KR20030003779A - Robot blade for manufacturing semiconductor device - Google Patents
Robot blade for manufacturing semiconductor device Download PDFInfo
- Publication number
- KR20030003779A KR20030003779A KR1020010039331A KR20010039331A KR20030003779A KR 20030003779 A KR20030003779 A KR 20030003779A KR 1020010039331 A KR1020010039331 A KR 1020010039331A KR 20010039331 A KR20010039331 A KR 20010039331A KR 20030003779 A KR20030003779 A KR 20030003779A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- robot blade
- semiconductor device
- groove
- support surface
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Abstract
Description
본 발명은 반도체 장치에 관한 것으로, 더욱 상세하게는 반도체 장치 제조용 로봇 블레이드에 관한 것이다.The present invention relates to a semiconductor device, and more particularly to a robot blade for manufacturing a semiconductor device.
반도체 웨이퍼는 통상 그 제조 과정에 있어서 웨이퍼를 카세트에 적재하거나한 공정에서 다음 공정으로 이송하기 위한 일련의 공정에서 예컨대, 로봇과 같은 자동화된 설비를 사용하고 있다.BACKGROUND OF THE INVENTION Semiconductor wafers typically use automated equipment such as, for example, robots in a series of processes for transferring wafers into cassettes or transferring them from one process to the next.
반도체 웨이퍼에 대하여 각종 처리, 예를 들면 식각이나 이온주입 등을 실시하기 위해서는 우선 다수장, 예를 들면 25장의 웨이퍼가 수납된 카세트가 로드락 챔버 내에 수용된다. 로드락 챔버 내에 수용된 카세트 내의 웨이퍼는 그 후 진공 분위기 하에서 로봇에 의하여 트랜스퍼 챔버를 통하여 공정 챔버로 보내어진다. 즉, 트랜스퍼 챔버내에 장착된 로봇은 웨이퍼를 한 번에 한 개씩 카세트로부터 해제하여 각각의 웨이퍼를 공정 챔버로 차례로 이송한다. 공정 챔버내에서 웨이퍼의 처리작업이 완료되면, 그 웨이퍼는 카세트로 복귀되며(또는 다음 처리챔버로 이송) 로봇은 다른 웨이퍼를 카세트로부터 꺼내어 공정 챔버로 이송한다.In order to perform various processes, such as etching and ion implantation, on a semiconductor wafer, the cassette which accommodates several sheets, for example, 25 wafers is first accommodated in the load lock chamber. The wafer in the cassette contained in the load lock chamber is then sent by the robot under the vacuum atmosphere to the process chamber through the transfer chamber. That is, the robot mounted in the transfer chamber releases the wafers from the cassette one at a time and transfers each wafer to the process chamber in turn. When the processing of the wafer in the process chamber is complete, the wafer is returned to the cassette (or transferred to the next processing chamber) and the robot removes the other wafer from the cassette and transfers it to the process chamber.
이러한 일련의 작업을 수행하는 로봇은 웨이퍼를 탑재하기 위한 로봇 블레이드를 포함하고 있다. 그러나, 웨이퍼 이송 도중 또는 웨이퍼를 들어올리거나 내려놓는 중에 흔들림에 의하여 웨이퍼가 로봇 블레이드에서 미끄러져 웨이퍼가 로봇 블레이드의 정위치에 놓여 있지 않게 되는 현상이 자주 발생한다. 이와 같은 웨이퍼의 미끄러짐은 로봇 블레이드가 웨이퍼 표면과 마찰력이 거의 없는 스테인레스 재질 또는 세라믹 재질로 되어 있기 때문이다. 웨이퍼가 로봇 블레이드 위에서 전후 또는 좌우로 미끄러지게 되면, 웨이퍼는 공정 챔버의 정위치에 안착되지 못하게 되며 이로 인해 공정상의 오류가 발생할 수 있다.The robot performing this series of tasks includes a robot blade for mounting a wafer. However, a phenomenon often occurs in which the wafer slides off the robot blade due to shaking during wafer transfer or lifting or lowering the wafer so that the wafer does not sit in the robot blade. Such wafer slippage is because the robot blade is made of stainless or ceramic material with little friction with the wafer surface. If the wafer slides back, forth, or left and right over the robot blade, the wafer will not be seated in the process chamber, resulting in process errors.
본 발명이 이루고자 하는 기술적 과제는 웨이퍼를 안정하고 정확하게 이송할수 있는 반도체 장치 제조용 로봇 블레이드를 제공함에 있다.An object of the present invention is to provide a robot blade for manufacturing a semiconductor device capable of transferring a wafer stably and accurately.
