JPH0539965A - Heat pump arrangement - Google Patents

Abstract

PURPOSE:To provide the title arrangement whereby the temperature of a heating part in a heat pump is made higher and thus more heating effect can be obtained. CONSTITUTION:In the title arrangement 10, a gaseous refrigerant having low temperature, which is led from a cooler 1, is compressed by a compressor 3 and is made into the gaseous refrigerant having high temperature, following which it is supplied to a heating part (condenser) 6 in a heat pump, and a liquid refrigerant made by passing through that part is decompressed by an expansion valve 8 and is circulately supplied to the cooler 1, and thus the gaseous refrigerant having the low temperature is reproduced. A heat-exchanger 12 whereby the heat of the liquid refrigerant before decompression is transmitted to the gaseous refrigerant before compression, is provided. In this way, since a temperature of the gaseous refrigerant led to the compressor is raised, the temperature at the heating part 6 is made higher as compared with a former arrangement for the heat pump, and thus more heating effect can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pump device, and more particularly to a heat pump device provided in air conditioning equipment.

[0002]

2. Description of the Related Art Conventionally, this type of heat pump device is shown in FIG.
As shown in FIG.
Is sucked into the compressor 3 through the compressor, and the compressor 3 compresses the refrigerant gas into a high temperature gas. This gas is supplied to the heat pump heating section via the pipe 4, condensed in the condenser 6 and liquefied. The condensed liquid material is decompressed by an expansion valve 8 connected to a pipe 7 to form a mixed phase flow of a low temperature gas and a low temperature liquid, and this refrigerant gas is circulated and supplied to the cooler 1 through a pipe 9, and thereafter, All become gaseous. That is, the refrigerant gas is regenerated here.

The temperature difference of heat exchange in the conventional heat pump device is in the range of 3 ° C. to 5 ° C. The purpose is to flush (gas) the liquid material by supercooling on the liquid material side. On the refrigerant gas side, the residual liquid is heated to prevent liquid compression (liquid back) of the condenser 3 and to prevent its damage.

[0004]

However, in the conventional heat pump device, even if the low temperature refrigerant gas from the cooler 1 is compressed by the compressor 3 and heated, the temperature rises from 40 ° C to 50 ° C.
Since it is only about C, there is a drawback that the heat pump heating unit 5 cannot obtain a high temperature heating effect.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a heat pump device capable of obtaining a high temperature heating effect in a heat pump heating section.

[0006]

In order to achieve the above-mentioned object, the present invention compresses a low-temperature refrigerant gas from a cooler into a high-temperature gas by a compressor and heats this gas into a heat pump heating section, that is, In a heat pump device for supplying pressure to a condenser, reducing the pressure of a refrigerant that has been cooled by passing through the condenser to become a liquid material, and supplying the refrigerant to the cooler, and regenerating a refrigerant gas to circulate the refrigerant gas in the same system. Further, a heat exchanger for exchanging heat between the uncompressed refrigerant gas flowing from the cooler to the compressor with the liquid material before depressurization flowing from the condenser is provided.

[0007]

According to the present invention, the refrigerant gas before compression is heat-exchanged with the liquid material before decompression in the heat exchanger to raise the temperature of the refrigerant gas, and the refrigerant gas in this state is sucked into the compressor. Thereby, as compared with the conventional heat pump device, it is possible to obtain more heating effect at high temperature in the heat pump heating unit.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a heat pump device according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of a heat pump device 10 according to the present invention, and the same or similar members as those in the conventional example shown in FIG.

A compressor 3 is connected to the outlet side 1a of the cooler 1 via a pipe 2, and a heat pump heating section, that is, a condenser 6 is connected to the compressor 3 via a pipe 4. The pipe 2 is disposed so as to pass through a heat exchanger 12 and exchanges heat with a pipe 7 described later. An expansion valve 8 is connected to the condenser 6 via a pipe 7. The expansion valve 8 is disposed on the outlet side of the pipe 7 that is inserted through the heat exchanger 12, that is, outside the heat exchanger 12, and on the inlet side 1b of the cooler 1 via the pipe 9. Connected.

Next, the operation of the heat pump device 10 configured as described above will be described. First, the low-temperature refrigerant gas from the cooler 1 is drawn into the compressor 3 through the pipe 2,
The compressor 3 compresses the refrigerant gas into a high temperature gas. This high temperature gas is supplied to the condenser 6 via the pipe 4 and liquefied. After that, the liquefied gas is supplied to the expansion valve 8 through the pipe 7, is decompressed by the expansion valve 8, becomes a multiphase flow of the low temperature gas and the liquid, and is supplied to the cooler 1 through the pipe 9, and thereafter. , All become gaseous. That is, the refrigerant gas is regenerated here.

The point of the present invention is that the low-temperature refrigerant gas passing through the pipe 2 is heat-exchanged with the (high-temperature) liquid substance passing through the pipe 7 by the heat exchanger 12, and is supplied to the compressor 3. That is, the temperature of the refrigerant gas is increased. Thereby, the temperature of the liquid material compressed by the compressor 3 is higher than that of the conventional heat pump device of 40 ° C to 50 ° C obtained by compressing the low-temperature refrigerant gas at that temperature. In the example, it was found that a temperature of about 95 ° C was obtained. Therefore, in the present embodiment, it is possible to obtain more heating effect at high temperature in the heat pump heating section, that is, the condenser 6, as compared with the conventional heat pump device. In addition, it is possible to reduce the auxiliary heat source (electric heater, etc.) for heating the refrigerant gas,
It is also possible to reduce the heat insulation work for the suction side pipe.

Furthermore, it has been found that the use of R-12 as the refrigerant gas can reduce the power consumption of the conventional heat pump device by about 10% (coefficient of performance 3.4: 3.1).

[0013]

As described above, according to the heat pump device of the present invention, a heat exchanger for exchanging heat between the refrigerant gas before compression and the liquid material before expansion is provided, and the refrigerant gas heats the liquid material. Since the temperature is raised by replacement and the temperature is supplied to the compressor, more heating effect can be obtained at high temperature in the heat pump heating unit as compared with the conventional heat pump device.

[Brief description of drawings]

FIG. 1 is a system diagram showing an embodiment of a heat pump device according to the present invention.

FIG. 2 is a system diagram showing an example of a conventional heat pump device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Cooler 3 ... Compressor 6 ... Heat pump heating part, condenser 8 ... Expansion valve 10 ... Heat pump device 12 ... Heat exchange device

Claims (1)

[Claims] 1. A low-temperature refrigerant gas from a cooler is compressed by a compressor into a high-temperature gas, which is supplied to a heat pump heating section, that is, a condenser, and cooled by passing through this condenser. In a heat pump device that depressurizes the refrigerant that has become a liquid and supplies it to the cooler, regenerates the refrigerant gas and circulates it in the same system, the refrigerant gas before compression that flows from the cooler to the compressor A heat pump device comprising a heat exchanger for exchanging heat with the liquid material before being decompressed flowing from the condenser.