JPH0537496Y2 - - Google Patents
Info
- Publication number
- JPH0537496Y2 JPH0537496Y2 JP1987039329U JP3932987U JPH0537496Y2 JP H0537496 Y2 JPH0537496 Y2 JP H0537496Y2 JP 1987039329 U JP1987039329 U JP 1987039329U JP 3932987 U JP3932987 U JP 3932987U JP H0537496 Y2 JPH0537496 Y2 JP H0537496Y2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- copper foil
- foil pattern
- insulating film
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012790 adhesive layer Substances 0.000 claims description 74
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 56
- 239000011889 copper foil Substances 0.000 claims description 56
- 239000010410 layer Substances 0.000 claims description 15
- 230000002265 prevention Effects 0.000 claims 1
- 238000005452 bending Methods 0.000 description 19
- 230000001154 acute effect Effects 0.000 description 8
- 239000004020 conductor Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987039329U JPH0537496Y2 (de) | 1987-03-17 | 1987-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987039329U JPH0537496Y2 (de) | 1987-03-17 | 1987-03-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63147868U JPS63147868U (de) | 1988-09-29 |
| JPH0537496Y2 true JPH0537496Y2 (de) | 1993-09-22 |
Family
ID=30852387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987039329U Expired - Lifetime JPH0537496Y2 (de) | 1987-03-17 | 1987-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537496Y2 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220064284A (ko) * | 2020-11-11 | 2022-05-18 | 지이에프 테크 컴퍼니 리미티드 | 방열 전도성 연성 판 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4606181B2 (ja) * | 2005-01-17 | 2011-01-05 | 京セラ株式会社 | 多層配線基板 |
| JP5434167B2 (ja) * | 2009-03-17 | 2014-03-05 | 株式会社村田製作所 | 回路基板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57104560U (de) * | 1980-12-17 | 1982-06-28 |
-
1987
- 1987-03-17 JP JP1987039329U patent/JPH0537496Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220064284A (ko) * | 2020-11-11 | 2022-05-18 | 지이에프 테크 컴퍼니 리미티드 | 방열 전도성 연성 판 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63147868U (de) | 1988-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5993579A (en) | High performance electrical cable and method of manufacture | |
| KR102500436B1 (ko) | 연성기판 | |
| US6350387B2 (en) | Multilayer combined rigid/flex printed circuit board containing flexible soldermask | |
| US5121297A (en) | Flexible printed circuits | |
| US5516989A (en) | Structure of the flexing section of a multilayer flexible circuit board | |
| US7286370B2 (en) | Wired circuit board and connection structure of wired circuit board | |
| US8178191B2 (en) | Multilayer wiring board and method of making the same | |
| JPH04212494A (ja) | 剛性／可撓性プリント回路構造体の製作方法とこの方法により製作された多層可撓性回路基板 | |
| JP2773366B2 (ja) | 多層配線基板の形成方法 | |
| TWI712346B (zh) | 復合電路板及其製造方法 | |
| EP0749673B1 (de) | Herstellung einer mehrschichtigen kombinierten starr-flexiblen leiterplatte | |
| JPH0537496Y2 (de) | ||
| JP2006128360A (ja) | プリント配線板およびその製造方法 | |
| US5877940A (en) | Fabrication multilayer combined rigid/flex printed circuit board | |
| JP4398626B2 (ja) | 積層回路 | |
| WO1988002978A1 (en) | Multi-layer printed circuit board and a method of fabricating the same | |
| JP2010040934A (ja) | リジッドフレックス回路板 | |
| JPH0412702Y2 (de) | ||
| TWI760973B (zh) | 超長電路板及其製備方法 | |
| TW202114502A (zh) | 軟硬複合線路板 | |
| US20080017305A1 (en) | Method for fabricating multi-layered printed circuit board without via holes | |
| JPH0426190A (ja) | 多層フレキシブル印刷配線板 | |
| JPH01286339A (ja) | 多層プリント配線板 | |
| TWM526749U (zh) | 薄膜開關結構 | |
| JPS60236278A (ja) | 配線用板 |