JP2002208501A - Resistor unit, electronic part using the same, and use of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resistor unit suitable for measuring a current, its use, an electronic part using the same, and its use. SOLUTION: A resistor unit 100 is composed of a resistor 110 formed of precious metal alloy or the like, high-conductivity connecting electrodes 121 and 122, and bonding electrodes 141 and 142. The thickness ratio tE/tR is set so as to satisfy a formula, tE/tR>0.1 wherein tE denotes the thickness of the connecting electrode, and tR denotes the thickness of the bonding electrode. The outer edges 143 and 144 of the bonding electrodes 142 and 141 which are half as wide as the bonding electrodes 142 and 141 respectively are so formed at positions fit to be connected to voltage measuring wires. Therefore, the resistor unit 100 is capable of precisely measuring a current.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor and a method of using the resistor, for example, a low-resistance element portion suitable for detecting a high current and a resistor having a metal conductor having a high conductivity in the low-resistance element portion. And how to use it.

[0002] The present invention further relates to an electronic component using the resistor and a method of using the same.

[0003]

2. Description of the Related Art It is well known to use a resistor having an extremely small resistance value of the order of milliohms for detecting a large current. In the detection of a large current I (A) using this resistor, a resistor R having a known low resistance value and a small variation in the resistance value is used.
(Ω), a voltage drop V (V) at both ends of the resistor when a high current I (A) flows is measured, and a current value I (A) is calculated using I = V / R.

FIG. 12 shows an example of a current detecting resistor. The low-resistance resistor 1000 for detecting a current includes a metal resistor portion 1400 and two electrode portions 1100. For the resistance section 1400, for example, a metal alloy such as a Cu-Ni alloy (for example, CN49R) is used. Electrode 1
100 is provided with solder 1200 in consideration of solderability.

[0005]

By the way, in order to accurately measure a current using a resistor, a change in a resistance value with respect to a change in a current when a current is applied is reduced, and a voltage (V) -current (I ) It is necessary to improve the characteristics. Further, in order to use the resistor with high accuracy, it is necessary to form a four-terminal structure at an optimum electrode position of the resistor and measure the voltage.
That is, electrodes are formed on the upper and lower surfaces of the resistor, and the voltage is measured from the upper surface by wire bonding to form a four-terminal structure.

However, there is no knowledge about the effects of the resistor film thickness and the resistor film thickness on the voltage measurement when the resistor is connected to the current application pattern on the substrate, so that it has a structure suitable for current measurement. The resistor could not be manufactured. Also, when connecting the bonding wire for voltage measurement to the resistor using the resistor, it was unclear which position of the resistor to connect the wire to is optimal for voltage measurement.

[0007] For this reason, a voltage was not measured by connecting a wire to an optimum position of the resistor, and the resistor could not be used in an optimum state.

The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a resistor suitable for current measurement and a method of using the same.

It is still another object of the present invention to provide an electronic component using a resistor suitable for the above-described current measurement and a method of using the same, which has been made to solve the above-mentioned problems of the prior art.

[0010]

A resistor according to an embodiment of the present invention for achieving the above object has the following configuration. That is, a resistor made of a substantially plate-shaped resistance alloy, at least two first electrodes made of a metal having high conductivity, and at least two second electrodes made of a metal, The electrodes are on the first surface of the resistor and at both ends of the resistor, and the second electrode is on the second surface and both ends of the resistor facing the first surface. First and second electrodes are arranged to sandwich the resistor,
The thickness of the first electrode is 1/10 of the thickness of the resistor.
It is characterized by being larger.

Further, for example, the surface of the first electrode is coated with a molten solder material or a lead-free molten solder material.

Further, for example, the resistor is characterized in that a position to which a voltage measuring wire is to be connected is formed.

Also, for example, the specific resistance of the electrode material used for the first electrode is larger than 1/150 and smaller than 1/2 with respect to the specific resistance of the resistor material used for the resistor.

Further, for example, the resistor material is Fe—C
r-based alloy, Cu-Ni-based alloy, Ni-Cr-based alloy, 6-element alloy, 7-element alloy, 8-element alloy, 9-element alloy, Pd-
It is characterized by being selected from a Pt-based alloy, an Au-Ag alloy, and an Au-Pt-Ag alloy. Also, for example, the resistor is characterized in that its thickness is adjusted to have a predetermined resistance value by any one of polishing, laser processing, sandblasting and etching.

