JPH091452A - Wire type cutting-off method and apparatus therefor - Google Patents

Wire type cutting-off method and apparatus therefor

Info

Publication number
JPH091452A
JPH091452A JP14915595A JP14915595A JPH091452A JP H091452 A JPH091452 A JP H091452A JP 14915595 A JP14915595 A JP 14915595A JP 14915595 A JP14915595 A JP 14915595A JP H091452 A JPH091452 A JP H091452A
Authority
JP
Japan
Prior art keywords
wire
cut
workpiece
cutting
type cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14915595A
Other languages
Japanese (ja)
Other versions
JP2991083B2 (en
Inventor
Shoji Masuyama
尚司 増山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP14915595A priority Critical patent/JP2991083B2/en
Publication of JPH091452A publication Critical patent/JPH091452A/en
Application granted granted Critical
Publication of JP2991083B2 publication Critical patent/JP2991083B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007Use, recovery or regeneration of abrasive mediums

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

PURPOSE: To provide a wire type cutting-off method and apparatus therefor capable of uniformly supplying working liquid to a portion against which a wire is pressed to improve the working accuracy irrespective of the shape of a cut-off workpiece. CONSTITUTION: In a cutting-off method wherein wires 1 wound around a plurality of grooved rollers 2 located at predetermined intervals are allowed to travel and a cut-off workpiece 3 is pressed against the wires 1 for cutting-off, working liquid 5 containing isolated grinding grains is sprayed to the wires 1 and cut-off the workpiece 3.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ワイヤ式切断方法及び
切断装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire type cutting method and a cutting apparatus.

【0002】[0002]

【従来の技術】従来より、半導体材料、磁性材料、セラ
ミック材料等の脆性材料を切断するために、図2に示す
ようなワイヤ式切断装置が用いられている。
2. Description of the Related Art Conventionally, a wire type cutting apparatus as shown in FIG. 2 has been used for cutting brittle materials such as semiconductor materials, magnetic materials and ceramic materials.

【0003】図示するように、この装置は、3本のロ−
ラ22と、このローラに巻回された複数のワイヤ21
と、ワイヤ21で囲まれる装置中央付近に設けられ、遊
離研粒を含む加工液25をワイヤ21及び被切断加工物
にシャワー状に供給するシャワーノズル24とから構成
されている。
As shown in the figure, this device has three rolls.
22 and a plurality of wires 21 wound around this roller
And a shower nozzle 24 provided in the vicinity of the center of the apparatus surrounded by the wire 21 and supplying a working liquid 25 containing free abrasive grains to the wire 21 and the workpiece to be cut in a shower shape.

【0004】この装置で被切断加工物23を切断するに
は、ローラ22を回転させることによりワイヤ走行さ
せ、シャワーノズル24から加工液25を被切断加工物
23及びワイヤ21に対してシャワー状に供給しなが
ら、被切断加工物23をワイヤ21に押し当て、切断を
行っていた。
In order to cut the work 23 to be cut with this apparatus, the roller 22 is rotated to run the wire, and the machining liquid 25 is showered from the shower nozzle 24 to the work 23 and the wire 21 to be cut. While being supplied, the workpiece 23 was pressed against the wire 21 to perform the cutting.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上記装
置及び方法では加工液をシャワー状、線状、又は帯状に
供給しているため、加工液は被切断加工物の表面及び切
断面を伝わり流れ落ちてしまう。従って加工液の流れは
被切断加工物の形状に左右される。
However, in the above apparatus and method, the working fluid is supplied in a shower shape, a linear shape, or a strip shape, so that the working fluid travels down the surface and the cut surface of the workpiece to be cut and flows down. I will end up. Therefore, the flow of the working fluid depends on the shape of the workpiece to be cut.

