JPH05327291A - Mounting method for electronic component - Google Patents

Abstract

PURPOSE:To accurately mount an electronic component by previously accurately providing main and auxiliary electrodes on a board of the component, and positioning the component while measuring electric numeric values between both the electrodes. CONSTITUTION:A second auxiliary electrode 11 is formed at an opposite side to a mirror 2 to the electrode 11 and a main electrode 4 between the electrode 4 and the mirror 2 formed on a semiconductor substrate 1, and solder for fixing a semiconductor laser 3 is previously vapor-deposited on the electrodes 4, 11. Resistance meters 12, 13 for measuring resistance values between the electrodes 4, 10 and 4, 11 are provided. When the laser 3 is sucked to be moved on the substrate 1 and the resistance values are measured by the meter 12, the resistance value is reduced due to the fact that, when the laser 3 is disposed on the electrode 10, the value becomes parallel sum of the both. Since the laser 3 can be moved by a nozzle 7, a position where the values of the meters 12, 13 are maximum is discovered, and mounted. Accordingly, since it is positioned at a position having a maximum value while measuring the resistance value on the accurate electrode formed by a semiconductor process, it can be accurately mounted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art Conventionally, when an electronic component is mounted on a substrate with high precision, a reference point is provided on the substrate and the electronic component is moved while referring to a position from the reference point to position the electronic component at a predetermined position.

A conventional method for mounting electronic components will be described below with reference to the drawings by taking as an example a method for mounting a semiconductor laser on a semiconductor substrate using the electronic component as a semiconductor laser and the substrate as a semiconductor substrate.

FIG. 4 is an explanatory view for explaining such a mounting method. FIG. 4A shows a semiconductor laser 3 on the semiconductor substrate 1.
It is a top view which shows the state which mounted.

In FIG. 4A, reference numeral 2 is a mirror formed by etching the semiconductor substrate 1, and the semiconductor laser 3
Must be mounted on the mirror 2 at a predetermined distance with an accuracy of about 50 μm.

Reference numeral 4 denotes an electrode formed on the semiconductor substrate 1, which has a base for mounting the semiconductor laser 3, a function of supplying power to the semiconductor laser 3 and a function of heat dissipation, and is connected to a terminal 5 for supplying power. ..

FIG. 4B is a side view when the semiconductor laser 3 is mounted on the semiconductor substrate 1. In FIG. 4B, 7 is a nozzle of the mounting apparatus. The semiconductor laser 3 is sucked by the nozzle 7 and the nozzle 7 is moved while measuring the distance between the end face 6 of the semiconductor substrate 1 and the center of the nozzle 7. When a predetermined distance is reached, the semiconductor laser 3 is preformed on the semiconductor substrate 1. It is positioned and fixed on the electrode 5.

By thus positioning the semiconductor laser 3 with respect to the end face 6 by the nozzle 7, the semiconductor laser 3 can be mounted on the semiconductor substrate 1.

[0009]

However, in such a conventional mounting method of electronic components, since the distance from the end face 6 of the semiconductor substrate 1 is measured by visual inspection or optical means, mounting with high precision is achieved. It had a problem that it could not be done.

The present invention solves the above-mentioned problems of the conventional example, and an object of the present invention is to provide a mounting method of electronic parts which can be mounted easily and accurately.

[0011]

In order to achieve this object, a method of mounting an electronic component according to the present invention is such that a main electrode and an auxiliary electrode are accurately provided in advance on a substrate of an electronic component, and an electric value between them is calculated. It is mounted by positioning with respect to the electrode while measuring.

[0012]

According to this mounting method, the position of the electronic component can be positioned with respect to the electrode with high accuracy while confirming the position by an electric value, so that the electronic component can be mounted with high precision.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram showing a method of mounting electronic components according to an embodiment of the present invention.

An example of mounting the semiconductor laser on the electrodes of the semiconductor substrate will be described. FIG. 1A shows a semiconductor substrate 1.
FIG. In FIG. 1A, between the main electrode 4 and the mirror 2 formed on the semiconductor substrate 1, the auxiliary electrode 10 and the second auxiliary electrode 1 on the side opposite to the mirror 2 with respect to the main electrode 4.
1 is created. Solder for fixing the semiconductor laser 3 is vapor-deposited on the main electrode 4 and the auxiliary electrode 11 in advance.