A resistor according to one embodiment of the present invention for achieving the above object has the following configuration. That is,
At least two separate metals of high conductivity
One electrode and a resistor made of a substantially plate-shaped resistance alloy electrically and mechanically coupled to the electrode, wherein the thickness of the electrode is larger than 1/10 of the thickness of the resistor It is characterized by the following.

A method of using a resistor according to an embodiment of the present invention to achieve the above object has the following configuration.
That is, the method of using the resistor according to claim 1, wherein the resistor is provided on the second electrode and outside of a half of a length of the second electrode along a current direction. It is characterized by connecting and using a voltage measuring wire.

A method of using a resistor according to an embodiment of the present invention for achieving the above object has the following configuration.
That is, in the method of using the resistor according to claim 6, wherein the electrode is disposed on a first surface of the resistor and at both ends of the resistor, and A wire for voltage measurement is connected and used on a second surface facing the surface and outside of a half of a length of the electrode along a current direction.

An electronic component according to an embodiment of the present invention for achieving the above object has the following configuration. That is, a resistor made of a substantially plate-shaped resistor alloy, at least two first electrodes near the first face and both ends of the resistor, and a second face facing the first face. The resistor having at least two second electrodes near the surface and both end portions, at least two first substrate electrodes connected to the second electrode of the resistor, and the second one of the resistor An insulating substrate having at least two second substrate electrodes connected to one electrode via a metal wire, wherein the second electrode of the resistor has a high conductivity metal and It is characterized by being formed to be at least 1/10 of the thickness.

Further, for example, the surface of the first electrode is coated with a molten solder material or a lead-free molten solder material, and the first electrode is connected to the insulating substrate via the molten solder material or the lead-free molten solder material. And is connected to

Further, for example, it is preferable that the first electrode and the metal wire are connected outside the half of the length of the first electrode along the direction of the current flowing through the resistor. Features.

Further, for example, the specific resistance of the electrode material used for the first electrode is larger than 1/150 and smaller than 1/2 with respect to the specific resistance of the resistor material used for the resistor.

Also, for example, the resistor material is Fe-C
r-based alloy, Cu-Ni-based alloy, Ni-Cr-based alloy, 6-element alloy, 7-element alloy, 8-element alloy, 9-element alloy, Pd-
It is characterized by being selected from a Pt-based alloy, an Au-Ag alloy, and an Au-Pt-Ag alloy. Also, for example, the resistor is characterized in that its thickness is adjusted to have a predetermined resistance value by any one of polishing, laser processing, sandblasting and etching.

An electronic component according to an embodiment of the present invention for achieving the above object has the following configuration. That is, a resistor made of a substantially plate-shaped resistor alloy, the resistor having at least two electrodes near a first surface and both end portions of the resistor, and a resistor connected to the electrode of the resistor. At least two first substrate electrodes, and
An insulating substrate having at least two second substrate electrodes connected via metal wires near a second surface and both ends facing the first surface of the resistor; and The electrode is formed of a metal having high conductivity to a thickness of 1/10 or more of the thickness of the resistor.

A method for using an electronic component according to an embodiment of the present invention to achieve the above object has the following configuration. That is, a method of using the electronic component according to any one of claims 13 to 17, wherein the measurement of a current flowing through the at least two first substrate electrodes includes: It is characterized in that a substrate electrode is used.

A method for using an electronic component according to an embodiment of the present invention for achieving the above object has the following configuration. That is, a method of using the electronic component according to any one of claims 18 to 22, wherein the measurement of a current flowing through the at least two first substrate electrodes includes the measurement of the at least two second electrodes. It is characterized in that a substrate electrode is used.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below in detail with reference to the accompanying drawings.

The alloy composition used as a resistor of a resistor having a very small resistance of about milliohm for detecting a current described in the present embodiment is an example,
Unless otherwise specified, the scope of the present invention is not intended to be limited to these, but is determined according to the required characteristics and specifications of the resistor to be manufactured.

[First Embodiment] First, the structure and characteristics of the resistor according to the first embodiment will be described below.