【0006】このため、ワイヤが押し付けられている部
分に入り込む遊離研粒の量(加工液の流量)は場所によ
って異なりバラツキが生じたり、加工液がワイヤに均一
に付着しないで、所々流れ落ちてしまうためムラが生じ
ていた。このため、被切断加工物の加工精度を低下させ
てしまうという問題があった。
For this reason, the amount of free abrasive particles (flow rate of the working fluid) entering the portion where the wire is pressed differs depending on the location, and the working fluid does not uniformly adhere to the wire and flows off in places. Therefore, unevenness occurred. Therefore, there is a problem that the processing accuracy of the workpiece to be cut is reduced.

【0007】そこで、本発明の目的は、上記課題を解決
し、被切断加工物の形状に拘らず、ワイヤが押し付けら
れている部分に加工液が均一に供給でき、加工精度の高
いワイヤ式切断方法及び切断装置を提供することにあ
る。
Therefore, an object of the present invention is to solve the above-mentioned problems, and regardless of the shape of the workpiece to be cut, the working fluid can be uniformly supplied to the portion where the wire is pressed, and the wire-type cutting with high working accuracy is achieved. A method and a cutting device are provided.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
に本発明は、所定の間隔に位置する複数の溝付きロ−ラ
に巻回されたワイヤを走行させ、被切断加工物を上記ワ
イヤに押し付けて切断する方法において、遊離研粒を含
む加工液をワイヤ及び被切断加工物に対して霧状に噴射
しながら切断するものである。
SUMMARY OF THE INVENTION To achieve the above object, the present invention runs a wire wound around a plurality of grooved rollers located at predetermined intervals, and cuts a workpiece to be cut into the wire. In the method of pressing by pressing against, the cutting fluid is cut while spraying a working liquid containing free abrasives to the wire and the work to be cut in a mist state.

【0009】また、所定の間隔に位置する複数の溝付き
ロ−ラと、これらロ−ラに巻回するワイヤとにより被切
断加工物を切断するワイヤ式切断装置において、遊離研
粒を含む加工液を噴射ノズルによって霧状に噴射する加
工液噴射手段を設けたものである。
Further, in a wire type cutting device for cutting a work to be cut by a plurality of grooved rollers positioned at predetermined intervals and a wire wound around these rollers, a processing including free abrasives Machining liquid ejecting means for ejecting the liquid in a mist state by the ejection nozzle is provided.

【0010】[0010]

【作用】上記構成によれば、被切断加工物に対して加工
液を霧状に噴射することができるため、被切断加工物の
形状に拘らず常に加工液を均一に供給でき、ワイヤに流
れ落ちないよう均一に付着させることができる。よっ
て、加工精度を向上させることができる。
According to the above construction, the working liquid can be sprayed in a mist state on the work to be cut, so that the working liquid can always be supplied uniformly regardless of the shape of the work to be cut and run down onto the wire. It can be applied uniformly so that it does not exist. Therefore, the processing accuracy can be improved.

【0011】[0011]

【実施例】以下、本発明の一実施例を添付図面に基づい
て詳述する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the accompanying drawings.

【0012】まず、本発明の方法を実施する装置を説明
する。
First, an apparatus for carrying out the method of the present invention will be described.

【0013】図1に示すように、この装置は、3本のロ
−ラ2と、このローラ2に巻回された複数のワイヤ1
と、遊離研粒を含む加工液5をワイヤ1及び被切断加工
物3の切断部分に霧状に噴射する噴霧ノズル6とから構
成されている。
As shown in FIG. 1, this device comprises three rollers 2 and a plurality of wires 1 wound around the rollers 2.
And a spray nozzle 6 for spraying the working liquid 5 containing free-abrasive grains in a mist state on the cut portion of the wire 1 and the workpiece 3 to be cut.

【0014】ここで、上記ローラ2はその表面に複数本
の溝(図示せず)を有し、所望の回転数で回動できるよ
うアクチュエータが設けられている。また、ワイヤは、
被切断加工物3から切り出す切断加工物の厚さに対応す
る間隔で溝内に配置されている。
Here, the roller 2 has a plurality of grooves (not shown) on the surface thereof, and an actuator is provided so that it can rotate at a desired rotation speed. Also, the wire is
The grooves are arranged in the groove at intervals corresponding to the thickness of the cut workpiece cut out from the cut workpiece 3.

