JPH05343477A - Tab tape and manufacture of molded package - Google Patents

Abstract

PURPOSE:To obtain a small-sized molded package by a method wherein an improved TAB tape is used, the outflow of a molding resin in a molding operation is prevented, the efficiency of the molding operation is enhanced and materials are saved. CONSTITUTION:An IC chip 4 is inserted in a device hole 3 which has been made in a film carrier 1; an improved TAB tape 19 in which dam bars 10 used to bury parts between inner leads 6 so as to be the same height as the inner leads 6 is used; only the IC chip 4 and the inner leads 6 are molded on the film carrier at the outer circumference of the device hole 3; the leads are separated and a molded package is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a mold package in which an IC chip such as an LSI is molded with resin. More specifically, a manufacturing method for obtaining a mold package by using a TAB tape that has been IC-bonded by so-called tape automated bonding (hereinafter referred to as TAB) of an IC chip such as an LSI on a film carrier, and an improvement used for the manufacturing. The present invention relates to a produced TAB tape.

[0002]

2. Description of the Related Art In molding IC chips such as LSI with resin, a mold package using a TAB tape already bonded to an IC is well known, and an IC bonding method using this TAB tape is USP 3,689,991.
Gazette, or Japanese Patent Publication No. 47-3206 corresponding thereto
It is well known from the publication. For example, FIGS. 4 to 7 show an embodiment in which a mold package is manufactured using a conventional TAB tape, and FIG. 4 is a front sectional view for explaining a state during transfer molding, and FIGS. 7 is a sectional view for explaining the state of the seal portion. FIG. 5 shows a case where the adhesive 15 extruded from below the inner lead 6 has a sealing function, and FIG. 6 shows a case where the sealing resin 16 has a sealing function.

As a known method for manufacturing a mold package, a film carrier having a sprocket hole is provided with a device hole and an outer lead hole on the outer side thereof, and a film between the device hole and the outer lead hole is used as a support ring. The remaining film carrier is used. In manufacturing, a film carrier with sprocket holes is used, and device holes and outer lead holes are punched into this, a copper foil is laminated, leads are formed by etching and plating, and then IC chips are formed in the device holes. Insert and connect the IC electrode and the inner lead through the bump,
The C chip and the inner lead portion are transfer-molded with resin and sealed, and the molded IC package is taken out.

In this manufacturing process, the support ring provided on the film carrier supports the leads.
That is, when performing transfer molding, IC
A mold is provided with a space for enclosing the chip, and the mold is sandwiched between the molds from above and below to allow the resin to flow into the space. In this case, the upper and lower mold sealing surfaces sandwich the outer circumference of the support ring to prevent the inflowing resin from leaking out, but there is a gap between the adjacent leads on the support ring. Therefore, there is a problem that the mold resin is extruded from the void. In order to prevent the mold resin from flowing out, it is necessary to fill the gap between the leads.

For this purpose, a sealing resin is applied on the leads and the voids in advance, and the mold is closed in this state.
A method is used in which the gap is filled with a sealing resin by heating and pressurizing. When a lead is formed by etching using a TAB tape obtained by adhering a film carrier and a copper foil for forming a lead with an adhesive such as an epoxy resin, the support ring portion is pressed by a high temperature die sealing surface. As a result, the adhesive is extruded from below the leads to fill the voids. The support ring not only supports the leads, but also functions as a pedestal for the sealing resin and the adhesive to fill such voids.

[0006] However, such a method for preventing the outflow of the mold resin has not necessarily achieved sufficient results. In other words, when the lead spacing is large, the method of extruding the adhesive under the leads to seal them is difficult to fill the gaps between the leads, leaving voids and causing the mold resin to flow out. Has occurred. Further, even when the lead interval is not so large and the adhesive extruded from below the lead fills the voids, the adhesive layer below the lead becomes thin and the adhesive force between the lead and the film decreases. Causes the problem. Even when the sealing resin is applied onto the voids in advance, if the application amount is not appropriate, the mold resin cannot be prevented from flowing out, or the sealing resin may run out, which causes a problem. In this way, when molding, the support ring that is effectively used to prevent the outflow of the molding resin does not have to be present after the molding is completed. There is an inconvenience that

[0007]

In order to solve such a problem, the present inventors did not use a support ring which is not particularly necessary after the molding was completed, and the support ring fulfilled the molding resin at the time of molding. Method for manufacturing molded chip using TAB package capable of suppressing effluent and improved TAB used for manufacturing
It provides a package.