[Structure of First Resistor] FIG.
1 shows a resistor 100 according to a first embodiment soldered on a conductor pattern 0.

The resistor 100 includes a metal resistor 110, electrodes 121 and 122 as connection terminals, and bonding electrodes 141 and 142. The resistor 100 includes two resistors 110 having a rectangular parallelepiped shape.
This is a structure in which two rectangular parallelepiped electrodes 121 and 122 and two rectangular parallelepiped bonding electrodes 141 and 142 are joined as shown in FIG.

In voltage measurement using the resistor 100, the conductor pattern of the substrate 150 is connected to the electrodes 121 and 122, and bonding wires are connected to the bonding electrodes 141 and 142 by, for example, bonding. The voltage drop between the bonding electrodes 141 and 142 is measured. Each bonding electrode 141
1 and 142, positions suitable for connecting wires to 143 and 144, which are positions outside the half of the width of each of the bonding electrodes 141 and 142, as shown in FIG.

The thickness (t _R ) of the resistor 110 is, for example, about 50 to 2000 μm, the thickness (t _E ) of each of the electrodes 121 and 122 is about 10 to 500 μm, and the electrode 120 is
The ratio of the thickness of the resistor 110 to the thickness of the resistor 110 is t _E / t _R > 1/1
It is designed to be zero. Also, each bonding electrode 141,
The thickness of each electrode 142 is about 10 to 100 μm.
On the surfaces of 21 and 122, a solder film (for example, a molten solder film) of about 2 to 10 μm is formed.

The resistor 100 is designed to easily radiate heat, and is used for mounting the substrate 1 on a printed wiring board or the like.
For example, a metal substrate such as an aluminum substrate is used as the substrate 50, and the substrate 150 also has a structure connected to a heat sink or the like.

That is, since the heat generated in the resistor 100 when a high current is measured is transmitted in the direction of the substrate 150, the junction surface between the resistor 100 and the substrate 150 is important. A feature is that a thick copper plate having good heat conductivity is used for the electrodes 121 and 122 which are the bonding surfaces with the substrate 150, and the bonding area is made large.

The current for measuring the high current depends on the pattern of the substrate 150 and the one electrode 12 of the resistor 100.
1 flows to the resistor 110, and further flows from the resistor 110 to another electrode 122. In addition, the bonding electrodes 141 and 142 are connected to the pattern of the substrate 150 by wire bonding using an aluminum wire or the like, and the voltage drop between the patterns when a high current flows, that is, the voltage drop across the resistor 100 is measured. The bonding electrodes 141 and 142 are joined to the resistor 110 for the purpose of improving the resistance value accuracy. Therefore, FIG.
The resistor 100 having the above structure can be used with a large current.

As a material for the resistor 110, for example, C
A u-Ni alloy (such as CN49R), various metal alloys and various noble metal alloys shown in FIG. 2 are used, and a metal alloy or a noble metal that conforms to various characteristics such as specific resistance, TCR, and resistance change determined according to specifications. An alloy or the like is appropriately selected from FIG. 2 and used. Further, other than FIG. 2, for example, a manganese-copper-nickel alloy may be used.

Further, as shown in FIG.
When a noble metal alloy having about 7 μΩ · cm is used, a resistor 110 having an extremely low electric resistance is obtained. For example, when these noble metal alloys are used as the resistor 110, the resistance value of the resistor 100 having the structure shown in FIG. 1 is about 0.04 to 0.15 mΩ.

As a material for the electrodes 121 and 122, a copper material or the like having a lower electric resistance than the resistor 110 (for example, a specific resistance of about 1.6 μΩ · cm) is used.
The resistor 110 and the electrode 121 or the resistor 110 and the electrode 1
22 is joined by cladding.

The electrode material used for the electrodes 121 and 122 and the resistor material used for the resistor 110 are defined by the ratio of the specific resistance / resistance of the electrode material expressed by the following equation. Specific resistance of body material = 1 / 150-1
It is more preferable to use a material having a specific resistance satisfying the condition of / 2.

As a material for the bonding electrodes 141 and 142, a nickel material (for example, about 6.8 μΩcm), an aluminum material (for example, about 2.6 μΩcm), a gold material (for example, about 2.0 μΩcm), or the like is used. The electrode surfaces of the two electrodes 121 and 122 are designed to have a large electrode area so that heat is easily transmitted in the direction of the substrate 150 in order to easily radiate heat generated when measuring a high current. It is characterized by using a metal having good thermal conductivity (eg, copper) and having a large bonding area.

