JPH0538936U - Assembly board - Google Patents

Abstract

(57) [Abstract] [Purpose] An object of the present invention is to provide a collective substrate having a structure in which stress is not exerted on the surrounding base portion and chip components even when the substrate connecting portion is cut. [Structure] A plurality of single substrates 12A, 12B, 12C for mounting chip parts are provided, and the separation holes 14 and the substrate connecting portions 20 are alternately arranged at the boundaries of these single substrates. The assembled substrate 10 configured as above, wherein the substrate connecting portion 20 is provided.
The holes 16 and 16I for relieving the stress generated at the time of cutting the substrate connecting portion are provided in the vicinity of.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention has a plurality of single substrates for mounting chip parts, and the boundaries of these single substrates are provided with alternate separation holes and substrate connecting portions like so-called perforations. Related to the assembled substrate.

[0002]

[Prior Art]

 In order to improve the mounting efficiency of the chip components, a single substrate surrounded by a boundary composed of alternating holes for separation and substrate connecting portions is generally used to improve the mounting efficiency. It is a collective substrate having a plurality of sheets. Therefore, after mounting various chip parts, the above-mentioned board connecting portions are cut to separate them into single boards.

This will be described with reference to FIG. The collective substrate 50 is provided with two single substrates 52A and 52B, which are boundaries of the separating holes 54 and the substrate connecting portions 60, which are long holes. FIG. 7 is an enlarged view of a portion A near the board connecting portion 60. In order to separate each single board after mounting each chip component, the board connecting portion 60 must be cut by a nipper or the like. FIGS. 8 and 9 show how the cutting is performed by the nippers 62. 8 is a sectional view taken along the line BB of FIG. 7, and FIG. 9 is a sectional view taken along the line C-C of FIG. 7.

[0004]

[Problems to be solved by the device]

 However, when each board connecting portion 60 is cut by the nippers 62, stress acts on the peripheral area due to the thickness of the blade of the nipper, and as a result, the crack 58A is generated in the chip component 58 mounted in the vicinity of the board connecting portion 60. May occur or cracks may occur in the solder used to mount the chip components. Therefore, it is not possible to place chip components near the board connection part, which is a large constraint on the board design. This means that the hatched areas 53 cannot be used effectively.

Although it does not prevent the cracks that occur during cutting, it does not prevent the board from being deformed or damaged in the process of mounting chip components on the board or in the process of solder reflow. There may be a case where a divided substrate portion is provided, which is disclosed in Japanese Patent Publication No. 1-49031. Then, in this publication, when the auxiliary divided substrate portion is punched and formed in a perforated shape, a waste hole 10 is formed in order to prevent a crack from being generated in the perforated portion. The abandoned holes seem to be similar to the stress-relieving holes of the present invention described below.

However, the waste hole of this publication is punched at the same time when the auxiliary split substrate portion is punched into a perforated shape, and the punch of the die used for the punching enters the waste hole. The function of holding and fixing the auxiliary split substrate portion is to prevent the perforation from cracking, and is not a hole for reducing stress when cutting out the perforation as in the present invention. Further, unlike the case of the present invention, the waste hole in the publication is directed to the auxiliary divided substrate portion surrounded by the slits 8 and 8 ', and a larger difference is from the purpose of the waste hole 10 described above. Although the discard hole 10 cannot be formed near the perforation hole 9, the hole of the present invention can reduce the stress at the time of cutting only when the hole is provided near the board connecting portion. That is the difference in the place where the holes are formed.

Therefore, an object of the present invention is to provide a collective substrate having a structure that does not give stress to the surrounding substrate portion and chip components even when the substrate connecting portion is cut.

[0008]

[Means for Solving the Problems]

 In view of the above object, the present invention has a plurality of single substrates for mounting chip parts, and the boundaries of these single substrates are configured by alternately arranging separation holes and substrate connecting portions. An aggregate substrate, characterized in that a hole is provided near the substrate connecting portion to alleviate stress generated when the substrate connecting portion is cut.

[0009]

[Action]

 When the substrate connecting portion is cut by the nipper, stress is generated around the blade due to the thickness of the blade of the nipper, but the stress is absorbed and alleviated by providing the hole near the substrate connecting portion.

[0010]

【Example】

 Hereinafter, the present invention will be described in more detail with reference to the embodiments shown in the accompanying drawings. FIG. 1 shows a collective substrate 10 for mounting a chip component according to the present invention. This collective substrate 10 has three single substrates 12A, 12B, 12C surrounded by a long hole 14 for separating each single substrate and a substrate connecting portion 20 arranged between them. ing. Round holes 16 or 16I are provided in the vicinity of each board connecting portion 20 of each of these single boards. The round holes 16 are formed outside the boundary of each single substrate, and the round holes 16I are formed inside. These round holes may be provided in the vicinity of the substrate connecting portion 20, and may be inside or outside thereof. Due to the space of the single board layout, it can be outside or inside.

