JPH05335788A - Equipment and method for mounting electronic component - Google Patents

Abstract

PURPOSE:To speed up the carriage of a substrate in an electronic component mounting line by preventing the substrates from colliding with each other between adjacent conveyors and to prevent the substrate from being rubbed by a rotating belt and thereby damaged while the substrate is standing by at a stand-by position on a front conveyor. CONSTITUTION:A front conveyor 8 is provided with lifting boards 58 and 59 for lifting from on a belt 30 a substrate S which is standing by at a stand-by position (b) or (c) on the front conveyor 8. The lifting boards 58 and 59 are so installed that they may be elevated freely by elevation devices 50 and 51.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and mounting method, and more particularly, to speeding up the transfer speed of a substrate on an electronic component mounting line while preventing collision of the substrates between adjacent conveyors. The present invention also relates to an electronic component mounting apparatus and a mounting method capable of avoiding damage to a substrate by sliding contact with a rotating belt of the front conveyor while the substrate is on standby at the standby position of the front conveyor.

[0002]

2. Description of the Related Art Chip type electronic parts such as QFP, SOP, resistor chip, capacitor chip (hereinafter "chip")
Is mounted on the board, the electronic component mounting line is a screen printing section that applies cream solder to the electrodes of the board, an electronic component mounting section that mounts the chip on the electrodes of the board, and the cream solder that bonds the chip to the electrodes is heated. It is configured by arranging reflow units for processing in parallel.

FIG. 8 is a front view of a conventional electronic component mounting line. It should be noted that the electronic component mounting line is divided by I2-I2 in order to make the drawing clearer by enlarging the scale. Reference numeral B denotes a rotary head type electronic component mounting portion. A large number of transfer heads 3 are provided below the rotary head 1 of the electronic component mounting portion B along the circumferential direction of the rotary head 1. By rotating in the direction of the arrow N, the transfer head 3 adsorbs the chip P of the chip supply unit (not shown) onto the nozzle 2 to pick it up, and the substrate S
To be transferred and loaded. A central conveyor 10 is arranged below the rotary head 1, and the central conveyor 10 is composed of an X table 4, a Y table 5, and a Z table 6.
It is placed on the YZ table 7. Central conveyor 10
On the loading side of the board S, a front conveyor 8 is provided for loading the board S having the solder portion formed thereon through the screen printing section A into the central conveyor 10.
On the unloading side of the substrate S, a rear conveyer 12 is provided for unloading the substrate S on which the chips P are mounted by the electronic component mounting portion B from the central conveyor 10 to the reflow portion C in the subsequent process. The conveyors 8, 10 and 12 are all belt conveyors.

A positioning unit 15 is provided on the central conveyor 10 for clamping and positioning the substrate S from both sides. Above the end of the central conveyor 10 on the unloading side of the substrate S, the substrate S is provided. A cylinder 16 is provided as a stopper for stopping the motor at a mounting position a immediately below the rotary head 1. By projecting the rod 17 of the cylinder 16, the substrate S transported on the central conveyor 10 is stopped at the mounting position a, and the rod 17 is retracted to be carried out to the rear conveyor 12. Further, a first cylinder 18 and a second cylinder 26 as stoppers are provided at predetermined intervals also on the end portion and the central portion of the front conveyor 8 on the unloading side of the substrate S, and the first cylinder 1
The substrate 19 is stopped at the first standby position b by projecting and retracting the rod 19 of No. 8 and is carried out to the next central conveyor 10. Further, the substrate S is stopped at the second standby position c by projecting and retracting the rod 27 of the second cylinder 26,
Further, it is carried out to the next first standby position b.

M1, M2, M3 are conveyors 8, 10,
Motors 12 are driven, and reference numerals 30, 31, 32 are belts arranged on the conveyors 8, 10, 12. Three
Reference numeral 8 is a pulley having a belt 30 and a belt 32. The feeding speed of the substrate S of each conveyor 8, 10, 12 is
The front conveyor 8 is V1, the central conveyor 10 is V2, and the rear conveyor 12 is V3. These speeds V1, V2, V3
The relationship is such that V1 = V2 = V3 so that the feed speeds of the conveyors 8, 10, 12 are equal. 33 is a main body box of the front conveyor 8, 34 is a rear conveyor 1
It is the body box of 2.

