JPH0536275Y2 - - Google Patents

Info

Publication number
JPH0536275Y2
JPH0536275Y2 JP1988159576U JP15957688U JPH0536275Y2 JP H0536275 Y2 JPH0536275 Y2 JP H0536275Y2 JP 1988159576 U JP1988159576 U JP 1988159576U JP 15957688 U JP15957688 U JP 15957688U JP H0536275 Y2 JPH0536275 Y2 JP H0536275Y2
Authority
JP
Japan
Prior art keywords
circuit board
conductor
package
semiconductor
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988159576U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0189752U (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988159576U priority Critical patent/JPH0536275Y2/ja
Publication of JPH0189752U publication Critical patent/JPH0189752U/ja
Application granted granted Critical
Publication of JPH0536275Y2 publication Critical patent/JPH0536275Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1988159576U 1988-12-08 1988-12-08 Expired - Lifetime JPH0536275Y2 (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988159576U JPH0536275Y2 (OSRAM) 1988-12-08 1988-12-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988159576U JPH0536275Y2 (OSRAM) 1988-12-08 1988-12-08

Publications (2)

Publication Number Publication Date
JPH0189752U JPH0189752U (OSRAM) 1989-06-13
JPH0536275Y2 true JPH0536275Y2 (OSRAM) 1993-09-14

Family

ID=31440912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988159576U Expired - Lifetime JPH0536275Y2 (OSRAM) 1988-12-08 1988-12-08

Country Status (1)

Country Link
JP (1) JPH0536275Y2 (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016048728A (ja) * 2014-08-27 2016-04-07 株式会社村田製作所 導電性ポスト、及び、導電性ポストを用いた積層基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5559746A (en) * 1978-10-27 1980-05-06 Hitachi Ltd Semiconductor device and its mounting circuit device
JPS5743452A (en) * 1980-08-28 1982-03-11 Mitsubishi Electric Corp Mounting structure for integrated circuit substrate
JPS5791586A (en) * 1980-11-29 1982-06-07 Tokyo Shibaura Electric Co Hybrid integrated circuit device
JPS57121256A (en) * 1981-01-21 1982-07-28 Hitachi Ltd Ceramic multilayer wiring structure
JPS57181144A (en) * 1981-05-01 1982-11-08 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
JPH0189752U (OSRAM) 1989-06-13

Similar Documents

Publication Publication Date Title
US4724472A (en) Semiconductor device
US5381039A (en) Hermetic semiconductor device having jumper leads
JP3032964B2 (ja) ボールグリッドアレイ半導体のパッケージ及び製造方法
JP3011233B2 (ja) 半導体パッケージ及びその半導体実装構造
US6188127B1 (en) Semiconductor packing stack module and method of producing the same
US5602059A (en) Semiconductor device and method for manufacturing same
US5942795A (en) Leaded substrate carrier for integrated circuit device and leaded substrate carrier device assembly
US5367124A (en) Compliant lead for surface mounting a chip package to a substrate
US6486551B1 (en) Wired board and method of producing the same
US6376905B2 (en) Semiconductor package
KR100248035B1 (ko) 반도체 패키지
US4396971A (en) LSI Chip package and method
JPH0536275Y2 (OSRAM)
JP3432552B2 (ja) 窒化アルミニウム多層基板
JP2715974B2 (ja) 半導体装置及びその製造方法
JPS63229842A (ja) 表面実装用パツケ−ジ
JPH10261735A (ja) 半導体装置およびその製造方法
JP2001044326A (ja) 半導体装置およびその製造方法
EP0646963A1 (en) Multi-chip module and manufacturing method thereof
JPH0368163A (ja) 半導体装置
JPH09148334A (ja) バンプ、バンプを有する半導体チップ及びパッケージ並びに実装方法及び半導体装置
JP3127948B2 (ja) 半導体パッケージ及びその実装方法
KR19980083259A (ko) 칩 싸이즈 반도체 패키지의 구조 및 그 제조 방법
JPH10209213A (ja) 半導体装置およびその製造方法
JPH10209212A (ja) 半導体装置およびその製造方法