도 1은 본 발명의 바람직한 실시예에 따른 반도체 장치 제조용 로봇 블레이드를 도시한 평면도이다.1 is a plan view showing a robot blade for manufacturing a semiconductor device according to a preferred embodiment of the present invention.
도 2는 도 1의 반도체 장치 제조용 로봇 블레이드를 A-A' 방향으로 자른 단면도이다.FIG. 2 is a cross-sectional view of the robot blade for manufacturing the semiconductor device of FIG. 1 taken along the line AA ′. FIG.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
W : 웨이퍼100 : 로봇 블레이드W: Wafer 100: Robot Blade
102 : 평판104 : 지지면102: flat plate 104: support surface
106 : 홈108 : 부재106: groove 108: member
110 : 턱110: jaw
상기 기술적 과제를 달성하기 위하여 본 발명은, 평판과, 상기 평판의 일단 및 타단에 형성된 웨이퍼 이탈을 방지하기 위한 턱과, 상기 평판 상에 형성된 지지면과, 상기 지지면에 형성된 홈 및 웨이퍼 표면에 대하여 마찰력을 가지며 상기 홈 내에 삽입되어 상기 지지면 상부로 돌출되어 있는 부재를 포함하는 반도체 장치 제조용 로봇 블레이드를 제공한다.In order to achieve the above technical problem, the present invention provides a flat plate, a jaw for preventing the detachment of the wafer formed at one end and the other end of the flat plate, a support surface formed on the plate, a groove formed on the support surface, and a wafer surface. It provides a robot blade for manufacturing a semiconductor device comprising a member having a frictional force against and is inserted into the groove and protrudes above the support surface.
상기 웨이퍼 표면에 대하여 마찰력을 갖는 상기 부재는 고무 재질의 물질인 것이 바람직하다. 상기 고무 재질의 물질은 탄성 중합체인 것이 바람직하다.Preferably, the member having a frictional force with respect to the wafer surface is a rubber material. Preferably, the rubber material is an elastomer.
상기 지지면은 상기 평판의 네 모퉁이에 형성되어 있으며, 상기 홈은 상기 지지면 각각에 적어도 1개 이상 형성되어 있다.The support surface is formed at four corners of the flat plate, and at least one groove is formed in each of the support surfaces.
이하, 첨부된 도면을 참조하여 본 발명에 따른 바람직한 실시예를 상세하게 설명하기로 한다. 그러나, 이하의 실시예는 이 기술분야에서 통상적인 지식을 가진 자에게 본 발명이 충분히 이해되도록 제공되는 것으로서, 여러 가지 다른 형태로 변형될 수 있으며, 본 발명의 범위가 다음에 기술되는 실시예에 한정되는 것은 아니다. 도면상에서 동일 부호는 동일한 요소를 지칭한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the following embodiments are provided to those skilled in the art to fully understand the present invention, and may be modified in various forms, and the scope of the present invention is described in the following embodiments. It is not limited. Like numbers refer to like elements in the figures.
도 1은 본 발명의 바람직한 실시예에 따른 반도체 장치 제조용 로봇 블레이드를 도시한 평면도이다. 도 2는 도 1의 반도체 장치 제조용 로봇 블레이드를 A-A' 방향으로 자른 단면도이다.1 is a plan view showing a robot blade for manufacturing a semiconductor device according to a preferred embodiment of the present invention. FIG. 2 is a cross-sectional view of the robot blade for manufacturing the semiconductor device of FIG. 1 taken along the line AA ′. FIG.
도 1 및 도 2를 참조하면, 본 발명의 바람직한 실시예에 따른 반도체 장치제조용 로봇 블레이드(100)는 평판(102)과, 평판(102) 상에 형성된 지지면(104)과, 평판(102)의 일단 및 타단에 형성된 턱(110)을 가진다. 평판은(102) 평탄한 판형으로 이루어진다. 지지면(104)은 평판(102) 상의 네 모퉁이에 섬모양으로 형성되어 있다. 턱(110)은 지지면(104)에 놓이는 웨이퍼(W)가 로봇 블레이드(100)에서 이탈되는 것을 방지하는 역할을 한다.1 and 2, the robot blade 100 for manufacturing a semiconductor device according to an exemplary embodiment of the present invention may include a flat plate 102, a support surface 104 formed on the flat plate 102, and a flat plate 102. It has a jaw 110 formed at one end and the other end of the. The plate 102 is made into a flat plate shape. The support surface 104 is formed in an island shape at four corners on the flat plate 102. The jaw 110 serves to prevent the wafer W placed on the support surface 104 from being separated from the robot blade 100.
