JPH0542968A - Emboss carrier type taping - Google Patents

Abstract

PURPOSE:To reduce the occurrence of a stringiness or knocking pattern phenomenon in a pressure-sensitive adhesive layer. CONSTITUTION:A top cover tape 4 consists of the plastic film having a contraction coefficient of at most 3% after continuous heating at least for 50 hours at 60 deg.C and a thickness of from 5mum to less than 100mum. Its non-adhesive layer 6 has a thickness of from 5mum to less than 75mum. A pressure-sensitive adhesive layer 5 consists of a silicone resin adhesive agent containing as a main component the polydimethylsiloxane having at most 15g each of the maximum and minimum values in the range of the run-out of a knocking pattern occurring upon peeling off at a constant speed and a toluene solvent dissolution rate ranging from 50% to less than 80% by adjusting cross-linking reaction and its thickness is from 1mum to less than 50mum.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to taping of surface mounting electronic components (hereinafter referred to simply as "electronic components"), in particular, the electronic components are housed in a recess provided in the tape, and a top cover tape is stuck thereon. The present invention relates to a completed embossed carrier type taping.

[0002]

2. Description of the Related Art As electronic parts have become lighter, thinner, shorter, smaller and more densely mounted, surface mounting for mounting leadless electronic parts directly on the surface of a printed wiring board has become widespread. The demand for embossed carrier type taping for electronic parts is increasing rapidly.

This embossed carrier type taping is standardized in Japanese Industrial Standard (JIS) C0806, but as shown in FIG. 4, a plastic in which recesses 1 are provided at predetermined intervals along the longitudinal direction. Made of an embossed carrier tape 2, an electronic component 3 housed in the recess 1 of the embossed carrier tape 2, and a top cover tape 4 attached to the upper surface of the embossed carrier tape 2 containing the electronic component 3. It was completed as taping. The feed hole 7 is provided for feeding the tape when the taping is applied to the mounting machine in the assembly process, and the reel 8 is for winding the tape.

By the way, conventionally, the top cover tape 4 made of polypropylene film is provided on the non-adhesive surface of the cellophane adhesive tape at the portion covering at least the opening area of the recess 1 so that the electronic parts do not directly touch the adhesive surface. Embossed carrier tape through a non-adhesive layer formed by utilizing the above, and an adhesive layer made of a rubber-based or acrylic resin-based adhesive in a portion covering the area outside the opening area of the recess 1 It is usually attached to No. 2 (eg, Japanese Utility Model Publication No. 62-36766).

[0005]

The conventional embossed carrier type taping as described above has the following disadvantages. That is, (1) when left for a long time for transportation or storage or left at a high temperature, the cohesive force of the rubber-based or acrylic resin-based adhesive decreases and the stringing of the adhesive layer is reduced. The phenomenon occurs. In addition, if it occurs unevenly and an extremely long stringing phenomenon occurs, the adhesive adheres to the electronic component mounting machine in the assembly process, which deteriorates the mounting function.

(2) If the adhesive is aged, stringing continues for a long time, and the adhesiveness varies, when the top cover tape 4 is peeled off by the mounting machine in the assembly process, the tape 4 is removed. As described above, a so-called knocking pattern phenomenon that causes uneven peeling occurs, and peeling does not occur smoothly. In addition, the knocking vibration causes the electronic component 3 to jump out from the recess 1 of the embossed carrier tape 2, thereby greatly reducing the mounting efficiency and efficiency.

The present invention has been made in order to solve such a problem, and reduces the occurrence of the stringing phenomenon and the knocking pattern phenomenon as much as possible to reduce the function of the electronic component mounting machine and improve the mounting efficiency and efficiency. The present invention aims to provide embossed carrier type taping that prevents the deterioration.

[0008]

SUMMARY OF THE INVENTION According to the present invention, a recess of an embossed carrier tape in which electronic parts are stored is made to face a non-adhesive layer in its opening area and an adhesive layer in a peripheral area. An embossed carrier type taping in which a top cover tape is attached and covered, wherein the top cover tape has a shrinkage ratio of 3% or less at a temperature of 60 ° C. and 50 hours of continuous heating and a thickness of more than 5 μm. It consists of a plastic film of less than 100 μm, the thickness of the non-adhesive layer is more than 5 μm and less than 75 μm, and the adhesive layer has a knocking pattern swing range of 15 g at the maximum value and the minimum value during constant speed peeling. In the following, the solvent-based elution rate of toluene is more than 50% and less than 80%. Is obtained by a silicone resin-based pressure-sensitive adhesive layer is less than 50μm exceed 1 [mu] m.