【0015】このためアクチュエータを作動することに
より、ローラ2を回転させて、ワイヤ1を走行させるこ
とができる。
Therefore, by operating the actuator, the roller 2 can be rotated and the wire 1 can be run.

【0016】更に、上記噴霧ノズル6は、パイプ7及び
ポンプ8を介して外部にある加工液5が充填されたタン
ク9に連結されている。従って、ポンプ8により所望の
圧力がパイプ7中の加工液5に加えられ、噴霧ノズル6
から流出する加工液5を霧状に噴射することができる。
Further, the spray nozzle 6 is connected via a pipe 7 and a pump 8 to a tank 9 filled with the working fluid 5 located outside. Therefore, a desired pressure is applied to the working fluid 5 in the pipe 7 by the pump 8, and the spray nozzle 6
The machining fluid 5 flowing out of the can be sprayed in a mist state.

【0017】次に、上記装置により本発明の方法を実施
する。
Next, the method of the present invention is carried out by the above apparatus.

【0018】まず、被切断加工物3に応じた所望の回転
数でロ−ラ2が回動するようアクチェータを作動させ
て、ワイヤ1を走行させる。
First, the actuator 1 is operated so that the roller 2 rotates at a desired rotation speed according to the workpiece 3, and the wire 1 is run.

【0019】次に、加工液5を噴霧ノズル6よりワイヤ
1及び被切断加工物3に対して霧状に噴射する。このと
きポンプ8が加工液5に与える圧力は、噴霧ノズル6か
ら流出した場合に霧状になるよう設定されている。加工
液5の噴射を行いながら、所定の力で被切断加工物3を
ワイヤ1に押し付けることにより被切断加工物3を切断
する。
Next, the working liquid 5 is sprayed from the spray nozzle 6 onto the wire 1 and the workpiece 3 to be cut. At this time, the pressure applied to the working liquid 5 by the pump 8 is set so as to become a mist when flowing out from the spray nozzle 6. The workpiece 3 is cut by pressing the workpiece 3 against the wire 1 with a predetermined force while jetting the processing liquid 5.

【0020】上記方法によれば、加工液5を霧状に噴射
するため、被切断加工物3に対して均一に加工液5を供
給することができると共に、ワイヤ1に流れ落ちない程
度に均一に加工液5を付着させることができるため、被
切断加工物3とワイヤ1の間に遊離研粒を均一かつ十分
に供給する・引き込むことができる。よって、被切断加
工物を精度よく切断加工することができる。
According to the above method, since the machining liquid 5 is sprayed in the form of mist, the machining liquid 5 can be uniformly supplied to the work piece 3 to be cut, and the machining liquid 5 can be evenly supplied so as not to flow down to the wire 1. Since the processing liquid 5 can be attached, the loose abrasive grains can be uniformly and sufficiently supplied / drawn between the workpiece 3 to be cut and the wire 1. Therefore, the work to be cut can be cut accurately.

【0021】また、従来のように大量の加工液を垂れ流
す必要がないため、加工液の消費を大幅に減らすことが
できる。また、従来のシャワーノズルのように被切断加
工物と同等の大きさにする必要がないため、省スペース
化が図れる。
Further, since it is not necessary to drain a large amount of working fluid as in the conventional case, consumption of the working fluid can be greatly reduced. Further, unlike the conventional shower nozzle, it is not necessary to make the size equal to that of the workpiece, so that the space can be saved.

【0022】その他の実施例を述べる。Another embodiment will be described.

【0023】上記実施例においては、加工液をワイヤと
被切断加工物の両方に噴射したが、ワイヤのみに噴射し
て、被切断加工物とワイヤの間に遊離研粒を供給しても
よい。
In the above embodiment, the working fluid was jetted to both the wire and the work piece to be cut, but it may be jetted only to the wire to supply the loose abrasive grains between the work piece and the wire. .

