JPH0543278Y2 - - Google Patents
Info
- Publication number
- JPH0543278Y2 JPH0543278Y2 JP1988048701U JP4870188U JPH0543278Y2 JP H0543278 Y2 JPH0543278 Y2 JP H0543278Y2 JP 1988048701 U JP1988048701 U JP 1988048701U JP 4870188 U JP4870188 U JP 4870188U JP H0543278 Y2 JPH0543278 Y2 JP H0543278Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- resin block
- guides
- attachment
- mutual spacing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 25
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- 238000001514 detection method Methods 0.000 description 12
- 238000005476 soldering Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988048701U JPH0543278Y2 (de) | 1988-04-11 | 1988-04-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988048701U JPH0543278Y2 (de) | 1988-04-11 | 1988-04-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01152095U JPH01152095U (de) | 1989-10-19 |
JPH0543278Y2 true JPH0543278Y2 (de) | 1993-10-29 |
Family
ID=31274836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988048701U Expired - Lifetime JPH0543278Y2 (de) | 1988-04-11 | 1988-04-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0543278Y2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6379451B2 (ja) * | 2012-12-20 | 2018-08-29 | アイシン精機株式会社 | 電流センサの製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4892878A (de) * | 1972-03-09 | 1973-12-01 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62201965U (de) * | 1986-06-13 | 1987-12-23 |
-
1988
- 1988-04-11 JP JP1988048701U patent/JPH0543278Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4892878A (de) * | 1972-03-09 | 1973-12-01 |
Also Published As
Publication number | Publication date |
---|---|
JPH01152095U (de) | 1989-10-19 |
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