JPH0543278Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) This invention relates to an attachment for mounting electronic components used in fan devices of air conditioners and the like.

(Prior Art) In recent years, as disclosed in, for example, Japanese Utility Model Application Publication No. 178095/1983, the size of the device has been reduced by configuring the rotor of a DC brushless motor to be directly connected to the side plate of the fan rotor. Attempts are being made. This brushless motor requires a control circuit to form a rotating magnetic field on the stator side. Rotation control using this type of control circuit detects the rotational position of the rotor and periodically controls the energization of the coils on the stator side according to the detection signal. It is detected by a magnetic field detection element such as a Hall element placed close to the magnetic field. Therefore, when mounting the magnetic field detecting element on the circuit board constituting the control circuit, high accuracy is required for the positional accuracy of the magnetic field detecting element after mounting.

Conventionally, magnetic field detection elements have been supported in a predetermined position by lead wires soldered to the lands of the circuit board, and the positional accuracy in terms of height and phase relative to the rotor is maintained by the supporting force of the lead wires themselves. was. When mounting the magnetic field detection element on a circuit board, insert the lead wire into the lead wire insertion hole of the circuit board, hold the magnetic field detection element in your hand, and set the installation height and phase at the determined position. The required positional accuracy was ensured by soldering the lead wires to the lands of the circuit board. Furthermore, since it is difficult to automate soldering work, it is necessary to solder by hand.

(Problem to be solved by the invention) However, if the positional accuracy of the magnetic field detection element is maintained by the supporting force of the lead wire itself as in the past, the positional accuracy may be deteriorated due to unavoidable factors such as vibration. There are problems in that the quality and performance of the control circuit are likely to vary.

In addition, mounting work that involves manual positioning and soldering of magnetic field detection elements not only increases the number of work hours and reduces work efficiency, leading to increased costs, but also makes the work itself difficult and difficult to ensure high positional accuracy. There is a problem in that the work requires a high degree of skill.

This idea was created in view of the above problems, and it is possible to maintain the positional accuracy of electronic components such as magnetic field detection elements in a state where distortions due to unavoidable factors such as vibrations are less likely to occur, and moreover, it reduces the mounting work. An object of the present invention is to provide an attachment for mounting an electronic component, which can be easily and accurately soldered with a small number of man-hours, and which enables automatic soldering of lead wires.

(Means for Solving the Problems) Therefore, the attachment for mounting an electronic component according to the first claim is an attachment for mounting an electronic component such as a Hall element H on a circuit board 100, and the end surface is attached to the circuit board 100. A plurality of guides 3 respectively corresponding to the plurality of lead wires 51 of the electronic component are extended in the height direction of the insulating resin block 2, which is seated on the insulating resin block 2.
The mutual spacing of the resin block 2 is set in accordance with the mutual spacing P ₄ of the plurality of lead wires 51 of the electronic component on the one end surface 2b of the resin block 2.
On the other end surface 2a, the lead wire insertion holes formed in the circuit board 100 are set to have a mutual spacing _P3 different from the mutual spacing _P4 , and the guide 3 has an opening in the side surface of the resin block 2. It is characterized in that the grooves 5 are arranged so as to alternately open to opposite side surfaces.

Furthermore, in the electronic component mounting attachment according to the second aspect, the guide 3 is formed of a through hole 6 drilled in the resin block 2 instead of the groove 5.

(Function) When the attachment according to the first and second claims is used, each of the plurality of lead wires 51 of the electronic component can be smoothly passed along the other end surface 2b of the resin block 2 by the plurality of guides 3 without bending. ,
The guide 3 is bent at an intermediate position, and the leads are arranged at one end surface 2a of the resin block 2 at the same interval as the mutual interval P ₄ of the lead wire insertion holes of the circuit board 100.
The lead wire 51 can be easily inserted into the insertion hole.
Then, one end surface 2a of the resin block 2 is connected to the circuit board 1.
00, the positional accuracy of the electronic component in the height direction is accurately determined. Since the electronic component mounted in this manner is supported by the attachment, the positional accuracy of the electronic component is reliably maintained at the accuracy immediately after mounting.