On the surfaces of the electrodes 121 and 122,
In order to improve the solderability of the substrate to the conductor pattern, for example, films 131 and 132 of a molten solder material (Sn: Pb = 9: 1) or a lead-free molten solder material are formed. Since the diffusion layer is formed between the copper electrode 121 or 122 and the conductor pattern of the substrate by using the molten solder material, the bonding strength of the electrode is improved, and the electrical reliability is also improved.

The feature of the resistor 100 is that the resistor 11
0 has a simple structure consisting of a flat plate, and has a notch 130 as seen in the conventional low resistor 1000 for current detection.
There is no 0.

That is, in the resistor 100, the resistor 11
0 plate thickness (electrode side on the upper surface of the resistor 100 in FIG. 1,
The resistance value is adjusted by changing the thickness of the resistor 110 exposed on the lower electrode side. Examples of a method for adjusting the thickness of the resistor 110 include polishing, laser processing, sandblasting, and etching, and the method of adjusting the thickness of the resistor 110 so that the resistor 100 has a predetermined resistance value using the above method. Adjust the thickness. When adjusting the thickness of the resistor 510, one or both of the upper surface and the lower surface of the resistor 510 may be processed by the processing method described above.

As described above, in the resistor 100, the resistor 1
10, there is no cut, so that the current path when a current flows is stable, and the resistance change when there is a cut is 1 /
It can be reduced to several tens to 1/200.

The resistor 110 has a resistance of about 2 to 7 μΩ · cm.
When a noble metal alloy having an extremely low electric resistance is used, the resistance value of the resistor 100 becomes about 0.04 to 0.15 m.
Therefore, a resistor suitable for measuring a high current can be obtained.

[Measurement of Voltage Using Resistor] FIG. 3 (a)
FIG. 3B shows the dimensions of each part of the manufactured resistor 100 and the connection positions of the wires when voltage measurement is performed using the resistor 100. The thickness t _E of the electrode joining the resistor 110 of the resistor 100 and the substrate is t _E / t _R > 1/10.

In FIG. 3, L _w1 and L _w2 are the widths of the left and right bonding electrodes 141 and 142 in the horizontal direction.
Numbers 1 to 1 described in the bonding electrodes 141 and 142
Reference numeral 18 denotes a position where a wire for voltage measurement is connected to the bonding electrodes 141 and 142. L ₁ and L ₂ are distances from the outer ends of the bonding electrodes 1 to 18 described above.

The structure of the manufactured comparative resistor differs only in the thickness t _{E of the} electrode to be joined to the substrate of the resistor 100 (that is, designed so that t _E / t _R <1/10).
All other dimensions are the same as resistor 100.

The positions of L ₁ and L ₂ illustrated in FIG. 3 (a) indicate the positions where the wires for voltage measurement are connected to the center portions of the left and right bonding electrodes, respectively, and L ₁ / L
_w1 = _0.5, is _{L 2 / L} w2 = 0.5.

FIGS. 3A to 3D show combinations of positions where wires are connected to the bonding electrodes 141 and 142 at the time of voltage measurement. That is, (1), the wire connection position when voltage measurement of the bonding electrodes 141 and _{142, L 1 / L w1> 0} .
5 shows combinations of wire connection positions when the condition of L ₂ / L _w2 > 0.5 is satisfied.

Similarly, (2) indicates that L ₁ / L _w1 <0.5,
A combination of connecting a wire to a position satisfying the condition of L ₂ / L _w2 > 0.5 is shown, and (3) shows L ₁ / L
_{w1> 0.5,} indicates a combination of connecting wires to satisfy the position of _{L 2 / L w2 <0.5,} (4)
_Shows a combination of L ₁ / L w1 _<0.5, the condition is satisfied position of _{L 2 / L} w2 <0.5 connecting wire.

FIG. 4 shows the voltage measurement results using the resistor 100 shown in FIGS. 3A and 3B together with the voltage measurement results using a comparative resistor.

