JPH0541595A - Electric component placing machine - Google Patents

Abstract

PURPOSE:To prevent positional deviation of an electric component placed on a board during conveying. CONSTITUTION:A two-shaft robot 6 positions an electric component 4 held by a placing head 5 above a placing position of a board 2, and moves down the head 5 thus mounting the head 5 in place. Then, the robot 6 positions a heater chip 7 above a lead terminal of the component 4, and moves down it. Solder paste 1 reflows to connect part of the terminal of the component 4 to the board 2. Incidentally, a two-shaft robot for positioning the chip 7 may be separately provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an electric component mounting machine,
In particular, the present invention relates to an electric component mounting machine having a function of preventing displacement of electric components.

[0002]

2. Description of the Related Art A conventional electric component mounting machine, as shown in FIG. 2, is provided with a stage 13 for holding a substrate 12 coated with a solder paste 11, and a stage 13 provided above the stage 13.
A mounting head 15 for lowering an electric component (for example, an LSI or a capacitor) 14 in a holding state and mounting it on the substrate 12.
And a biaxial robot 16 for positioning the mounting head 15 at a predetermined position on the substrate 12.

Next, the operation of the conventional electric component mounting machine will be described. Electrical component 14 held by mounting head 15
Is positioned above the mounting position on the substrate 12 by the biaxial robot 16, and then the mounting head 15 is lowered and mounted.

[0004]

In this conventional electrical component mounting machine, since the electrical components are simply placed on the solder paste, there is a drawback that the electronic components are easily displaced when the substrate is carried to the next step. there were.

[0005]

SUMMARY OF THE INVENTION According to the present invention, a stage for holding a substrate, a mounting head disposed above the stage for mounting an electric component on the substrate by lowering it in a holding state, and holding the mounting head. And a first manipulator for positioning the stage at a predetermined position, a bonding head for bonding a part of the electric component held on the first manipulator and mounted on the substrate onto the substrate. have.

Further, instead of the first manipulator, a second manipulator for holding the joining head and joining a part of the electric parts mounted on the substrate on the substrate may be provided.

Further, each of the first and second manipulators may be a two-axis robot.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a side view showing an embodiment of the present invention. The electric component mounting machine of the present invention is provided with a stage 3 for holding a substrate 2 coated with a solder paste 1, and an electric component 4 arranged above the stage 3 and lowered in a holding state to be mounted on the substrate 2. The mounting head 5 and the biaxial robot 6 for positioning the mounting head 5 at a predetermined position on the substrate 2 are provided, and these configurations are similar to those of a conventional electric component mounting machine. In addition, in the present embodiment, the heater chip 7 for soldering part of the lead terminals of the electric components 4 mounted on the biaxial robot 6 to the substrate 2 is further provided.
It is configured to include and.

Next, the operation of the electric component mounting machine of the present invention will be described. Electrical component 4 held by mounting head 5
Is positioned above the mounting position on the substrate 2 by the biaxial robot 6, and then the mounting head 5 is lowered and mounted. Then, the heater chip 7 is positioned above the leads of the electric component 4 and descends, and the solder paste 1 is reflowed to bond a part of the lead terminals to the substrate.

A two-axis robot for positioning the heater chip 7 may be separately provided.

[0012]

As described above, in the electrical component mounting machine of the present invention, the bonding head performs the bonding to prevent the positional displacement immediately after mounting, so that the electrical component is displaced when the substrate is transferred to the next process. Has the effect of not occurring.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of the present invention.

FIG. 2 is a side view showing a conventional example.

[Explanation of symbols]

 1 Solder paste 2 Substrate 3 Stage 4 Electric component 5 Mounting head 6 2-axis robot 7 Heater chip

Claims (3)

[Claims] 1. A stage for holding a substrate, a mounting head disposed above the stage for lowering an electric component from a holding state to mount the component on the substrate, a stage for holding the mounting head, and the stage. And a first manipulator for positioning the electric component on a predetermined position of the electric component mounting machine, which joins a part of the electric component mounted on the substrate to the substrate, the head being held by the first manipulator. An electric component mounting machine characterized by having. 2. A second manipulator for holding the joining head instead of the first manipulator and joining a part of the electric component mounted on the substrate onto the substrate. The electric component mounting machine according to claim 1. 3. The first and second manipulators each comprise a biaxial robot.
Alternatively, the electric component mounting machine described in 2.