The conventional means has the above-mentioned structure, and the operation will be described below. In FIG. 8, the substrate S that has passed the screen printing unit A is transferred from the front conveyor 8 to the central conveyor 10
It is loaded into the cylinder 16, hits the rod 17 of the cylinder 16, stops at the mounting position a of the central conveyor 10, and is clamped and positioned by the positioning unit 15. Next Z table 6
Drive the central conveyor 10 down to the position indicated by the chain line in the figure. Then, while moving the central conveyor 10 in the XY directions by the XY tables 4 and 5, the chips P attracted to the nozzles 2 of the transfer head 3 are transferred to the substrate S. Are sequentially transferred and mounted at the predetermined coordinate positions. During this mounting, the succeeding substrate S is sequentially conveyed from the screen printing section A to the front conveyor 8, and the succeeding first substrate S hits the rod 19 of the first cylinder 18 to reach the first standby position of the front conveyor 8. In the second waiting position b, the subsequent second substrate S hits the rod 27 of the second cylinder 26 and waits in the second waiting position c.

When the mounting of the chip P is completed, the Z table 4 is driven to raise the central conveyor 10 to the position shown by the solid line in the figure, and the rod 17 of the cylinder 16 is pulled in.
The substrate S on which the chips P are mounted is unloaded from the central conveyor 10 to the rear conveyor 12, and is transported to the reflow unit C in the next step. At the same time, the cylinder 18 on the front conveyor 8,
The rods 19 and 27 of 26 are pulled in, the substrate S at the first standby position b is carried into the central conveyor 10, the substrate S at the second standby position c is sent to the first standby position b, and the screen printing unit The substrate S is unloaded from A to the second standby position c. Thereafter, the chips P are sequentially mounted on the substrate S by repeating the same operation as described above.

[0008]

By the way, the electronic component mounting section B tries to shorten the mounting time as much as possible so that the chips P can be mounted on the substrate S at an extremely high speed (5 or more per second). However, the feeding speed of the conveyors 8, 10, 12 is extremely slow, and it takes a long time of several seconds to carry the substrate S from the screen printing section A to the reflow section C by the front conveyor 8, the central conveyor 10, and the rear conveyor 12. is doing. Therefore, even if the mounting speed of the electronic component mounting section B is increased to shorten the mounting time, each conveyor 8,
Since the transfer speed of the substrate S by the 10 and 12 is slow, the total time from mounting the chip P on the substrate S carried out from the screen printing unit A to sending it to the reflow unit C in the next step is substantially small. The reality is that it has not been shortened.

In order to solve this, each conveyor 8,
It is conceivable to increase the feed speeds V1, V2, V3 of 10 and 12 equally. However, in this case, especially when the substrate S is a large one having the full length of the conveyor, at the start of driving the conveyor, The substrate S on the front conveyor 8 is likely to collide with the substrate S on the central conveyor 10, the substrate S on the central conveyor 10 is likely to collide with the substrate S on the rear conveyor 12, that is, the subsequent substrate S is likely to collide with the preceding substrate S. The problem arises.

Further, the motor M1 of the front conveyor 8 can instantly convey the substrate S when the substrate S waiting at the first waiting position b or the second waiting position c moves to the next stop position. In addition, the substrate S is always driven even while the substrate S is on standby. Therefore, there is a problem that the substrate S waiting at the first waiting position b or the second waiting position c of the front conveyor 8 is liable to be damaged by sliding contact with the rotating belt 31.

Therefore, the present invention is a belt in which substrates can be conveyed at a high speed while preventing them from colliding with each other when the substrates move to the next conveyor, and the substrates waiting at the standby position of the previous conveyor rotate. An object of the present invention is to provide an electronic component mounting apparatus and a mounting method that are not slidably contacted with and damaged.

[0012]

SUMMARY OF THE INVENTION The present invention is a front conveyer comprising a belt conveyer, which is disposed below a standby position of a substrate and which lifts the substrate from the belt of the front conveyer, and the lifting means. And an elevating means for elevating and lowering.

[0013]

In the above construction, in the present invention, when the substrate is on standby at the standby position of the front conveyor, the standby substrate is lifted by the lifting plate and separated from the belt. As a result, the substrate waiting at the standby position of the front conveyor does not come into sliding contact with the rotating belt and is damaged.

[0014]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a front view of an electronic component mounting line according to the present invention. In the figure, the electronic component mounting line is divided by I1-I1 for the sake of clarity and clarity. In the figure, the same components as those of the conventional apparatus shown in FIG. In this device, the feeding speed V1 of the front conveyor 8 and the central conveyor 10
The feed speed V2 of the rear conveyor 12 and the feed speed V3 of the rear conveyor 12 are
The relationship is V1> V2 <V3 so that the central conveyor 10 is slower than the front conveyor 8 and the rear conveyor 12 is faster than the central conveyor 10. The speed ratio is, for example, V1: V2: V3 = 2: It is 1: 2.