[0009]

With this configuration, the characteristics of the adhesive layer hardly change even when left for a long time or at a high temperature, so that the occurrence of stringing stones and knocking pattern phenomena is significantly reduced, and the electronic component mounting machine It is possible to prevent the deterioration of the function and the deterioration of wearing efficiency and efficiency.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of embossed carrier type taping according to the present invention will be described below with reference to the drawings.

FIG. 1 is a partially exploded perspective view of this embodiment, and FIG. 2 is a detailed explanatory view thereof. (A) is a partially enlarged plan view of taping, (b) is a line AA in (a). It is sectional drawing which followed.

In FIGS. 1 and 2, 1 is a recess, 2
Is an embossed carrier tape, 3 is an electronic component, 4 is a top cover tape, 5 is an adhesive layer, 6 is a non-adhesive layer formed by sticking non-adhesive tapes, 7 is a feed hole, and 8 is a reel.

The structure of this embodiment will be described. The embossed carrier tape 2 made of a plastic film.
The recesses 1 for accommodating the electronic components 3 are provided at regular intervals in the longitudinal direction. Electronic components 3 are housed in the respective recesses 1. The top cover tape 4 is attached to the embossed carrier tape 2 to cover the recess 1. The non-adhesive layer 6 is made to face the opening region of the recess 1 and the length of the non-adhesive layer 6 is increased. The two side regions in the direction are bonded together via the adhesive layer 5. The top cover tape 4 has a temperature of at least 60 ° C.
A polyester film having a shrinkage of about 1% and a thickness of 25 μm after being continuously heated for 50 hours was used. In the area of the top cover tape 4 corresponding to the opening of the recess 1,
A non-adhesive tape 6 having a thickness of 25 μm is attached.
The layer thickness is 30 μm on both side regions in the longitudinal direction of the non-adhesive layer 6 of the top cover tape 4, and the range of swing of the knocking pattern at the time of constant speed peeling is about 5 near the maximum value.
g, about 7 g in the vicinity of the minimum value, and a layer 5 made of a silicone resin-based pressure-sensitive adhesive containing polydimethylsiloxane as a main component, the cross-linking reaction of which has been adjusted to a solvent elution rate of 65%.

Next, in order to investigate the effect of this embodiment, the peel strength of the top cover tape was measured and so on. The result is shown in FIG.

For comparison with this, the peel strength of the conventional embossed carrier type taping was also measured.
The result is shown in FIG.

Comparing the results of FIG. 3 and FIG. 5, the embossed carrier type taping of this embodiment has a more uniform peeling of the top cover tape than the conventional product and is very stable.

The peel strength is 50 at an ambient temperature of 60 ° C.
The embossed carrier type taping left for a period of time was taken out, and the top cover tape was peeled off at a speed of 60 mm / min.

By the way, from the experimental results by the inventors,
It is desirable that the top cover tape 4, the non-adhesive layer 6 and the adhesive layer 5 satisfy the following conditions in practical use.

The top cover tape 4 has a shrinkage ratio of 3 after being continuously heated at a temperature of 60 ° C. for 50 hours.
If a plastic film exceeding 100% is used, phenomena such as meandering and twitching occur remarkably during taping and winding, and the mounting rate of the winding and mounting machine decreases. When the thickness is 5 μm or less, it is extremely difficult to form the adhesive layer 5 uniformly on the adhesive layer 5, and the electronic component 3 often pops out from the recess 1 because it is too thin. Become. Further, when the thickness is 100 μm or more, the rigidity becomes a strength that cannot be ignored, and it becomes difficult to wind the reel. The results are summarized in Table 1.

[0020]

[Table 1]

When the thickness of the non-adhesive layer 6 is 5 μm or less, there is an inconvenience that “wrinkles” are formed when the non-adhesive layer 6 is attached to the adhesive layer 5, and when the thickness is 75 μm or more, the non-adhesive layer 6 is formed. As a result, the rigidity of the pressure-sensitive adhesive tape that constitutes the component becomes too strong, resulting in weakening the bonding force. Table 2 shows the experimental results.

[0022]

[Table 2]

When the thickness of the adhesive layer 5 is 1 μm or less, the adhesive force with the embossed carrier tape 2 becomes insufficient, and the generally required peel strength of the top cover tape of 20 gf to 70 gf is not satisfied. However, if the thickness is 50 μm or more, the peel strength becomes abnormally large.