또한, 지지면(104)에는 적어도 1개 이상의 홈(106)이 형성되어 있다. 홈(106) 내에는 웨이퍼(W)의 미끄러짐을 방지하기 위하여 웨이퍼(W) 표면과 마찰력을 갖는 부재(108)가 삽입된다. 부재(108)는 지지면(104) 상부로 돌출되어 있다. 또한, 웨이퍼(W) 표면과 마찰력을 갖는 부재(108)는 고무 재질의 물질, 예컨대 탄성중합체(polyelestromer)로 이루어져 있다. 웨이퍼(W) 표면과 마찰력을 갖는 부재(108)는 홈으로부터 탈부착이 가능하다.In addition, at least one groove 106 is formed in the support surface 104. In the groove 106, a member 108 having a frictional force with the surface of the wafer W is inserted to prevent the wafer W from slipping. The member 108 protrudes above the support surface 104. In addition, the member 108 having a frictional force with the surface of the wafer W is made of a rubber material, for example, an elastomer. The member 108 having frictional force with the surface of the wafer W can be detached from the groove.
본 발명의 바람직한 실시예에 따른 로봇 블레이드(100)는 지지면(104)의 홈(106) 내에 부착된 웨이퍼(W) 표면과 마찰력을 가지는 부재(108)를 구비하기 때문에, 웨이퍼(W) 이송 도중 또는 웨이퍼(W)를 들어올리거나 내려놓는 중에 웨이퍼(W)가 로봇 블레이드(100)에서 미끄러지는 현상이 발생하지 않는다.Since the robot blade 100 according to the preferred embodiment of the present invention includes a member 108 having frictional force with the surface of the wafer W attached in the groove 106 of the support surface 104, the robot blade 100 is transferred. The wafer W does not slip on the robot blade 100 during the lifting or lifting of the wafer W.
본 발명에 의한 반도체 장치 제조용 로봇 블레이드에 의하면, 웨이퍼 표면과 마찰력이 큰 고무 재질의 물질이 구비되어 있으므로 웨이퍼의 미끄러짐이 없이 웨이퍼를 정확하고 안전하게 이송할 수 있다.According to the robot blade for manufacturing a semiconductor device according to the present invention, since a rubber material having a high frictional force with the wafer surface is provided, the wafer can be accurately and safely transferred without slipping the wafer.
이상, 본 발명의 바람직한 실시예를 들어 상세하게 설명하였으나, 본 발명은상기 실시예에 한정되는 것은 아니며, 본 발명의 기술적 사상의 범위 내에서 당 분야에서 통상의 지식을 가진 자에 의하여 여러 가지 변형이 가능하다.As mentioned above, although preferred embodiment of this invention was described in detail, this invention is not limited to the said embodiment, A various deformation | transformation by a person with ordinary skill in the art within the scope of the technical idea of this invention is carried out. This is possible.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020010039331A KR20030003779A (en) | 2001-07-02 | 2001-07-02 | Robot blade for manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020010039331A KR20030003779A (en) | 2001-07-02 | 2001-07-02 | Robot blade for manufacturing semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20030003779A true KR20030003779A (en) | 2003-01-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020010039331A KR20030003779A (en) | 2001-07-02 | 2001-07-02 | Robot blade for manufacturing semiconductor device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200471057Y1 (en) * | 2011-11-04 | 2014-02-03 | 주식회사 테스 | Substrate transfer blade |
| KR101449546B1 (en) * | 2007-10-31 | 2014-10-14 | 참엔지니어링(주) | Apparatus for transfering substrate |
| KR20170054249A (en) * | 2015-10-22 | 2017-05-17 | 램 리써치 코포레이션 | Automated replacement of consumable parts using interfacing chambers |
-
2001
- 2001-07-02 KR KR1020010039331A patent/KR20030003779A/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101449546B1 (en) * | 2007-10-31 | 2014-10-14 | 참엔지니어링(주) | Apparatus for transfering substrate |
| KR200471057Y1 (en) * | 2011-11-04 | 2014-02-03 | 주식회사 테스 | Substrate transfer blade |
| KR20170054249A (en) * | 2015-10-22 | 2017-05-17 | 램 리써치 코포레이션 | Automated replacement of consumable parts using interfacing chambers |
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