Moreover, in addition to the above, the attachment of the first claim facilitates the molding operation and can be constructed at low cost, and the attachment of the second claim can maintain good insulation properties. .

(Embodiment) Figures 1 to 4 show an attachment 1 according to an embodiment of this invention. This attachment is used for a Hall element as a magnetic field detection element, which is an example of an electronic component.A number of guides 3 corresponding to the number of lead wires of the Hall element are attached to an insulating resin block 2 in the total height direction. It is extended over a period of time. The resin block 2 is formed into a flat shape in plan view similar to the shape of the Hall element in plan view, and has a narrow neck portion 4 at its upper end, and one end surface 2a and the other end surface 2b are flat surfaces. It's getting old. In this embodiment, the guide 3 consists of two grooves 5 formed on each side of the resin block 2, and these grooves 5 are arranged so that the bottoms of the grooves 5 are aligned in a straight line at the center of the resin block 2 in the thickness direction. They are arranged alternately on one side and the other side in the width direction of the resin block 2. These grooves 5, that is, the plurality of guides 3
are formed in straight lines that maintain a parallel state near one end surface 2a of the resin block 2, and are formed in straight lines in which the distance between them narrows as they approach the other end surface 2b at other locations. The mutual spacing P ₁ of the guides 3 on the one end surface 2a is the distance between each of the lead wire insertion holes Ha, Hb, and Hc (see FIG. 12) formed in the circuit board 100 shown in FIG. 11. The mutual spacing P ₃ of the guides 3 on the other end surface 2b is set to be the same as the mutual spacing P 3 , and the mutual spacing P ₂ of the guides 3 on the other end surface 2b is set to the same dimension as the mutual spacing P 3 .
The dimension is set to be the same as the mutual spacing P ₄ of the plurality of lead wires 51 arranged horizontally in the Hall element H shown in the figure. For example, if the mutual spacing between the lead wire insertion holes Ha, Hb, and Hc of the circuit board 100 is 2.5 mm, the mutual spacing P ₁ of the guides 3 on the one end surface 2a is set to 2.5 mm, and the Hall element H If the mutual spacing of the lead wires 51 is 1.0 mm, the mutual spacing P ₂ of the guides 3 at the other end surface 2b is
Set to 1.0mm.

FIG. 8 shows an example in which the Hall element H is mounted on the circuit board 100 using the attachment 1. As shown in the figure, the lead wire 51 of the Hall element H
... are individually fitted into the guides 3 of the attachment 1, so that their base portions and middle portions are bent into shapes that follow the corresponding guides 3. The tip of each lead wire 51 is connected to the lead wire insertion hole 110 of the circuit board 100.
It is soldered to the land of the wiring pattern while being inserted into... 120 indicates solder. Further, one end surface 2a of the attachment 1 is connected to the circuit board 1.
00, while the other end is held in a holding hole 210 of an end bracket 200 (described later) which is disposed opposite to the circuit board 100 with a gap therebetween. Further, the flat lower surface of the Hall element H is brought into contact with the other end surface 2b of the attachment 1.

The height position of the Hall element H mounted on the circuit board 100 is determined with high precision by the height of the attachment 1, and the horizontal position (phase)
is determined with high precision by the horizontal position of the attachment 1 held in the holding hole 210, and the Hall element H is held by the attachment 1 stably supported by the circuit board 100 and the end bracket 200. Because of this, even if an external force such as vibration is applied, the positional accuracy will not easily deteriorate. In particular, if overhanging pieces 52 are formed at predetermined locations of the lead wires 51 of the Hall element H as shown in FIG. 9, these overhanging pieces 52 will be connected to the guides 3 as shown in FIG. Since the hole element H engages with the wall surface in a biting manner, there is an advantage that the mounting state of the Hall element H is further stabilized. Another advantage is that the attachment 1 reliably insulates the lead wires 51 and the end bracket 200.