Further, in the main body box 33 of the front conveyor 8, a pair of lifting devices for individually lifting the substrate S waiting at the first waiting position b and the substrate S waiting at the second waiting position c, respectively. 35 and 36 are arranged, and at the end of the rear conveyor 12 on the substrate S loading side, a high-speed feeder for conveying the substrate S unloaded from the central conveyor 10 to the rear conveyor 12 at high speed. 37 is provided. The main body box 33 is provided with interval adjusting means for adjusting the interval between the front conveyors 8 according to the type of the substrate S prior to mounting the chips P on the substrate S. The interval adjusting means will be described below with reference to FIG.

FIG. 5 is a perspective view of the front conveyor 8 and its drive system. Reference numeral 40 denotes an L-shaped fixed plate, and a movable plate 41 that moves in the Y direction according to the type of substrate S is provided on the fixed plate 40. The front conveyor 8 is attached to the upper ends of the fixed plate 40 and the movable plate 41. At the central portions of the fixed plate 40 and the movable plate 41 and the end portion on the unloading side of the substrate S, the lifting plate 5 to be described later is provided.
Four openings 40 for inserting both ends of 4, 55
a and 41a are formed. These fixed plates 4
0 and the movable plate 41 constitute the main body box 33.

Reference numeral 42 is a pair of guide rails provided on both sides of the fixed plate 40 and extending in the Y direction (width direction of the substrate S), and 43 is a slider provided on the lower surface of the movable plate 41. Reference numeral 44 is a nut provided on the movable plate 41, and 45 is a ball screw with which the nut 44 is screwed. When the motor 46 is driven, the ball screw 45 rotates, the movable plate 41 moves in the Y direction along the guide rail 42, and the gap between the front conveyors 8 is adjusted according to the type of the substrate S. The interval adjusting means is also provided in the central conveyor 10 and the rear conveyor 12, which are not shown. Next, the substrate S lifting devices 35, 3
6 will be described in detail.

In FIG. 5, reference numerals 50 and 51 denote cylinders, which are provided at the end of the fixed plate 40 on the unloading side of the substrate S and at the center thereof. Rod 52 of cylinder 50
Elevating plates 54 and 55 extending in the Y direction are provided at the tip of the rod 53 of the cylinder 51. Lift plate 54,
55 has substantially the same length as the width of the lower surface of the fixed plate 40 in the Y direction. A guide rod 56 is vertically provided on the lower surface of one end of each of the elevating plates 54 and 55, and the guide lot 56 is slidably inserted into a guide ring 57 provided upright on the fixed plate 40. Cylinders 50, 51
When the rods 52 and 53 are driven to move in and out, the lifting plate 5
4, 55 move up and down.

Reference numeral 58 denotes a pair of left and right lifting plates as lifting means for lifting the substrate S standing by at the standby position b from the belt 30, and 59 also lifting the substrate S waiting at the standby position c from the belt 30. It is a pair of left and right lifting plates as means. 60 is placed on both ends of the lifting plates 54, 55, and each lifting plate 58,
It is a lifting unit for lifting 59. Cylinder 50,5
When the elevating plates 54 and 55 are moved up and down by the drive of 1, the lifting plates 58 and 59 are moved up and down via the lifting portion 60. Next, the lifting portion 60 will be described with reference to FIG.

FIG. 6 is a sectional view of the front conveyor 8. Figure 6
In the left half (a), the lower state of the front conveyor 8 is
The right half (b) shows the ascending state. A bearing 62 attached to a block 68 is provided below the support bracket 61 of the front conveyor 8, and an elevating shaft 63 is inserted into the bearing 62 so as to be vertically movable. A rotatable roller 64 is provided below the elevating shaft 63, and the lifting plate 58 disposed above the block 68 is provided above the elevating shaft 63. When the movable plate 41 moves in the Y direction by driving the motor 46, the roller 64 on the movable plate 41 side moves while rotating on the elevating plate 54. The roller 64 on the fixed plate 40 side
May be a fixed roller that does not rotate. A spring 65 that urges the elevating shaft 63 downward is provided between the bearing 62 and the lower portion of the elevating shaft 63.

