JPH0543475Y2 - - Google Patents
Info
- Publication number
- JPH0543475Y2 JPH0543475Y2 JP11147087U JP11147087U JPH0543475Y2 JP H0543475 Y2 JPH0543475 Y2 JP H0543475Y2 JP 11147087 U JP11147087 U JP 11147087U JP 11147087 U JP11147087 U JP 11147087U JP H0543475 Y2 JPH0543475 Y2 JP H0543475Y2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- lead frame
- lower mold
- gauge
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 239000008188 pellet Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11147087U JPH0543475Y2 (US20020095090A1-20020718-M00002.png) | 1987-07-20 | 1987-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11147087U JPH0543475Y2 (US20020095090A1-20020718-M00002.png) | 1987-07-20 | 1987-07-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6416635U JPS6416635U (US20020095090A1-20020718-M00002.png) | 1989-01-27 |
| JPH0543475Y2 true JPH0543475Y2 (US20020095090A1-20020718-M00002.png) | 1993-11-02 |
Family
ID=31349543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11147087U Expired - Lifetime JPH0543475Y2 (US20020095090A1-20020718-M00002.png) | 1987-07-20 | 1987-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543475Y2 (US20020095090A1-20020718-M00002.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11107746B2 (en) | 2016-02-09 | 2021-08-31 | Mitsubishi Electric Corporation | Power semiconductor apparatus and manufacturing method therefor |
-
1987
- 1987-07-20 JP JP11147087U patent/JPH0543475Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11107746B2 (en) | 2016-02-09 | 2021-08-31 | Mitsubishi Electric Corporation | Power semiconductor apparatus and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6416635U (US20020095090A1-20020718-M00002.png) | 1989-01-27 |
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