JPH0537960U - Substrate holder for thin film processing equipment - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] The present invention relates to a substrate holder in a thin film processing apparatus that performs etching and other processing on the surface of a substrate. It is an object of the present invention to prevent a film attached to an annular member that constitutes a substrate holder from being peeled off by an internal stress and from being damaged by an internal stress of an attached film. [Structure] A substrate holder that holds a substrate 11 to be processed between two annular members 12. The annular member 12 is formed by connecting a plurality of segment parts 13.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a thin film processing apparatus for forming a thin film on the surface of a substrate, or a substrate holder in a thin film processing apparatus for etching the surface of the substrate.

[0002]

[Prior Art]

 Conventionally, as a substrate holder in the above-mentioned thin film processing apparatus, as shown in FIG. 4, one in which a substrate 2 is sandwiched between two annular members 1, 1 is known. Claw pieces 3 and 3 are provided so as to project from the inner edge of each annular member 1, and the claw pieces 3 and 3 are hooked on the edges of the substrate 2 to support the substrate 2. In the case of the substrate holder shown in the figure, the circular substrate 2 can be supported in any direction.

If the substrate 2 is a silicon substrate, the material of the annular member 1 is quartz, and the annular member 1 is manufactured integrally with the claw pieces 3 and 3.

[0004]

[Problems to be solved by the device]

 When the substrate holder as described above is used to perform thin film processing such as etching and deposition on the surface of the substrate, an impurity film is attached to the annular member 1, which causes a problem caused by the attached film. There was a point.

For example, when the substrate is a silicon substrate and the annular member is quartz, and a thin film formed on the surface of the silicon substrate is etched, there are the following problems.

That is, the substance generated in the etching process adheres to and deposits on the annular member, and the internal stress increases as the thickness of the deposited film increases. As a result, when the internal stress exceeds a certain value, the deposited film peels off, and the peeled film was a source of contamination on the substrate. In some cases, the exfoliation of the deposited film did not occur, but the increased internal stress sometimes damaged the quartz ring member.

Even when a silicon dioxide thin film is attached to the surface of the silicon substrate using the same silicon substrate and annular member as described above, the internal stress increases as the film thickness of the silicon dioxide attached to the annular member increases. Even though the material is the same as that of the annular member, the adhered film may peel off, which may be a source of contamination on the silicon substrate, or may cause damage to the annular member without peeling off. It was

[0008]

[Means for Solving the Problems]

 The present invention has been made in view of the above problems, and the internal stress of the film adhered to the annular member when the substrate is processed may cause the exfoliation of the adhered film or the damage of the annular member. It is intended to provide a board holder that does not.

The substrate holder of the present invention, which has a different purpose from the above, is a substrate holder for sandwiching a substrate to be processed between two annular members, and the annular member is formed by coupling a plurality of segment parts. It is characterized by

[0010]

[Action]

 According to the substrate holder in the thin film processing apparatus of the present invention, since the annular member is divided into a plurality of segment parts, the internal stress of the film attached to the annular member can be reduced in inverse proportion to the number of segment parts. it can. As a result, peeling of the adhered film and damage to the annular member can be prevented.

[0011]

【Example】

 An embodiment of this invention will be described below with reference to the drawings.

FIG. 1 shows a substrate holder composed of two annular members 12 and 12 so as to sandwich a disk-shaped silicon substrate 11, and each annular member is made of quartz and has four pieces. The segment parts 13, 13 are connected in an annular shape. As shown in FIG. 2, the connecting portion is formed by connecting the step portions 14 and 15 formed at the ends of the segment components 13 and 13 together by a fixing component 16 such as a screw or a nut. Claw pieces 17, 17 are integrally formed at the center of the inner side edges of each of the segment parts 13, 13.

FIG. 3 shows another embodiment of the joint portion at the ends of the segment parts 13 and 13. Therefore, the corrugated irregularities 18 and 19 (see FIG. )), Asperities 20 and 21 on a triangular wave (FIG. (B)) and sinusoidal asperities 22 and 23 (FIG. (C)) are formed so that the concavities and convexities can be fitted and coupled to each other. is there.

In order to sandwich the silicon substrate 11 with the substrate holder of the above-described embodiment, the annular members 12 and 12 are brought close to each other with the silicon substrate 11 sandwiched therebetween, and the annular member is clamped with a clamp device (not shown). Maintain close proximity of members. The edge portion of the silicon substrate 11 is hooked and supported by the claw pieces 17, 17 of the annular members 12, 12.

When surface processing such as etching and deposition is performed on the supported silicon substrate 11, substances generated during etching adhere to the surfaces of the annular members 12 and 12. In deposition, the silicon substrate 11 is deposited. The same film as the thin film formed on the surface adheres. Therefore, when etching or deposition processing is repeated on a large number of silicon substrates, the thickness of the film attached to the surface of the annular member 12 gradually increases, and the internal stress also increases, but the annular member 12 has a plurality of layers. Since the segment parts 13 and 13 are configured by being divided, the internal stress of the attached film can be suppressed to be small. As a result, it is possible to prevent the adhesion film from peeling off and contaminating the surface of the silicon substrate 11, and also to prevent the annular member 12 from being damaged.

Although the embodiment in which the annular silicon ring member 12 is used for the disk-shaped silicon substrate 11 has been described above, the present invention is not limited to this embodiment, such as a square ring-shaped annular member for a square substrate. Other shapes can be implemented. Also, the material of the annular member 12 may be silicon instead of quartz. The material of the annular member is determined in consideration of the material of the substrate and the processing atmosphere for the substrate.

[0017]

[Effect of the device]

 According to this invention, since the internal stress of the film attached to the annular member can be reduced, the substrate holder can be prevented from being contaminated by the film peeling, and can be used stably for a long time without the risk of damage. There is an effect that can be provided.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an embodiment of the present invention.

FIG. 2 is a partially enlarged cross-sectional view of the same embodiment.

3 (a), (b) and (c) are partially enlarged sectional views of another embodiment of the present invention.

FIG. 4 is an exploded perspective view of a conventional example.

[Explanation of symbols]

 11 Silicon Substrate 12 Annular Member 13 Segment Component 16 Fixed Component 17 Claw Piece

Claims (1)

[Scope of utility model registration request] 1. A substrate holder for holding a substrate to be processed between two annular members, wherein the annular member is formed by joining a plurality of segment parts together. .