【0024】また、本発明は加工液の供給を重力落下に
頼らないため、噴霧ノズルを被切断加工物の上方だけで
はなく、各方位に設けてもよい。
Further, in the present invention, since the supply of the working fluid does not depend on the gravity fall, the spray nozzle may be provided not only above the workpiece to be cut but also in each direction.

【0025】更に、噴霧ノズルは複数個設けてもよく、
この場合、遊離研粒をより十分に供給できるため、さら
なる加工精度の向上が期待できる。
Further, a plurality of spray nozzles may be provided,
In this case, since the free-abrasive grains can be supplied more sufficiently, further improvement in processing accuracy can be expected.

【0026】[0026]

【発明の効果】以上要するに本発明によれば、被切断加
工物に対して加工液を霧状に噴射することができるた
め、被切断加工物の形状に拘らず常に加工液を均一に供
給でき、ワイヤに流れ落ちないよう均一に付着させるこ
とが可能である。よって、研粒が切断部に十分に供給さ
れ、加工精度の向上が可能となる。
In summary, according to the present invention, since the working liquid can be sprayed in a mist state to the work piece to be cut, the working liquid can be always supplied uniformly regardless of the shape of the work piece to be cut. It is possible to evenly attach the wire so that it does not run down. Therefore, the abrasive grains are sufficiently supplied to the cutting portion, and the processing accuracy can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のワイヤ式切断装置の一実施例を示す斜
視図である。
FIG. 1 is a perspective view showing an embodiment of a wire type cutting device of the present invention.

【図2】従来のワイヤ式切断装置の一実施例を示す斜視
図である。
FIG. 2 is a perspective view showing an example of a conventional wire-type cutting device.

【符号の説明】[Explanation of symbols]

1 ワイヤ 2 溝付きロ−ラ 3 被切断加工物 5 加工液 6 噴霧ノズル 1 Wire 2 Roller with Groove 3 Workpiece to be Cut 5 Working Liquid 6 Spray Nozzle

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 所定の間隔に位置する複数の溝付きロ−
ラに巻回されたワイヤを走行させ、被切断加工物を上記
ワイヤに押し付けて切断する方法において、遊離研粒を
含む加工液をワイヤ及び被切断加工物に対して霧状に噴
射しながら切断することを特徴とするワイヤ式切断方
法。
1. A plurality of grooved rollers located at predetermined intervals.
In the method of running the wire wound around the wire and pressing the work to be cut against the above wire, cutting is performed while spraying a working liquid containing free abrasives on the wire and the work to be cut. A wire-type cutting method comprising:
【請求項2】 所定の間隔に位置する複数の溝付きロ−
ラと、これらロ−ラに巻回するワイヤとにより被切断加
工物を切断するワイヤ式切断装置において、遊離研粒を
含む加工液を噴射ノズルによって霧状に噴射する加工液
噴射手段を設けたことを特徴とするワイヤ式切断装置。
2. A plurality of grooved rollers located at predetermined intervals.
In a wire-type cutting device for cutting a workpiece to be cut by a la and a wire wound around these rollers, a machining liquid ejecting means for ejecting a machining liquid containing free abrasive grains into a mist by an injection nozzle is provided. A wire-type cutting device characterized in that
JP14915595A 1995-06-15 1995-06-15 Wire type cutting method and cutting device Expired - Fee Related JP2991083B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14915595A JP2991083B2 (en) 1995-06-15 1995-06-15 Wire type cutting method and cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14915595A JP2991083B2 (en) 1995-06-15 1995-06-15 Wire type cutting method and cutting device

Publications (2)

Publication Number Publication Date
JPH091452A true JPH091452A (en) 1997-01-07
JP2991083B2 JP2991083B2 (en) 1999-12-20

Family

ID=15468998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14915595A Expired - Fee Related JP2991083B2 (en) 1995-06-15 1995-06-15 Wire type cutting method and cutting device

Country Status (1)

Country Link
JP (1) JP2991083B2 (en)

Also Published As

Publication number Publication date
JP2991083B2 (en) 1999-12-20

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