If the swing range of the knocking pattern exceeds 15 g, the resonance phenomenon becomes too large, and the electronic component 3 may fly out of the recess 1.

Furthermore, the solvent elution rate of toluene is 80
% Or more, the low molecular weight dimethylsiloxane in the pressure-sensitive adhesive is not confined and the cohesive force becomes insufficient. As a result, the stringing phenomenon when peeling off the top cover 4 becomes remarkable, and so-called adhesive residue may occur, Adhesive strength is not stable, and so-called "running phenomenon" at the time of peeling is exhibited. When the solvent elution rate of toluene is 50% or less, the adhesive layer 5 is impaired in proper flexibility and cannot be smoothly peeled off. The results are summarized in Table 3.

[0026]

[Table 3]

The solvent elution rate means that the adhesive tape (weight W ₁ ) having a predetermined area is immersed in toluene at room temperature (23 ° C. and 5 ° C.) for 15 hours, then taken out and dried at 80 ° C. for 3 hours. Using the measured weight (W ₂ ) and the weight (W ₃ ) of the base material remaining after drying by dipping in toluene again to separate the remaining adhesive and the base material, It is obtained from a mathematical formula.

The solvent elution of toluene (%) = {1 - [(W ₂ over _{W 3) / (W 1 -W} 3) ]} × 100 It should be noted that using a polyester film on the top cover tape is in this embodiment However, any film such as a polyimide film, a polyether ether ketone film, and a polyphenylene sulfide film may be used instead.

The pressure-sensitive adhesive may be either a polymer type or an addition type.

[0030]

According to the embossing carrier type taping of the present invention, the top cover tape has a temperature of at least 60 ° C.
When the shrinkage rate in continuous heating at 50 ° C for 50 hours is 3% or less,
The non-adhesive layer has a thickness of more than 5 μm and less than 100 μm, and the non-adhesive layer has a thickness of more than 5 μm and less than 75 μm. Is 15 g or less at each of the highest value and the lowest value, and the cross-linking reaction is adjusted to adjust the solvent elution rate in toluene to a range of more than 50% and less than 80%, and the main component is polydimethylsiloxane. Since it is composed of a silicone resin-based pressure-sensitive adhesive having a size of more than 1 μm and less than 50 μm, the knocking pattern when the top cover tape is peeled off is stable and smooth even after being left for a long time. Occurrence can be reduced, and the functional deterioration of the electronic component mounting machine and the mounting efficiency / efficiency can be prevented.

[Brief description of drawings]

FIG. 1 is a partially exploded perspective view of an embossed carrier type taping according to an embodiment of the present invention.

2A is a partially enlarged plan view of the taping shown in FIG. 1, and FIG. 2B is a sectional view taken along line AA in FIG.

FIG. 3 is a diagram showing the peel strength of the top cover tape in the example of the present invention.

FIG. 4 is a perspective view of a conventional embossed carrier type taping.

FIG. 5 is a diagram showing the top cover tape peel strength of a conventional embossed carrier type taping.

[Explanation of symbols]

 1 recess 2 embossed carrier tape 3 electronic component 4 top cover tape 5 adhesive layer 6 non-adhesive layer 7 feed hole 8 reel

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[Procedure amendment]

[Submission date] February 4, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 1

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0002

[Correction method] Change

[Correction content]

[0002]

As the density of the Related Art miniaturization and mounting of electronic components, become surface directly attach surface mounting of electronic components to printed wiring board is widely practiced, for electronic components Consequently surface mounting The demand for embossed carrier type taping is rapidly increasing.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction content]

[0008]

SUMMARY OF THE INVENTION According to the present invention, a recess of an embossed carrier tape in which electronic parts are stored is made to face a non-adhesive layer in its opening area and an adhesive layer in a peripheral area. An embossed carrier type taping in which a top cover tape is attached and covered, wherein the top cover tape has a shrinkage ratio of 3% or less at a temperature of 60 ° C. and 50 hours of continuous heating and a thickness of more than 5 μm. It consists of a plastic film with a thickness of less than 100 μm, the thickness of the non-adhesive layer is more than 5 μm and less than 75 μm, and the adhesive layer has a knocking pattern deflection during constant-speed peeling.
In the range of the variation of the highest value and the variation of the lowest value in
Each of the ranges is 15 g or less, and the main component is polydimethylsiloxane whose cross-linking reaction is adjusted so that the solvent elution rate of toluene exceeds 50% and less than 80%, and the thickness is 1 μm.
A silicone resin-based pressure-sensitive adhesive layer having a thickness of more than m and less than 50 μm.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction content]