[0008]

The present invention includes: A TAB tape characterized in that a dam bar is provided at the same height as the leads between the leads near the inner circumference of the device hole formed in the film carrier to fill the gap between the leads. 2. Using the TAB tape of 1 above, I in the device hole
After inserting the C chip and connecting the lead and the IC electrode through the bump, only the IC chip and the inner lead inside the dam bar are transfer-molded, and then the dam bar between the leads is separated. Mold package manufacturing method. By doing so, the purpose is achieved.

A detailed description will be given below with reference to the drawings. 1 and 2 show an embodiment of the present invention. FIG. 1 is a plan view showing a state in which an IC chip 4 is placed on a TAB tape 19, and FIG. 2 is a transfer molding of the TAB tape 19 to which the IC chip 4 is joined. FIG. 6 is a front cross-sectional view for explaining a state when the operation is performed. In the figure, 1 is a film carrier, 2
Is a sprocket hole formed on both sides of the film carrier, and 3 is a device hole formed in the center of the film carrier. Reference numeral 4 is an IC chip housed in the device hole 3. 5 is an outer lead, 6 is an inner lead, and the end of the outer lead 5 is a test pad 7,
The ends of the inner leads 6 are connected to the IC electrodes 14 of the IC chip via bumps 18, respectively. 9 is a tie bar and 10 is a dam bar. Reference numeral 11 is an upper mold, 12 is a lower mold, and 13 is a molding resin.

The manufacturing method of the present invention is an improved TAB tape 1.
Use 9. FIG. 3 is a cross-sectional view illustrating a state of a seal portion when a mold package is manufactured using the improved TAB tape. Reference numeral 15 is an adhesive, 16 is a sealing resin, and 17 is a support ring. In the improved TAB tape 19, as the film carrier 1, a TAB film which has been widely used conventionally can be used as it is. For example, there is no particular limitation as long as it is a resin film made of polyimide, polyester, or the like, which is processed by giving a predetermined thickness. Sprocket Hall 2,
The TA that is conventionally used is also used to form the device hole 3.
It is similar to the case for B.

Improved TAB for use in the present invention
No holes need to be drilled in the film carrier of the tape 19 other than sprocket holes and device holes. That is, it is not necessary to provide the outer lead hole. The improved TAB tape 19 is provided with the dam bar 10. As shown in FIG. 2, the dam bar 10 is preferably provided near the inner peripheral portions of the seal surfaces of the upper and lower molds 11 and 12 of the device hole 3 and as close as possible to the void portion filled with the mold resin 13. .. The dam bar 10 is a device hole 3 formed in the film carrier 1 described above.
Outer lead 5 and inner lead 6 at predetermined positions inside
It is provided at a boundary portion between the outer lead 5 and the outer lead 5 so as to fill the space between the outer leads 5 and form a rectangular cross section having the same height as these leads.

A specific method of forming such a dam bar 10 is, for example, that the device hole 3 is formed in the film carrier 1.
When the inner lead 6 and the outer lead 5 are formed by punching, attaching copper foil to this, and etching, the dam bar 1
It is formed to be 0 at a predetermined position so as to fill the space between the outer leads 5 with a predetermined width. Since the copper foil having a uniform thickness is formed by etching, the dam bar has the same height as the inner lead and the outer lead. The tie bar 9 is formed of the same material as the dam bar and at the same height so as to connect the ends of the dam bar 10 to reinforce the strength of the material forming the dam bar 10. This tie bar is a reinforcement for the dam bar and need not necessarily be formed if the dam bar has sufficient strength.

FIG. 2 shows a state in which transfer molding is performed using the improved TAB tape 19. The sealing surfaces of the upper mold 11 and the lower mold 12 used in the present invention and the space filled with the molding resin 13 are located in the device hole 3 as shown in FIG. 2 and are improved as shown in FIG. IC chip 4 bonded to the TAB tape
The upper die 11 and the lower die 12 are engaged with each other so as to enclose the inner lead 6 portion. At this time, the conventional T
If the AB tape 19 is used, as shown in FIG. 4, the support ring 17 is interposed between the upper and lower metal molds 11 and 12 and the inside thereof. A cross section in the transverse direction of the upper and lower mold seal portions is as shown in FIG.

