JPH0542124B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a holding plate for chip components such as multilayer chip capacitors and chip resistors, and more particularly, to a holding plate used in the process of attaching terminal electrodes, measuring steps, etc. of chip components.

Conventionally, in order to attach terminal electrodes to chip components such as multilayer chip capacitors, as shown in Figure 1,
A plurality of chip parts 2 are pasted on the end surface of the holding plate 1 with an adhesive so that both ends thereof protrude outward, and an electrode paste of silver or the like is applied to both of the protruding ends. I was doing it. With this type of attachment method, only one row of chip parts can be pasted on the plate, which greatly limits the throughput, and the closer the end-to-end dimension of the chip parts is to the thickness of the plate, the more the chip parts can be pasted outward. Since the number of protruding parts is reduced, there is a problem in that it becomes difficult to attach the electrodes. Furthermore, some of these attachment means employ a plate spring to mechanically hold the chip component, but even in this case, problems similar to those of the attachment means arise.

The present invention has been made in view of these points, and provides a holding plate for chip parts that can process a large amount of chips at once and that facilitates work such as attaching electrodes regardless of the size of the end-to-end dimension of the chip parts. The purpose is to provide

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 2 is a perspective view of the holding plate, and FIG. 3 is an enlarged vertical cross-sectional view thereof. In these figures, 11
is a hard substrate made of a metal material such as aluminum, and as shown in FIG. The formed flat plate portion 13
, a plurality of through holes 14 formed in the flat plate portion 13 , and a recessed portion 24 , which is an example of an uneven portion formed on the inner circumferential surface of the frame portion 12 .
15 is an elastic material such as silicone rubber, which is disposed in the space formed on both sides of the flat plate part 13 by the frame part 12 and the flat plate part 13 of the hard substrate and in the through hole 14; With the chip parts storage hole,
It is formed inside the through hole 14 of the elastic material 15. It is preferable that these storage holes 16 have a circular cross section. Reference numeral 17 denotes a groove formed on the outer surface of the opposing frame portions 12 along the planar direction of the hard substrate so as to facilitate carrying of the holding plate.

As shown in FIG.
The elastic material 15 is inserted and fixed, and the elastic material 15 is prevented from lifting off from the hard substrate 11 without applying an adhesive or the like. In other words, since the hard substrate 11 and the elastic material 15 are made of different materials, their adhesive strength is not strong. In this case, there is a possibility that the peripheral edge of the elastic material 15 may peel off from the hard substrate 11 and float up. Therefore, the elastic material 1, which is the part that is most likely to lift up,
A recess 24 is provided at the interface with the peripheral edge of the elastic material 15 to increase the contact area between the elastic material 15 and the hard substrate 11 to prevent separation. Note that the storage hole 16 of the elastic material 15
The parts wear out due to sliding contact with chip parts, so
Although it is necessary to periodically replace the elastic material 15,
Since the peripheral edge of the elastic material 15 is simply fitted into the recess 24, reattaching the elastic material 15 is easy.

The holding plate for a chip component having such a structure is made by forming a hard substrate 11 in advance by cutting or other means, and inserting a pin with a smaller diameter through the center of the through hole 14 into the frame. 12, and then pour the elastic material 15 into the elastic material 12.
It is completed by hardening 5 and pulling out the pin. If it is necessary to improve the flatness of the holding plate, the surface may be polished after the elastic material such as silicone rubber is cured. At this time, it goes without saying that the elastic body needs to have enough hardness to be polished.

In order to hold a chip component on the holding plate configured as described above, the following procedure is performed. First, as shown in the longitudinal sectional view of the main part in Figure 5,
Hard substrate 1 having the same size as the holding plate of the present invention
8, a guide plate 20 having the same number of funnel through holes 19 corresponding to the chip component storage holes of the holding plate is positioned on the holding plate of the present invention using a locate pin or the like so that the wide opening side of the through holes is on the outside. and fix it. Next, when a large number of chip parts are placed on this guide plate 20 and shaken left and right and back and forth, one end of the chip parts forms a funnel-shaped through hole 1.
9 from the wide-mouth side thereof, and are housed in the respective through-holes 19. After that, the funnel-shaped through hole 19
When a large number of chip parts inside are pressed down simultaneously by a pin mold using a press machine, the chip parts are inserted into the storage hole of the holding plate while spreading the elastic material. When this holding plate is used in the electrode attachment process, the chip component is pushed into the receiving hole by the pin die until one end of the chip component projects to the opposite side of the holding plate. In this way, a large number of chip parts elastically held by the holding plate are moved as needed by the protruding ends of the chip parts coming into contact with the application plate coated with electrode paste such as silver. electrodes are attached. When the attached electrodes are dry, the press machine used earlier pushes the chip parts back in the original direction so that the end to which the electrodes are not attached protrudes from the storage hole, and the same process is applied to this part. Electrodes are attached. In addition, transfer the dried chip component with an electrode attached to only one end to the storage hole of another holding plate so that the end without the electrode attached protrudes, and then attach the electrode to that end. You may also do so. In this way, the chip component with electrodes attached to both ends is pushed out from the storage hole of the holding plate by the pin mold of the press and transferred to the next process.

The structure, manufacturing method, and usage of the chip component holding plate of the present invention have been described above.
It goes without saying that various modifications can be made without departing from the spirit of the invention. In particular, the hard substrate constituting the holding plate can be made of resin, and if the storage hole formed in the elastic material has a circular cross section, the cross section of the chip component Insertion is easy regardless of the shape, but other shapes than circular are also possible depending on the shape of the chip component. Furthermore, this holding plate can be used in a measurement process to simultaneously measure the electrical characteristics of a large number of chip components.

Since the chip component holding plate of the present invention is constructed as described above, it is possible to process a large number of chip components that are difficult to handle due to their small size at one time, and even when used in the electrode attachment process. Since it is only necessary to change the holding position of the chip component in the storage hole, various excellent effects such as easy attachment of electrodes are produced regardless of the size of the end-to-end dimension of the chip component.

In addition, since the peripheral edge of the elastic material, which is the part most likely to lift up, is fixed to the hard substrate by the uneven part formed on the inner peripheral surface of the frame, lifting can be reliably prevented without the need for adhesives, etc. When the elastic material wears out, it can be easily replaced.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a holding plate in a conventional chip component electrode attachment process, FIG. 2 is a perspective view of a holding plate of a chip component according to an embodiment of the present invention, and FIG. 3 is an enlarged vertical cross-sectional view thereof. FIG. 4 is a perspective view of a hard substrate used in the holding plate of the present invention, and FIG. 5 is a longitudinal sectional view of a main part of a guide plate for inserting a chip component into the storage hole of the holding plate of the present invention. DESCRIPTION OF SYMBOLS 11... Hard substrate, 12... Frame part, 13... Flat plate part, 14... Through hole, 15... Elastic material, 16...
... Storage hole, 24 ... recess.

Claims (1)

[Claims] 1. A frame, a flat plate integrally provided on the inner peripheral surface of the frame, a plurality of through holes provided in the flat plate, and a plurality of through holes formed on the inner peripheral surface of the frame. A hard substrate comprising an uneven portion, a space formed by a frame portion and a flat plate portion of the hard substrate, and an elastic material disposed within a through hole of the flat plate portion and having a peripheral edge fixed to the uneven portion. A chip component holding plate comprising: a chip component storage hole formed by penetrating the through hole portion of the flat plate portion of the elastic material.