JPH0533182A - Production of orifice plate - Google Patents

Abstract

PURPOSE:To produce the orifice plate having an always specified orifice diameter by forming rugged patterns on a conductive substrate, forming an electrocasting film on the conductive substrate and parting the film from the substrate. CONSTITUTION:The rugged patterns are formed on the conductive substrate 11. The electrocasting film is thereafter formed on the substrate 11 and is parted from the substrate 11. This electrocasting film is used as the orifice plate 17. The rugged patterns are, thereupon, formed by fixing insulating fine shafts 13 onto the conductive substrate 11. The electrocasting film is then formed on the conductive substrate 11 and is parted therefrom, by which the orifice plate 17 is obtd. The orifice plate having the orifice diameter of good accuracy is produced in this way.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention forms a concavo-convex pattern on a conductive substrate, and then forms an electroformed film on the conductive substrate to release the electroformed film from the conductive substrate. The present invention relates to a method for manufacturing an orifice plate using the electroformed coating as an orifice plate.

[0002]

2. Description of the Related Art Orifice plates are generally manufactured by electroforming, and are manufactured by the following steps.

First, a conductive film of nickel or chromium is deposited on a polished glass substrate by a sputtering method to give conductivity to the surface of the polished glass substrate to produce a conductive substrate. Alternatively, a polished stainless substrate is used as the conductive substrate.

Next, a conductive substrate is set in the spin-coating apparatus, and the photoresist is spin-coated on the conductive substrate. Next, a photomask is placed on the photoresist film for exposure, and then the photoresist is developed to form a concavo-convex pattern, which is used as a substrate for manufacturing an orifice plate.

Next, the orifice plate manufacturing substrate is subjected to a mold release treatment by an anodic oxidation method or a chromic acid dipping method (in the case of a polished stainless steel substrate, no mold release treatment is required), and the orifice plate is manufactured. After depositing a nickel electroformed film of about 40 to 80 μm on the substrate for electroforming by electroforming, the nickel electroformed film was released from the substrate for producing an orifice plate, and this nickel electroformed film was used as an orifice plate.

[0006]

However, in the method of manufacturing the orifice plate by the conventional method, the convex pattern for forming the orifice on the conductive substrate is formed by the photoresist, and the electroforming progresses. As the cast film becomes thicker, the electroformed film is electrodeposited from around the photoresist forming the orifice while gradually covering the photoresist. That is, the orifice diameter is not exactly constrained by the photoresist diameter. Therefore, it is extremely difficult to manufacture an orifice plate that has a small variation in the orifice diameter and always have a constant orifice diameter for each lot because of the influence of the current density distribution on the conductive substrate surface and the influence of stirring. It was difficult for me.

Further, since the orifice pattern is formed by using the photoresist, the photoresist may be deteriorated by the external environment before the orifice plate is completed. Therefore, an orifice plate having an accurate orifice diameter may not be obtained.

Further, since the adhesion between the substrate for producing the orifice plate and the photoresist is weak, when the electroformed film is released from the conductive substrate after the electroformed film is formed, a part of the photoresist is on the electroformed film side. There was a case where it was adhered to and peeled off from the conductive substrate. Therefore, the orifice plate manufacturing substrate using the photoresist can be used only once for manufacturing the orifice plate.

The present invention has been made in order to solve the above problems, and easily manufactures an orifice plate having a uniform orifice diameter for each lot without variations in the orifice diameters. It is also an object of the present invention to provide a method for manufacturing an orifice plate, which does not change the quality of the orifice pattern due to the external environment, and is capable of repeatedly using the substrate for manufacturing an orifice plate.

[0010]

In order to achieve this object, in the method for manufacturing an orifice plate of the present invention, a concavo-convex pattern is formed by fixing an insulative thin shaft to a conductive substrate to form a pattern on the conductive substrate. Forming an electroformed film on the
The orifice plate is manufactured by releasing the electroformed film from the conductive substrate.

[0011]

The operation of the orifice plate manufacturing method of the present invention having the above construction will be described below.

First, a thin shaft is manufactured, and an insulating treatment is applied to the surface of the thin shaft to manufacture an insulating thin shaft.

Next, an insulating thin shaft is fixed to the conductive substrate to form an uneven pattern on the conductive substrate. This is used as a substrate for manufacturing an orifice plate.

Then, a mold release treatment is performed on the substrate for manufacturing the orifice plate, and then the electroformed coating is electrodeposited. After the electroforming is finished, the orifice plate is completed by releasing the electroformed film from the orifice manufacturing original plate.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

1 (a) to 1 (e) are views showing the procedure for carrying out the method for manufacturing an orifice plate of the present invention.