In FIG. 5, the adhesive 15 under the inner lead 6 is pressed by being pressed by the upper and lower molds 11 and 12 at high temperature.
Is extruded to fill the space (a) between the inner leads. When the space between the adjacent inner leads 6 is wide, as shown in FIG. 7, the amount of the extruded adhesive is not sufficient, and a space (b) where resin is not filled remains between the inner leads, and during transfer molding. In some cases, the mold resin may leak outside from this space (b). FIG. 6 shows a state in which the seal resin 16 is applied in advance on the leads and in the gap (c) between the leads. If the application amount of the sealing resin is not appropriate and uniform over the entire circumference of the sealing surface, the space where the sealing resin is not filled is left and the outflow of the molding resin cannot be prevented, or the excess sealing resin overflows toward the outer lead 5 and burrs. Inconvenience occurs.

In the manufacturing method of the present invention using the improved TAB tape 19 shown in FIGS. 1 and 2, the upper and lower molds are engaged with each other in the cross section shown in FIG. 3, and there is no support ring and the film is not formed. All outside the mold sealing surface. Since this improved mold package does not require a support ring, the mold package using this TAB tape is small and the mounting space on the printed board can be reduced. That is, the portions where the upper and lower molds 11 and 12 mesh with each other are closed by the inner lead 6 and the dam bar 10, respectively, so that there is no gap through which the mold resin leaks. In this state, the mold resin 13
Is fed into the space between the upper and lower molds 11 and 12 to mold the IC chip 4 and the inner leads 6. Therefore, only the IC chip 4 and the inner leads 6 are present in the molded portion, and the film carrier 1 is not present.

After the molding is completed, the molds 11 and 12 are removed, and the dam bar portion of the lead, which is substantially integrally connected by the dam bar 10, is cut off and separated to complete the mold chip. According to the present invention, the outflow of the molding resin during transfer molding to the outside of the molds 11 and 12 can be significantly reduced as compared with the case where the conventional support ring is provided because the dam bar 10 is provided. .. Further, the mold resin does not leak and stain the mold, and the working efficiency is improved. As a result, the defective rate at the time of molding is higher than that of the conventional one with a support ring.
It can be significantly reduced.

Further, in the present invention, since the support ring is not provided, the size of the completed molding can be reduced to the necessary minimum. This is IC
This greatly contributes to the miniaturization of the portion where the chip 4 is used. Also, of course, there are material savings as many device holes can be provided on the same length film carrier.

[0018]

As described above, the present invention saves the materials used in manufacturing the TAB package, improves the processing efficiency in the manufacturing process of the mold package, reduces the occurrence of defective products, and obtains the molded package. It is possible to miniaturize, and to bring about excellent industrial effects that are rich in practicality.

[0019]

[Brief description of drawings]

FIG. 1 is a plan view of an IC-bonded TAB tape used in an embodiment of the present invention.

FIG. 2 is a front sectional view of the TAB tape during transfer molding.

FIG. 3 is an enlarged sectional view of a seal portion of FIG.

FIG. 4 is a front cross-sectional view of a conventionally used TAB tape during transfer molding.

5 is a partial cross-sectional view of the seal portion of FIG. 4 taken along the line AA.

FIG. 6 is a partial cross-sectional view of a mode different from the seal portion of FIG.

FIG. 7 is a partial cross-sectional view of a mode different from the seal portion of FIG.

[0020]

[Explanation of symbols]

 1: film carrier 2: sprocket hole 3: device hole 4: IC chip 5: outer lead 6: inner lead 7: test pad 8: pad 9: tie bar 10: dam bar 11: upper mold 12: lower mold 13: mold Resin 14: IC electrode 15: Adhesive 16: Seal resin 17: Support ring 18: Bump 19: TAB tape

Claims (2)

[Claims] 1. A TAB characterized in that a dam bar is provided between leads near the inner circumference of a device hole formed in a film carrier so as to fill the gap between the leads at the same height as the leads.
tape. 2. An IC chip is inserted into a device hole using the TAB tape according to claim 1, the lead and the IC electrode are connected via a bump, and then only the inner lead inside the IC chip and the dam bar is transfer-molded. Then
Then, a method of manufacturing a mold package, characterized in that the dam bar between the leads is separated.