The structure of this embodiment will be described. The embossed carrier tape 2 made of a plastic film.
The recesses 1 for accommodating the electronic components 3 are provided at regular intervals in the longitudinal direction. Electronic components 3 are housed in the respective recesses 1. The top cover tape 4 is attached to the embossed carrier tape 2 to cover the recess 1. The non-adhesive layer 6 is made to face the opening region of the recess 1 and the length of the non-adhesive layer 6 is increased. The two side regions in the direction are bonded together via the adhesive layer 5. The top cover tape 4 has a temperature of at least 60 ° C.
A polyester film having a shrinkage of about 1% and a thickness of 25 μm after being continuously heated for 50 hours was used. In the area of the top cover tape 4 corresponding to the opening of the recess 1,
A non-adhesive tape 6 having a thickness of 25 μm is attached.
The layer thickness is 30 μm on both side regions of the top cover tape 4 in the longitudinal direction of the non-adhesive layer 6, and the fluctuation of the maximum value in the swing of the knocking pattern at the time of constant speed peeling is high.
Is about 5 g, the range of variation of the minimum value is about 7 g, and the layer 5 made of a silicone resin-based pressure-sensitive adhesive containing polydimethylsiloxane whose cross-linking reaction is adjusted to a solvent elution rate of 65% of toluene is the main component. Has been formed.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0024

[Correction method] Change

[Correction content]

[0024] and, of knocking pattern shake smell
The range of variation of the highest value and the range of variation of the lowest value
If each exceeds 15 g, the resonance phenomenon becomes too large,
The risk of the electronic component 3 popping out of the recess 1 increases.

[Procedure Amendment 6]

[Document name to be amended] Statement

[Name of item to be corrected] 0030

[Correction method] Change

[Correction content]

[0030]

According to the embossing carrier type taping of the present invention, the top cover tape has a temperature of at least 60 ° C.
When the shrinkage rate in continuous heating at 50 ° C for 50 hours is 3% or less,
The non-adhesive layer has a thickness of more than 5 μm and less than 100 μm, and the non-adhesive layer has a thickness of more than 5 μm and less than 75 μm. Is 15 g or less at each of the highest value and the lowest value, and the cross-linking reaction is adjusted to adjust the solvent elution rate in toluene to a range of more than 50% and less than 80%, and the main component is polydimethylsiloxane. Since it is composed of a silicone resin-based adhesive having a size of more than 1 μm and less than 50 μm, it has the highest knocking pattern run-out when the top cover tape is peeled off even after being left for a long time .
The range of variation and the range of variation of the lowest value are not actually used
It can be seen, and the occurrence of stringing can be reduced,
It is possible to prevent functional deterioration of the electronic component mounting machine and deterioration of mounting efficiency and efficiency.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ken Matsushima 1-4-22 Hiromachi, Shinagawa-ku, Tokyo Inside the Teraoka Manufacturing Co., Ltd. (72) Inventor Mitsuo Ota 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Within the corporation

Claims (1)

[Claims] 1. An embossed carrier tape made of a plastic film in which a large number of recesses are provided at a predetermined interval along the longitudinal direction and electronic parts are housed in the recesses, and an opening area of the recesses and its opening area. In a top cover tape covering a peripheral area, a non-adhesive layer faces at least an opening area of the recess, and an embossed carrier type taping bonded to the peripheral area via an adhesive layer, wherein the top cover tape is , At least temperature 6
It comprises a plastic film having a shrinkage factor of 3% or less and a thickness of more than 5 μm and less than 100 μm in continuous heating at 0 ° C. for 50 hours, and the non-adhesive layer has a thickness of more than 5 μm and less than 75 μm. The pressure-sensitive adhesive layer has a knocking pattern swing range of 15 g or less at the maximum value and the minimum value at the time of constant-speed peeling, and the cross-linking reaction is adjusted so that the solvent elution rate of toluene exceeds 50%. An embossed carrier-type taping, which is a silicone resin-based pressure-sensitive adhesive layer having a thickness of more than 1 μm and less than 50 μm, containing polydimethylsiloxane as a main component in a range of less than 10%.