To explain an example of the procedure for mounting the Hall element H on the circuit board 100, first, connect the lead wires 51 of the Hall element H to one end surface 2b of the attachment 1.
The tips of the lead wires 51 are guided to the other end surface 2a side of the attachment 1 by inserting them through the guides 3 from the side, and then the tips of the lead wires 51 are inserted into the lead wire insertion holes 110 of the circuit board 100.
Insert it into the machine and solder using an automatic machine or by hand. Instead of inserting the lead wires 51 through the guides 3, the respective lead wires 51 may be fitted into the guides 3 from one side or the other side of the attachment 1. Here, one end surface 2 of the attachment 1
The mutual spacing P ₁ (see FIG. 4) between the guides 3 at point a is the same as the mutual spacing P ₃ (see FIG. 12) between the lead wire insertion holes 110 on the circuit board 100, and the distance between the lead wires 51... Since the tips are parallel to each other,
The tip of the lead wire 51 is inserted into the lead wire insertion hole 1.
10... is easy to insert. On the other hand, since the mutual distance P ₂ (see FIG. 4) between the guides 3 on the other end surface 2b of the attachment 1 is the same as the mutual distance P ₄ between the lead wires 51 of the Hall element H (see FIG. 10), It is also easy to insert the lead wires 51 into the guides 3. In addition, if the lead wires 51 of the Hall element H are irregularly bent,
By inserting the lead wire 51 into the guide 3 or fitting the lead wire 51 into the guide 3...
... is corrected to a shape that follows the guide 3 ..., so there is no problem with the mount.

5 to 7 show an attachment 1 according to another embodiment. This attachment 1 differs from the one shown in FIGS. 1 to 4 in that the guides 3 are formed by through holes 6. When the guides 3 are formed by the through-holes 6 in this manner, it is preferable to mold the resin block 2 into two halves in the thickness direction, for example, and to join these halves. Other configurations and operations are the same as those described with reference to FIGS. 1 to 4 and FIG. 8, so in order to avoid duplication of explanation, the same or corresponding parts will be given the same reference numerals and the explanation will be omitted. This embodiment has the advantage of being able to maintain good insulation, but from the viewpoint of manufacturing costs, only one molding operation is required and no bonding operation is required.
The example is better.

FIG. 11 shows a DC brushless motor M as a drive section of a cross flow fan in an indoor unit of an air conditioner. This motor M has a fixed shaft 11 provided at the axial center position of an end bracket 200, a stator 12 is fixed to this fixed shaft 11, and a rotor 13 surrounded by the stator 12 supports a bearing 14 provided on the fixed shaft 11. It is rotatably supported through. Note that a side plate (not shown) provided on a fan rotor of a cross flow fan is connected to the rotor 13.

As shown in FIGS. 13 and 14, the end bracket 200 has a substantially square shape when viewed from the front, and a support hole 220 for the fixed shaft 11 is provided in the center thereof, and the above-mentioned holding hole 220 is provided at an appropriate position in the peripheral portion. A hole 210 is provided. Further, the peripheral wall 230 is provided with an opening 231 and a notched recessed hole 232. Further, a circuit board 100 disposed inside the end bracket 200 is shown in FIG. This circuit board 100 has lead wire insertion holes into which the lead wires 51 of the Hall elements H are inserted.
The required number of Ha, Hb, and Hc have been set up in appropriate locations around the area. These lead wire insertion holes
Ha, Hb, and Hc correspond to the lead wire insertion holes 110 described in FIG. 8. Using the above attachment 1, place the circuit board 10 in the state shown in FIG.
The Hall element H mounted at 0 faces the inside of the rotor 13 through an opening 13a formed on the back surface of the rotor 13 as shown in FIG. 11, and the rotational position of the rotor 13 can be detected in this state. It is becoming possible to do this. Note that power transistors Q ₁ to _{Q 6} are mounted on the circuit board 100. Since these power transistors Q ₁ to _{Q 6} are heat generating elements, they are placed on the circuit board 100 to increase the cooling effect.
The recessed hole 2 of the end bracket 200 is located around the
32 and near the opening 231.