FIG. 2 is an enlarged view showing the vicinity of one substrate connecting portion 20 of the single substrate 12A, but the round hole 16 is provided outside the single substrate 12A. As another modification, the long hole 16L is provided outside the single substrate 12A, and as another modification, a round hole 16I is provided inside the single substrate 12A.

Next, the effect of the present invention will be described with reference to FIGS. 3 to 5. FIG. 3 shows a conventional collective substrate having no holes for stress relaxation in the vicinity of the substrate connecting portion 20 between the elongated holes 14 having a width of 1 mm and a distance between them of 2.5 mm as shown. .. The strain due to the stress when the substrate connecting portion 20 was cut with a nipper was measured at a measurement point MP1 2 mm away from the substrate connecting portion 20.

FIG. 4 shows a collective board according to the present invention in which a round hole 16 having a diameter of 2 mm is formed at a position 2 mm apart from the board connecting portion 20 with respect to the collective board of FIG. 3 described above. .. The strain due to the stress when the substrate connecting portion 20 was cut with a nipper was measured at the measurement point MP2, which is the same position as in FIG. 3 and 2 mm away from the substrate connecting portion 20.

In each of the above strain measurements, two types of thickness measurements of the nippers used for cutting the substrate connecting portion 20 are used, and the strains due to the cutting stress by the respective nippers are measured. As shown in FIG. 5, the cutting edge angles θ of the two types of nippers are the same, but the thickness dimensions are different, one being 0.9 mm and the other being 0.5 mm.

In the measurement data D1 and D2 of FIG. 5, the cutting target is the conventional collective substrate shown in FIG. 3, and the cutting is performed with a nipper having a thickness of 0.9 mm and a thickness of 0.5 mm. It is the compressive strain of the measurement point MP1 with respect to the cutting by the nipper. Further, both of the measurement data D3 and D4 are the collective substrate of the present invention shown in FIG. 4 whose cutting target is the cutting with the nipper having the thickness of 0.9 mm and the thickness of 0.5 mm. It is the compressive strain of the measurement point MP2 with respect to the cutting by the nipper. The circles M1, M2, M3 and M4 indicate the average value of each data.

From the results of these measurements, comparing the average value data M1 and M2, it can be seen that the thinner the nipper, the smaller the strain. The same thing can be said when the other average value data M3 and M4 are compared. Further, by comparing the average value data M1 and M3 or the average value data M2 and M4, it can be seen that the compressive strain generated in the aggregate substrate according to the present invention is reduced as compared with the conventional aggregate substrate. In this experiment, the strain is reduced by about 40%.

As shown in FIG. 4, it is desirable to provide a hole 16 for reducing stress and strain associated with cutting in the vicinity of the board connecting portion 20, but if this hole is made too close to it, a collective substrate is manufactured. Since the substrate is cracked, it is desirable to design the dimension L in the figure to be equal to or larger than the thickness of the substrate.

[0018]

[Effect of the device]

 As is clear from the above description, according to the present invention, the strain generated when the substrate connecting portion is cut by the nipper can be alleviated by the hole provided in the vicinity of the substrate connecting portion. Therefore, the vicinity of the board connecting portion is not damaged, chip parts can be arranged there, and the board can be effectively used for designing, and high-density mounting is also possible. Further, even if the thickness of the nipper is increased, the stress at the time of cutting the substrate connecting portion is alleviated, so that the durability of the nipper can be improved.

[Brief description of drawings]

FIG. 1 is a plan view of a collective substrate according to the present invention.

FIG. 2 is an enlarged view of the vicinity of a board connecting portion of the collective board according to the present invention.

FIG. 3 is an enlarged view of the vicinity of a board connecting portion of a conventional collective board, and is a view showing a target of the experiment of FIG.

FIG. 4 is an enlarged view of the vicinity of the board connecting portion of the collective board according to the present invention, showing the object of the experiment of FIG.

FIG. 5 is a graph for explaining the effect of the collective substrate according to the present invention.

FIG. 6 is a plan view of a conventional collective substrate.

FIG. 7 is an enlarged view of part A of FIG.

8 is a cross-sectional view taken along the line BB of FIG. 7 when cutting the board connecting portion with a nipper.

9 is a cross-sectional view taken along the line C-C of FIG. 7 when cutting the board connecting portion with a nipper.

[Explanation of symbols]

 10 Aggregate substrate 12A, 12B, 12C Single substrate 14 Separation hole 16, 16I Stress relaxation hole 18 Chip component 20 Board connection part

Claims (1)

[Scope of utility model registration request] 1. A collective board having a plurality of single boards for mounting chip parts, wherein boundaries of these single boards are constituted by alternately arranging separation holes and board connecting portions. A collective substrate, characterized in that a hole is provided near the substrate connecting portion to reduce stress generated when the substrate connecting portion is cut.