First, as shown in FIG. 1A, a hole of 0.1 to 0.3 mm is made by etching or the like in a conductive substrate 11 made of a material such as nickel, chromium, stainless steel, copper, or brass. Alternatively, instead of the conductive substrate 11,
Conductivity is applied to non-conductive substrates such as resin substrates and ceramics substrates with holes of 0.1 to 0.3 mm by dry plating such as sputtering or wet plating such as electroless nickel plating. It may be a processed substrate.

Next, a round thin shaft made of a material such as tungsten, copper, cemented carbide, etc. is formed by a wire discharge grinding method or the like as shown in FIG.
The thin shaft having the shape as shown in (b) is processed, and the surface of the thin shaft after the processing is subjected to an insulating treatment to produce the insulating thin shaft 13.

Next, as shown in FIG. 1 (c), the insulating thin shaft 13 is fitted into the hole of the conductive substrate 11 and fixed thereto, whereby the orifice plate manufacturing substrate 15 is completed.

The surface of the orifice plate manufacturing substrate 15 is first electrolytically cleaned and then rinsed with water. Next, it is immersed in 10 vol% sulfuric acid or 10 vol% hydrochloric acid at room temperature for about 1 min to perform an acid activation treatment, and then washed with water. Then, a mold release treatment is performed by immersing the mold in a mold release solution at room temperature for about 2 minutes.
Wash with water.

Thereafter, as shown in FIG. 1D, an electroformed film is formed on the orifice plate manufacturing substrate 15.
A nickel electroforming solution was used as the electroforming solution, and the solution composition was 6
0% nickel sulfamate tetrahydrate 750 g / l,
Nickel chloride hexahydrate 5 g / l, boric acid 35 g / l,
1 to 5 ml / l of additives (surfactants for pit prevention, stress reducing agents, brighteners, etc.) and pH adjusting agents (sulfamic acid or basic nickel carbonate) are added to the bath at 50 ° C, pH 4 It is controlled to be 0.0.

After controlling the total amount of current flowing on the surface of the orifice plate manufacturing substrate 15, electroforming is performed until the electroformed film deposited on the orifice plate manufacturing substrate 15 reaches a desired film thickness, and after the electroforming is completed. By washing with water and releasing the orifice plate 17 from the orifice plate manufacturing original plate 15 as shown in FIG.
It is possible to manufacture the orifice plate 17 having the orifice 19 in which the shape of No. 3 is transferred.

Further, the orifice plate 1 is repeated repeatedly.
Orifice plate manufacturing substrate 1 when manufacturing 7
5 is again immersed in 10 vol% sulfuric acid or 10 vol% hydrochloric acid at room temperature for about 1 min to perform acid activation treatment,
Wash with water. Then, it is immersed in a mold release solution at room temperature for about 2 minutes for mold release treatment, and then washed with water. Then, Figure 1
As shown in (d) to (e), an electroformed film is formed on the orifice plate manufacturing substrate 15 and the orifice plate 17 is released from the orifice plate manufacturing substrate 15 so that the orifice plate manufacturing substrate 15 is always manufactured so far. The orifice plate 17 having the same constant orifice diameter can be manufactured.

[0024]

According to the method of manufacturing an orifice plate of the present invention described above, since the shape of the insulating thin shaft is transferred to the orifice of the orifice plate, there is no variation in the orifice diameter of the plurality of orifices. Thus, it becomes possible to easily manufacture an orifice plate having a constant orifice diameter for each lot.

Further, since the solid orifice pattern is formed without using photoresist, the orifice pattern does not change due to the external environment until the orifice plate is completed. Orifice plates can be manufactured.

Further, since the orifice plate manufacturing substrate is made of solid, it can be used repeatedly.

[Brief description of drawings]

FIG. 1 is a view showing a procedure for carrying out an orifice plate manufacturing method of the present invention.

[Explanation of symbols]

 11 Conductive Substrate 13 Insulating Thin Shaft 17 Orifice Plate

Claims (1)

Claim: What is claimed is: 1. An uneven pattern is formed on a conductive substrate, and then an electroformed film is formed on the conductive substrate, and the electroformed film is released from the conductive substrate. In the method of manufacturing an orifice plate using the electroformed coating as an orifice plate, by fixing an insulating thin shaft to the conductive substrate, an uneven pattern is formed, and the electroformed coating is formed on the conductive substrate. A method for manufacturing an orifice plate, characterized in that the orifice plate is obtained by forming a mold and releasing it.