A resistance meter 12 for measuring the resistance value between the main electrode 4 and the auxiliary electrode 10, the main electrode 4 and the auxiliary electrode 1
Mounting is performed by an apparatus equipped with a resistance meter 13 for measuring the resistance value between 1 and 1.

Since the main electrode 4 and the auxiliary electrodes 10 and 11 formed on the semiconductor substrate 1 can be manufactured by the etching process of the semiconductor manufacturing process, the positional accuracy between the auxiliary electrodes 10 and 11 can be up to about 1 μm. Can be raised. A method of mounting the semiconductor laser 3 with high accuracy using the electrodes with high accuracy will be described.

FIGS. 1B, 1C and 1D are explanatory views showing a method of mounting the semiconductor laser 3 on the semiconductor substrate 1 with high accuracy.

In FIG. 1B, when the semiconductor laser 3 is sucked and moved on the semiconductor substrate 1 and the resistance value between the main electrode 4 and the auxiliary electrode 10 is measured by the ohmmeter 12, the semiconductor laser 3 shows the auxiliary electrode. When it is positioned above 10, the resistance value of the resistance meter 12 becomes the parallel sum of the resistance values of the semiconductor substrate 1 and the semiconductor laser 3, and the resistance value decreases. Therefore, the nozzle 7
Then, it becomes necessary to move the semiconductor laser 3 in the direction of the arrow.

When the semiconductor laser 3 reaches the auxiliary electrode 11 as shown in FIG. 1 (c), the resistance value of the ohmmeter 13 decreases, so that the nozzle is moved in the direction of the arrow opposite to that in FIG. 1 (b). The semiconductor laser 3 may be moved at 7. In this way, the resistance meter 12 and the resistance meter 13 are moved while moving the nozzle 7.
It should be implemented while finding the place where the value of becomes maximum.

FIG. 3D shows a state in which the semiconductor laser 3 is positioned on the main electrode 4 between the auxiliary electrodes 10 and 11 as described above. When the semiconductor substrate 1 is heated in this state, the solder evaporated on the electrodes is melted and the semiconductor laser 3 can be fixed, and the semiconductor laser 3 can be mounted on the mirror 2 with high accuracy.

The semiconductor laser 3 is mounted on the main electrode 4 with high accuracy by positioning and mounting while finding the maximum value of the resistance value while measuring the resistance value on the highly accurate electrode created by the semiconductor process by the above mounting method. It can be implemented well.

A method of mounting electronic components according to the second embodiment of the present invention will be described below with reference to the drawings. Figure 2
FIG. 3A is a top view showing a state in which the semiconductor laser 3 is mounted on the semiconductor substrate 1. The difference from the first embodiment is that the semiconductor laser 3 is mounted such that the main electrode 4 and the auxiliary electrodes 10 and 11 are shortened so as to extend over the respective electrodes.

A method of mounting the semiconductor laser 3 on the semiconductor substrate 1 with high precision will be described with reference to FIGS. 2 (b), 2 (c) and 2 (d).

First, the resistance value between the main electrode 4 and the auxiliary electrodes 10 and 11 is measured by the resistance meter 12 and the resistance meter 13. The values are recorded as r1 and r2, respectively.

Next, as shown in FIG. 2 (b), the semiconductor laser 3 is sucked by the nozzle 7 and placed on the main electrode 4 and moved left and right.

At this time, the resistance values of the ohmmeters 12 and 13 are measured and the values are set to R1 and R2. (R1-R1)-
The nozzle 7 is moved so that the value of (r2-R2) becomes zero.

Since the semiconductor laser 3 is biased toward the auxiliary electrode 10 side in FIG. 2B, (r1-R1) is (r2).
-R2) has a smaller resistance value.

When the semiconductor laser 3 is biased toward the auxiliary electrode 11 side as shown in FIG. 2C, (r2-R2) is now (r2-R2).
1-R1). Therefore, by moving the nozzle 7 in the direction of the arrow while measuring each resistance value, the semiconductor laser 3 can be positioned on the main electrode 4, and high-precision mounting can be achieved.