As shown in FIG. 6B, when the rod 52 of the cylinder 50 is projected, the elevating plate 54 rises, whereby the spring 65 contracts and the elevating shaft 63 rises by a height t to push up the pushing plate. 58 pushes up the lower surface of the substrate S by its upper end, and lifts the substrate S from the belt 30. Further, as shown in FIG.
When the rod 52 is pulled in, the elevating plate 54 descends.
Then, the elevating shaft 63 is caused by the spring force of the spring 65.
Is lowered, the push-up plate 58 is lowered and separated from the lower surface of the substrate S, and the substrate S is again grounded on the belt 30. The lifting plate 5 is formed by these components 50 to 57 and 62 to 65.
Elevating means for raising and lowering 8, 59 is configured. The lifting portion 60 of the lifting device 36 has the same configuration and operation. Next, the high-speed feeding device 37 provided on the rear conveyor 12 will be described with reference to FIG.

In FIG. 7, reference numeral 70 denotes a base plate, and a guide rail 71 extending in the vertical direction is provided on the base plate 70. A slider 72 is provided on the elevating plate 73. The motor 7 is provided below the lifting plate 73.
4 is provided, and a drive roller 76 is attached to the output shaft 75 of this motor 74. Reference numeral 77 denotes a support bracket of the rear conveyor 12, and a driven roller 78 for the drive roller 76 is rotatably provided at the end of the support bracket 77 on the substrate S loading side. 79 is a cylinder provided on the base plate 70, and the rod 80 is the coupling 8
It is connected to the connecting rod 82 protruding from the upper end portion of the elevating plate 73 by 1. 83 is the substrate S with the rear conveyor 1
It is a substrate detection sensor for detecting that it has been transported to 2. When the sensor 83 detects the edge of the substrate S,
The motor 74 is driven to convey the substrate S at a high speed.

The present apparatus has the above-mentioned structure, and its operation will be described below. In FIG. 5, the motor 46 is driven in advance to rotate the ball screw 45, move the movable plate 41 in the Y direction, and adjust the distance between the front conveyors 8 so as to correspond to the width of the substrate S. deep. Incidentally, although not shown, the central conveyor 10 and the rear conveyor 12 also perform the same interval adjustment.

In FIG. 1, the substrate S on which the solder portion is formed after passing through the screen printing portion A is carried into the central conveyor 10 from the front conveyor 8 and hits the rod 17 of the cylinder 16 at the mounting position a of the central conveyor 10. Stop and
It is positioned by the positioning unit 15.

Next, as shown in FIG. 2, the central conveyor 10 is lowered by the Z table 6 to move the XY tables 4 and 5.
Is driven to move the substrate S in the XY directions, and the chip P attracted by the nozzle 2 of the transfer head 3 by the electronic component mounting section B is transferred and mounted on the substrate S. During the mounting work of the chip P, the succeeding substrate S is sequentially conveyed from the screen printing section A to the front conveyor 8, and the succeeding first substrate S is applied to the rod 19 of the cylinder 18 as shown by the solid line in the figure. And waits at the first waiting position b, and as shown by the chain line in the figure, the subsequent second substrate S is brought into contact with the rod 27 of the cylinder 26 and waits at the second waiting position c.

Subsequently, as shown in FIG. 3, the cylinder 50,
The rods 52 and 53 of 51 are made to project and the lifting plates 54 and 55
To raise the push-up plates 58 and 59, thereby raising and supporting the substrate S waiting at the first standby position b and the second standby position c by the push-up plates 58 and 59, and rotating. The substrate S is separated from the belt 30 that is being used. As a result, in the conventional means, the belt 30 which is constantly rotating slidably contacts the lower surface of the substrate S to damage the substrate S and the belt 30, but in the present means, the push-up plates 58 and 59 cause the first standby position b and Since the substrate S at the second standby position c is lifted from the belt 30 to stand by, the substrate S is not damaged during standby and the belt 30 is not damaged.

Next, as shown in FIG. 4, when the mounting of the chips P on the substrate S is completed, the central conveyor 10 is raised to the original height position by the Z table 6, and the rods 52, 53 is retracted and the push-up plates 58 and 59 are lowered, whereby the substrate S at the first standby position b and the substrate S at the second standby position c that have been lifted are landed again on the belt 30. Then, the rods 17 and 19 of the cylinders 16 and 18 are pulled in all at once, so that the substrate S at the mounting position a is moved to the central conveyor 10.
From the rear conveyor 12 to the first standby position b
The substrate S is transported to the mounting position a of the central conveyor 10.

At this time, the feeding speed of the conveyor is higher than the feeding speed V1 of the front conveyor 8 by the feeding speed V of the central conveyor 10.
Since 2 is a low speed, for example, even if the substrate S is a large one having a full conveyor length, the substrate S loaded into the central conveyor 10 from the front conveyor 8 at a high speed is
When moving to the central conveyor 10, the feed speed is drastically reduced, so that a braking effect occurs. On the other hand, since the feed speed V3 of the rear conveyor 12 is higher than the feed speed V2 of the central conveyor 10, the chip P is mounted. Central conveyor 1
Since the substrates S on 0 are conveyed at high speed immediately after moving to the rear conveyor 12, the substrates S do not collide with each other when the substrates S move between the conveyors.