The measurement conditions (1) to (4) in FIG. 4 correspond to the measurement conditions (1) to (4) shown in FIG. The voltage V measured with the resistor 100, etc., were organized view with variation ΔV of the voltage shown in the following equation (measured voltage to the reference voltage V _0).

ΔV = (V ₀ −V) / V ₀ × 100 (%) In FIG. 4, the variation (ΔV) of the voltage under the measurement conditions (1) to (4) is determined by the thickness of the bonding electrode bonded to the substrate. Ratio (t _E ) to the thickness (t _R ) of the resistor is t _E / t _R > 1
It was displayed separately in the case of / 10 case and _{t E / t R ≦ 1/} 10 of the.

[In the case of the resistor 100] First, in the case of the resistor 100 (t _E / t _R > 1/10) of the first embodiment, the effect of the position where the wire is connected on the voltage variation value ΔV Will be described.

FIG. 4 shows that the four conditions (1) to (4) are
By comparison, condition (4) (L₁/ L _w1<0.5, L₂
/ L_w2<0.5) means that the voltage fluctuation (ΔV) is ± 0.1%
It is the smallest optimal condition. That is, the voltage measurement
When connecting the ear to the bonding electrodes 141 and 142
The width of the left and right bonding electrodes 141 and 142
The wire outside of the outer edge of the electrode by more than 1/2
Connecting to the position of the electrode surface of the
You.

The measurement results other than the condition (4) are as follows. That is, in the case of the condition (1), (L ₁ / L
_{w1> 0.5, L 2 / L} w2> 0.5) , the voltage variation ([Delta] V) is the largest and 5 to 10% ±, the condition is not suitable for stable voltage measurement. That is, when the voltage measuring wires are connected to the bonding electrodes 141 and 142, the wires are positioned at positions on the inner surface of the electrode that are both larger than か ら from the outer ends of the electrodes with respect to the lateral width of the left and right bonding electrodes 141 and 142. , The voltage fluctuation is maximized.

In the case of the condition (2) or the condition (3) (one of the two wires is placed at a position smaller than か ら from the outer end of the electrode, that is, the outer electrode surface position, and the other wire is placed at the electrode surface position). From the outer edge of the electrode is greater than 1/2, ie, connected to the inner electrode surface position), the voltage fluctuation (Δ
V) is ± 3 to 5%, which is an intermediate condition between the conditions (1) and (4).

[Case of Comparison Resistor] Next, in the comparison resistor (t _E / t _R <1/10), the effect of the position where the wire is connected on the voltage variation ΔV will be described.

FIG. 4 shows that comparing the four conditions (1) to (4), the voltage fluctuation ΔV is ± 10% or more under all the conditions (1) to (4). It is larger than the obtained voltage fluctuation ΔV.

Further, since the voltage fluctuation ΔV does not change even when the conditions (1) to (4) and the position where the wire is connected to the left and right bonding electrodes are changed, the wire is left and right bonded during the measurement of the comparative resistor voltage. It is not affected by the position where it is connected to the electrode.

[Comparison between Resistor and Comparative Resistor] From the results of the resistor 100 and the comparative resistor, in order to suppress the voltage variation ΔV and measure the voltage accurately, it is necessary to use a resistor and a connection electrode. Is manufactured using a material that satisfies the condition of specific resistance of electrode material / specific resistance of resistor material = 1/150 to 1/2, and the thickness of the junction electrode (t
_E ) and the thickness of the resistor (t _R ) is t _E / t _R > 1/1
It is necessary to satisfy the condition of 0 (the structure of the resistor 100).

Further, when the voltage is measured using the resistor 100 satisfying the above conditions, the condition shown in the condition (4), that is, L ₁ / L _w1 <0.5, L ₂ / L _w2 <
Bonding electrodes 141 and 142 satisfying the condition of 0.5
(Where the connection position of the wire with respect to the width of the electrode is a position outside 1/2 of the electrode end), the voltage variation (ΔV) is reduced to a minimum variation within ± 0.1%, for example. Can be suppressed.

The reason will be described with reference to FIGS.

FIG. 5 shows a case where the voltage is measured using the resistor 100 mounted on the substrates 151 and 152 (t _E / t
_R > 1/10), and FIG.
A case where a voltage is measured using a comparative resistor mounted on the 1520 (t _E / t _R <1/10) is shown.