The semiconductor laser 3 can be mounted on the main electrode 4 with high accuracy by mounting the semiconductor laser 3 on the high-precision electrode created by the semiconductor process while measuring the resistance value by the mounting method described above.

Further, since the resistance value is continuously changed by moving the semiconductor laser 3 so as to straddle the main electrode 4, the auxiliary electrode 10 and the auxiliary electrode 11, the nozzle 7 is moved while measuring the change in the resistance value. Easy to mechanize.

Further, the resistance values r1 and r2 are first measured, and the resistance value measured at the time of positioning is subtracted to perform positioning so that the resistance value becomes 0. A control circuit for controlling the movement of the can be easily configured.

The third embodiment of the present invention will be described below. FIG. 3 shows a mounting method of the electronic component of the present invention. FIG. 3 is a top view when the semiconductor substrate 1 is mounted on the lead wire group with high accuracy.
In FIG. 3, reference numeral 20 denotes a package for enclosing the semiconductor substrate 1, and lead wires 21, 22 and 23 for supplying power to the semiconductor substrate 1 are shown.

In order to mount the semiconductor substrate 1 on the package 20 with high precision, the lead wires 22 and 23, and 21 and 23.
Between the lead wires 22 and 23 with high precision by mounting the ohmmeters 24 and 25 for measuring the resistance value between the two and moving the semiconductor substrate 1 in the direction of the arrow while measuring the resistance value. Is possible.

By positioning the semiconductor substrate 1 while measuring the resistance value between the lead wires by the above mounting method, the semiconductor substrate 1 can be mounted with high precision.

In the first embodiment, the electrical value of the main electrode 4 and the auxiliary electrodes 10 and 11 is 1 as the resistance value.
Although 2 and 13 are resistance meters, the electric value may be the dielectric constant. In this case, 12 and 13 are dielectric constant meters, and in this case, the electronic parts to be mounted can be applied even when they are not semiconductors.

[0036]

As described above, the method of mounting an electronic component according to the present invention can accurately position the electronic component by moving and positioning the electronic component while measuring the electrical numerical values of the main electrode and the auxiliary electrode that are accurately formed. It can be implemented well.

[Brief description of drawings]

1A to 1D are explanatory views showing a mounting method of an electronic component in an embodiment of the present invention.

2A to 2D are explanatory views showing a mounting method of an electronic component according to a second embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a mounting method of electronic components according to a third embodiment of the present invention.

4A and 4B are explanatory views showing a conventional mounting method for electronic components.

[Explanation of symbols]

 1 Semiconductor Substrate 3 Semiconductor Laser 4 Main Electrode 7 Nozzle 10 Auxiliary Electrode 11 Auxiliary Electrode 12 Resistance Meter 13 Resistance Meter 21 Lead Wire

Continued Front Page (72) Inventor Tetsuro Shimamura 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. A main electrode and an auxiliary electrode are provided on a surface of a substrate, an electronic component is placed on the substrate, and the electronic component is moved while referring to an electric value between the main electrode and the auxiliary electrode,
A method of mounting an electronic component, wherein the electronic component is positioned and mounted on the main electrode when the electrical value reaches a predetermined value. 2. A main electrode and an auxiliary electrode are provided on the surface of a substrate, and after the numerical values of the main electrode and the auxiliary electrode are measured in advance, an electronic component is placed on the substrate, and between the main electrode and the auxiliary electrode. An electronic device that moves the electronic component while referring to the electrical value, and positions and mounts the electronic component to be mounted on the main electrode when the difference between the electrical value and the previously measured electrical value reaches a predetermined value. How to mount parts. 3. A main electrode and an auxiliary electrode are provided on a surface of a substrate, the main electrode or an electronic component is solder-plated, the electronic component is placed on the substrate, and an electrical connection between the main electrode and the auxiliary electrode is provided. Move the electronic components while referring to the numerical values,
A method for mounting an electronic component, wherein the electronic component is positioned and heated on the main electrode when the electrical value reaches a predetermined value, and the solder plating is melted and fixed to be mounted.