus. In the example of FIG. 6, the wire 1 is slid while pressing the workpiece 5 to be cut against the wire 1, and a hopper type slit nozzle 12 having a slit-shaped outlet is used, and the slit outlet 18 is cut. The working liquid 3 is supplied and cut while moving along the peripheral surface of the workpiece 5 in parallel with the wire traveling direction to the cut portion.

[0003]

[Problems to be solved by the device]

 In the conventional apparatus, since the working fluid 3 is supplied from above the wire 1, the abrasive grains in the working fluid 3 adhere to the lower portion of the wire 1 due to the formation of cavities in the lower portion of the wire 1 in the flow of the working fluid 3. It is difficult to do this, and uneven adhesion of the abrasive grains occurs at the bottom of the wire. Therefore, it is not possible to supply the abrasive grains uniformly and sufficiently to the sliding part between the wire 1 and the workpiece 5 to be cut, and the processing accuracy of the workpiece 5 to be cut is improved. (Large warpage, generation of saw marks) was bad, leading to a decrease in cutting efficiency. Further, the multi-groove roller 2 is significantly worn, and slide mechanisms 14 to 17 are provided at a portion where the machining liquid 3 is scattered so as to move the hopper type slit nozzle 12 to a position just below the cut in parallel to the wire traveling direction as shown in FIG. However, it was easily worn and deteriorated, and the maintainability was poor.

The present invention has been made in order to solve such a problem, and it is possible to constantly and uniformly supply a working fluid to a necessary place to improve the cutting accuracy and the cutting efficiency. It aims at proposing a simple wire type cutting device.

[0005]

[Means for Solving the Problems]

 The gist of the present invention is that a wire type is used, in which a wire to be cut is processed by supplying a working liquid containing loose abrasive grains to a wire pressing portion while sliding the wire while pressing the wire against the traveling wire of the workpiece. In the cutting device, there is provided a working liquid supply nozzle which enables a working liquid to be supplied to a wire from below, and a wire type cutting device is provided.

[0006]

[Action and Example]

 The features of the present invention will be described in detail with reference to the embodiments shown in FIGS. First, the embodiment of FIG. 1 will be described. The wire 1 passes through the multi-groove roller 2 to cut the workpiece 5, and is wound up by a wire winding reel (not shown). At the time of cutting the work piece, the pressing table 9 on which the work piece 5 to be cut is lifted to press the wire 1 and also to contain loose abrasive grains from the working liquid supply nozzle 4 which is directed to the wire 1 from below. The working fluid 3 is supplied to the wire pressing portion.

As shown in FIG. 3, the discharge pressure of the machining fluid supply nozzle 4 corresponds to the movement amount (: x) of the workpiece to be cut, and the machining fluid 3 is applied to the wire 1 below the cutting edge. So as to be supplied from the processing liquid nozzle, the opening (: a) of the machining liquid nozzle discharge pressure automatic control valve 6 such as an electric valve is controlled.

The number of working liquid supply nozzles 4 is determined by the length of the workpiece 5, and a plurality of working liquid supply nozzles 4 may be arranged. Similarly, the processing liquid nozzle discharge pressure automatic adjustment valve 6 may be plural. Further, although not shown, in order to detect the clogging of the abrasive grains in the machining liquid supply nozzle 4, a machining liquid discharge pressure gauge and a machining fluid flow meter may be provided.

Referring to FIG. 4 and FIG. 5 and FIG. 6 showing examples of experimental results of the present invention, by supplying the working liquid 3 to the cut portion from below with respect to the wire 1 of the present invention, the working accuracy is improved and The function of reducing the wear of the groove roller 2 will be described.

FIG. 4 is a diagram showing that the distribution of the adhering layer of the working fluid 3 supplied to the wire 1, which is confirmed by the experiment, differs depending on the working fluid supply direction. Similarly, when the wire 1 is supplied from below, the working liquid layer becomes thicker in the lower part of the wire 1 that comes into contact with the workpiece, and as a result, the abrasive grains adhere sufficiently to the lower part of the wire and the cutting efficiency is improved. In addition, since the machining liquid layer is thin on the upper portion of the wire 1 that contacts the grooves of all the multi-groove rollers 2, the amount of abrasive grains attached is small, so that the groove wear rate of the multi-groove roller 2 is reduced.

On the other hand, when the wire 1 is supplied from above as in the conventional method shown in FIG. 4 (b), uneven adhesion of abrasive grains occurs at the lower part of the wire 1 in contact with the workpiece 5, The cutting efficiency is deteriorated, and the upper part of the wire 1 contacting the multi-groove roller 2 is supplied with a large amount of the working fluid to increase the adhered amount of abrasive grains, which increases the groove wear rate of the multi-groove roller 2.

FIG. 5 shows an example of the experimental results of the cutting efficiency and the roller groove wear start time with respect to the machining fluid flow rate at the cut end. It can be seen that the present invention has improved cutting efficiency as compared with the conventional method. Further, when the machining fluid flow rate is increased, the machining fluid 3 is also scattered to increase the groove wear rate of the multi-groove roller 2 (the wear start time is shortened), but in the present invention, the discharge pressure of the machining fluid nozzle 4 is changed. By controlling the machining fluid flow rate, the average machining fluid flow rate can be reduced as compared to the conventional method, and as shown in the experimental result example of FIG. 5, the groove wear start time of the multi-groove roller 2 is delayed. Therefore, as shown in Table 1 of the experimental result example of the present invention, it was confirmed that the cutting efficiency is improved without lowering the cutting efficiency as compared with the conventional method.

[0013]

[Table 1]

[0014]

[Effect of the device]

 The cutting device of the present invention can improve the cutting accuracy and the cutting efficiency of the work piece to be cut of brittle material, and also reduce the wear of the groove rollers to reduce the running cost.

[Brief description of drawings]

FIG. 1 is a diagram illustrating an embodiment of the present invention.

FIG. 2 is a top view of a portion in which a working fluid 3 is supplied to the workpiece 5 to be cut in FIG.

FIG. 3 is a view for explaining an embodiment in which the discharge pressure of the machining liquid nozzle is adjusted according to the cutting position of the present invention.

FIG. 4 is a view for explaining the operation of the present invention.

FIG. 5 is a diagram illustrating an example of an experimental result of the present invention.

FIG. 6 is a diagram illustrating a conventional method.

FIG. 7 is a diagram illustrating a method of moving a conventional hopper type slit nozzle.

[Explanation of symbols] 1 wire 2 multi-groove roller 3 machining fluid 4 machining fluid supply nozzle 5 workpiece to be cut 6 machining fluid flow rate automatic adjustment valve 7 machining fluid supply pump 8 machining fluid tank 9 push up table 10 cutting position detector 11 machining Liquid flow rate controller 12 Hopper type slit nozzle 13 Nozzle 14 Motor 15 Support jig 16 Ball screw 17 Slide guide 18 Slit-shaped outlet

Claims (1)

[Scope of utility model registration request] 1. A wire-type cutting device for sliding while pressing a wire against a wire running through a workpiece to be cut, and supplying a working liquid containing free abrasive grains to a wire pressing portion to perform a cutting process. A wire-type cutting device provided with a working liquid supply nozzle that enables a working liquid to be supplied to a wire from below.