(Effect of the invention) As described above, according to the electronic component mounting attachment of the first and second claims, the positional accuracy in terms of height and phase is maintained even when unavoidable external forces such as vibrations are applied to the electronic component. Because it is reliably maintained without distortion, variations in quality and performance can be minimized, especially when applied to electronic components that require high positional accuracy, such as magnetic field detection elements such as Hall elements. Moreover, the lead wire is effectively insulated from the end bracket, etc. In addition, it is possible to easily and quickly mount electronic components such as magnetic field detection elements on circuit boards with less man-hours, and the mounting position is accurately set and lead wires can be automatically soldered. There are various advantages that can be achieved, including significant cost reductions.

Moreover, in addition to the above, the attachment according to the first claim has the advantage that it can be constructed at low cost because the molding operation is easy, and furthermore, the attachment according to the second claim can maintain good insulation properties. There will be an advantage.

[Brief explanation of drawings]

Figures 1 to 4 are views showing an attachment according to an embodiment of this invention. Figure 1 is a front view, Figure 2 is a top view, Figure 3 is a bottom view, and Figure 4 is the same as in Figure 2. 5 to 7 are views showing attachments according to other embodiments, in which FIG. 5 is a bottom view, FIG. 6 is a top view, and FIG. 7 is a cross-sectional view of FIG.
Figure 8 is a cross-sectional view of the attachment in use, Figure 9 is a front view of the Hall element, Figure 10 is a bottom view of the Hall element, and Figure 11 is a view of the Hall element as a magnetic field detection element. 12 is a front view of the circuit board, FIG. 13 is a front view of the end bracket, and FIG. 14 is a side view of the end bracket. 1... Attachment, 2... Insulating resin block, 3... Guide, 51... Lead wire, 100
... Circuit board, 210 ... Holding hole, H ... Hall element (example of electronic component), P ₁ ... Mutual distance between guides on one end surface of the resin block, P ₂ ... Mutual distance between guides on the other end surface of the resin block Mutual spacing between guides, P ₃ ... Mutual spacing between lead wire insertion holes, P ₄ ... Mutual spacing between lead wires.

Claims (1)

[Claims for Utility Model Registration] 1. Electronic components such as the Hall element H on the circuit board 100
A plurality of guides 3 corresponding to the plurality of lead wires 51 of the electronic component are attached to the insulating resin block 2 whose end face is seated on the circuit board 100.
are extended in the height direction, and these guides 3
The mutual spacing between the plurality of lead wires 51 of the electronic component on the one end surface 2b of the resin block 2 is
_P4 , and on the other end surface 2a of the resin block 2, the lead wire insertion holes formed in the circuit board 100 are set to have a mutual spacing _P3 , which is different from the mutual spacing _P4 . Further, the guide 3 is constituted by grooves 5 opening on the side surfaces of the resin block 2, and each groove 5 is arranged so as to open alternately on the opposite side surface. Attachment for mounting parts. 2 Electronic components such as the Hall element H are mounted on the circuit board 100.
A plurality of guides 3 corresponding to the plurality of lead wires 51 of the electronic component are attached to the insulating resin block 2 whose end face is seated on the circuit board 100.
are extended in the height direction, and these guides 3
The mutual spacing between the plurality of lead wires 51 of the electronic component on the one end surface 2b of the resin block 2 is
_P4 , and on the other end surface 2a of the resin block 2, the lead wire insertion holes formed in the circuit board 100 are set to have a mutual spacing _P3 , which is different from the mutual spacing _P4 . An attachment for mounting an electronic component, further characterized in that the guide 3 is constituted by a through hole 6 bored in the resin block 2.