JPH0543486Y2 - - Google Patents

Info

Publication number
JPH0543486Y2
JPH0543486Y2 JP1987160139U JP16013987U JPH0543486Y2 JP H0543486 Y2 JPH0543486 Y2 JP H0543486Y2 JP 1987160139 U JP1987160139 U JP 1987160139U JP 16013987 U JP16013987 U JP 16013987U JP H0543486 Y2 JPH0543486 Y2 JP H0543486Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
hole
circuit board
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987160139U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0165147U (US06566495-20030520-M00011.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987160139U priority Critical patent/JPH0543486Y2/ja
Publication of JPH0165147U publication Critical patent/JPH0165147U/ja
Application granted granted Critical
Publication of JPH0543486Y2 publication Critical patent/JPH0543486Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987160139U 1987-10-20 1987-10-20 Expired - Lifetime JPH0543486Y2 (US06566495-20030520-M00011.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987160139U JPH0543486Y2 (US06566495-20030520-M00011.png) 1987-10-20 1987-10-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987160139U JPH0543486Y2 (US06566495-20030520-M00011.png) 1987-10-20 1987-10-20

Publications (2)

Publication Number Publication Date
JPH0165147U JPH0165147U (US06566495-20030520-M00011.png) 1989-04-26
JPH0543486Y2 true JPH0543486Y2 (US06566495-20030520-M00011.png) 1993-11-02

Family

ID=31441945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987160139U Expired - Lifetime JPH0543486Y2 (US06566495-20030520-M00011.png) 1987-10-20 1987-10-20

Country Status (1)

Country Link
JP (1) JPH0543486Y2 (US06566495-20030520-M00011.png)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036347A (US06566495-20030520-M00011.png) * 1973-08-03 1975-04-05
JPS5535813U (US06566495-20030520-M00011.png) * 1978-08-29 1980-03-07

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036347A (US06566495-20030520-M00011.png) * 1973-08-03 1975-04-05
JPS5535813U (US06566495-20030520-M00011.png) * 1978-08-29 1980-03-07

Also Published As

Publication number Publication date
JPH0165147U (US06566495-20030520-M00011.png) 1989-04-26

Similar Documents

Publication Publication Date Title
JPH0543486Y2 (US06566495-20030520-M00011.png)
JPS5973869A (ja) 電気コネクタ−
JP2578530Y2 (ja) 端子接続構造
JPH0536296Y2 (US06566495-20030520-M00011.png)
JPH1084183A (ja) 表面実装素子のはんだ付用治具
JPH06268086A (ja) 半導体集積回路装置およびそれが装着されるプリント基板
JPH051597B2 (US06566495-20030520-M00011.png)
JPS63244658A (ja) 半導体装置
JPH0451484Y2 (US06566495-20030520-M00011.png)
JPH0410618Y2 (US06566495-20030520-M00011.png)
JPS63248155A (ja) 半導体装置
JP2530783Y2 (ja) チップ部品の実装構造
JPH09190952A (ja) 電子部品
JPH0414914Y2 (US06566495-20030520-M00011.png)
JPS5935956Y2 (ja) セラミツク基板との接続タ−ミナル
JPS6292342A (ja) 表面実装用半導体パツケ−ジ
JPS62261129A (ja) 電子部品の実装体
JP2674394B2 (ja) テープキャリアパッケージ実装装置
JPS6244556Y2 (US06566495-20030520-M00011.png)
JPH0287654A (ja) 表面実装型半導体装置
JP2736553B2 (ja) 混成集積回路
JPS60149176U (ja) プリント回路板の接続構造
JPH0421257Y2 (US06566495-20030520-M00011.png)
JPH0615269U (ja) 混成集積回路装置用リードアレイ
JPH0414857A (ja) 電子部品のリード端子構造