JPS6116692Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a thin plate holder that facilitates handling of thin plates such as silicon wafers and glass substrates.

Because silicon wafers and glass substrates have mirror-finished surfaces, they are difficult to grip with tweezers and often slip and break.

In order to facilitate the handling of thin plates as described above, the present invention has been developed by sandwiching the thin plate with a clamping part provided on a heat-resistant and chemical-resistant member, and roughening the groove or surface provided on the opposite side of the clamping part. To provide a thin plate holder whose portion can be grasped with tweezers or the like. Hereinafter, embodiments will be described in detail with reference to the drawings.

FIG. 1 shows a first embodiment of the present invention, in which 1 is a thin plate holder, 2 is a holding part for holding the thin plate, and 3 is a thin plate holder.
is a gripping groove provided on the opposite side of the gripping portion 2.

The thin plate holder 1 is made of a material having excellent heat resistance and chemical resistance (for example, Teflon), and a thin plate, for example a silicon wafer 4, is inserted into the gap between the clamping portions 2, as shown in FIG. The gap between the clamping parts 2 is made slightly narrower than the thickness of the silicon wafer 4 so that the silicon wafer is held from both sides by the elastic force of the clamping parts 2. It is preferable that the inner surface of the clamping portion 2 be made rough so as to increase the frictional force. The gripping groove 3 is provided so that it can be easily gripped with tweezers 5.

Since this embodiment configured as described above has heat resistance and chemical resistance, even when cleaning and drying a thin plate such as a silicon wafer, it can be processed while attached to the thin plate, making it easy to handle the thin plate. This has the effect of making it safer and easier.

In this embodiment, the groove is used as the portion to be gripped by the tweezers, but instead of the groove, a roughened surface may be provided to prevent the tweezers from slipping.
Further, although the outer shape of the thin plate holder is square, it may be circular or other shapes.

As explained above, according to the present invention, heat resistance,
Silicon wafers and glass substrates can be easily handled by using a thin plate holder that has a chemical-resistant member with a holding part that holds the thin plate, and a holding groove or a rough surface on the opposite side of the holding part to make it easier to grasp with tweezers. This has the advantage of making it easier to handle and preventing damage.

[Brief explanation of the drawing]

Fig. 1 is a diagram showing the configuration of one embodiment of the present invention, Fig. 1a is a side view, Fig. 1b is a front view, and Fig. 2 is a diagram for explaining the use of Fig. 1. be. 1... Thin plate holder, 2... Clamping portion, 3... Gripping groove.

Claims (1)

[Scope of utility model registration request] It is a small piece made of a heat-resistant and chemical-resistant material, and has a clamping part that sandwiches a thin plate, and a gripping groove or a rough surface part on the opposite side of the clamping part, and the clamping part can hold a silicon wafer,
1. A thin plate holder, characterized in that the edge of a thin plate such as a glass substrate is held, and the gripping groove or rough surface is gripped with tweezers or the like.