Further, in FIG. 7, when the substrate S moves from the central conveyor 10 to the rear conveyor 12, when the sensor 83 detects the leading end of the substrate S, the cylinder 79 is operated and the drive roller 76 and the driven roller 78 are operated. The tip of the substrate S is sandwiched between them. Then, the motor 74 is driven and the drive roller 76 rotates at high speed. As a result, the substrate S nipped between the driving roller 76 and the driven roller 78 is conveyed to the rear conveyor 12 at a high speed. Therefore, the rear conveyor 12
The substrate S is further transported at a higher speed. After that, the same operation as described above is repeated to sequentially mount the chips P on the substrate S.

In this apparatus, since the feeding speeds of the front conveyor 10 and the rear conveyor 12 are high, the screen printing section A can be used instead of the conventional means in which the feeding speeds of the conveyors 8, 10 and 12 are made uniform. It is possible to shorten the total time required for mounting, including the time required to transfer the board S to the reflow unit C, and transfer the board S at a high speed in the electronic component mounting line.

[0031]

As described above, according to the present invention, the feeding speed of the conveyor is lower in the central conveyor than in the front conveyor, and the rear conveyor is higher in speed than the central conveyor. When the board is moved to the central conveyor, the feed speed is drastically reduced, which causes a braking effect.On the other hand, the board on the central conveyor on which electronic components are mounted is transported at high speed as soon as it is moved to the rear conveyor. Therefore, the substrates do not collide with each other when the substrates move between the conveyors. Moreover, since the feeding speed of the front conveyor and the rear conveyor is high,
It is possible to shorten the total time required for mounting, including the time for carrying the board, and carry the board at a high speed in the electronic component mounting line.

Further, since the front conveyor is provided with the elevating means for lifting the substrate waiting at the standby position of the front conveyor from the belt by the lifting means, the substrate waiting at the standby position of the front conveyor is rotating. It does not come into contact with the belt and get damaged.

[Brief description of drawings]

FIG. 1 is a front view of an electronic component mounting line according to an embodiment of the present invention.

FIG. 2 is a front view of an electronic component mounting line according to an embodiment of the present invention.

FIG. 3 is a front view of an electronic component mounting line according to an embodiment of the present invention.

FIG. 4 is a front view of an electronic component mounting line according to an embodiment of the present invention.

FIG. 5 is a perspective view of a front conveyor and a drive system according to an embodiment of the present invention.

FIG. 6A is a sectional view of a lowered position of a front conveyor according to an embodiment of the present invention. FIG. 6B is a sectional view of a raised position of a front conveyor according to an embodiment of the present invention.

FIG. 7 is a perspective view of an essential part of a rear conveyor according to an embodiment of the present invention.

FIG. 8 is a front view of an electronic component mounting line according to conventional means.

[Explanation of symbols]

 8 Front Conveyor 10 Central Conveyor 12 Rear Conveyor 15 Positioning Part 30 Belt 50 Elevating Means 51 Elevating Means 58 Lifting Means 59 Lifting Means B Electronic Component Mounting Parts C Reflow Part P Electronic Components S Board b Board Standby Position c Board Standby Position

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display location B65G 47/52 A 8010-3F

Claims (2)

[Claims] 1. An electronic component mounting portion for mounting an electronic component on a substrate on which a solder portion is formed, a central conveyer disposed below the electronic component mounting portion and provided with a positioning portion for the substrate S, A front conveyor consisting of a belt conveyor provided on the board carry-in side of the central conveyor, a rear conveyor provided on the board carry-out side of this central conveyor to send this board to the reflow section, and a stand-by for the board on the front conveyor An electronic component mounting apparatus, which is provided below the position and is provided with a lifting means for lifting a waiting substrate from a belt of the front conveyor, and a lifting means for lifting the lifting means. 2. A substrate on which a solder portion is formed is carried in from a front conveyor to a central conveyor, and after mounting an electronic component on the substrate by an electronic component mounting portion on the central conveyor, the substrate is sent to a reflow portion. In the electronic component mounting method of carrying out from the central conveyor to the rear conveyor, the feed speed of each conveyor, the central conveyor is slower than the front conveyor, and the rear conveyor is faster than the central conveyor Parts mounting method.