In FIG. 5 or FIG.
When detecting (A), a high current I is supplied to the resistor R (Ω).
(A) The voltage drop V across the resistor when flowing
(V) is measured, and a current value I (A) is calculated using I = V / R.

That is, as shown in FIG. 5 or FIG. 6, for example, the pattern 151 of the substrate is connected to the bonding electrode 121 and the pattern 152 of the substrate is connected to the bonding electrode 122. , 142 are measured. FIG. 5 or FIG. 6 also shows the flow of the current I passing through the resistor 110.

In order to accurately measure the voltage between the bonding electrodes 141 and 142, the bonding electrode 1
It is desirable to perform the measurement under the condition that almost no current flows between 41 and 142. If a current flows between the bonding electrodes 141 and 142, an error occurs in the voltage measurement.

First, the flow of the current I passing through the resistor 110 when measuring the voltage using the resistor 100 shown in FIG. 5 will be described. The resistor 100 is designed so that the thickness (t _E ) of the junction electrode is t _E / t _R > 1/10, that is, the thickness is relatively large with respect to the resistor 110. Therefore, the current I passing through the resistor 110 is reduced due to the lowering of the conductor resistance of the bonding electrode.
Most of the current flows through the shortest distance between 2, 121 (the shortest path shown in bold in FIG. 5), and the remaining current flows through other paths in the figure.

Further, as shown in FIG. 5, current flows also in paths other than the shortest path, but the current flowing decreases as the path is farther from the shortest path. For this reason, the resistor 100
Since the current flowing between the bonding electrode 142 and the bonding electrode 141 during voltage measurement can be reduced, accurate voltage measurement can be performed.

Further, comparing the effect of the current flowing through the resistor 110 on the bonding electrode 142 during the voltage measurement shown in FIG. 5, the outer side (electrode portion 143) of the bonding electrode 142 indicated by the hatched portion is the inner side. It is less affected by the current I flowing in the resistor 110 than the (electrode portion 145). The same can be said for the bonding electrode 141. That is, the outside (electrode portion 144) indicated by the hatched portion in the bonding electrode 141 is less affected by the current I flowing through the resistor 110 than the inside (electrode portion 146).

From this, it can be seen in FIG. 5 that the voltage can be measured with high accuracy by connecting a wire at a position distant from the current path flowing through the resistor 110. In other words, the optimal positions for connecting the wires are outside the bonding electrode 142 (electrode portion 143) and outside the bonding electrode 141 (electrode portion 144), while conversely inside the bonding electrode 142 (electrode portion 145). It can be seen that the worst position is inside the bonding electrode 141 (electrode portion 146). What has been described above will be described with reference to FIG.
This is the reason that different voltage fluctuations were shown under the four conditions (4).

Next, the flow of the current I passing through the resistor 1100 when measuring the voltage using the comparison resistor of FIG. 6 will be described. In the comparative resistor, the thickness of the junction electrode (t
_E ) is designed so that t _E / t _R <1/10. Therefore, the current I passing through the resistor 1110 is reduced due to the increase in the conductor resistance of the bonding electrode.
The current flowing through the shortest distance between 0 and 1210 (the shortest path shown in bold in FIG. 6) decreases as compared with FIG. 5, and the current flowing through paths other than the shortest path in FIG. 6 increases.

Further, as shown in FIG. 6, the current flowing in the path other than the shortest path decreases as the path becomes farther from the shortest path.
This is considerably larger than in FIG. Therefore, when voltage measurement is performed using a comparison resistor, the bonding electrode 141
Since it becomes difficult to suppress the current flowing between the zero and the bonding electrode 1420 to a small value, the voltage fluctuation becomes large and accurate voltage measurement becomes difficult.

Further, comparing the effect of the current flowing through the resistor 1100 on the bonding electrode 1410 at the time of voltage measurement shown in FIG. 6, the outside (electrode portion 1430) and the inside (electrode portion 1430) shown by hatching in the bonding electrode 1420 are compared. There is no significant difference in the effect of the current I flowing through the resistor 110 at the portion 1450). The same applies to the bonding electrode 1410, and there is no significant difference in the effect of the current I flowing through the resistor 1100 between the outside (electrode portion 1440) and the inside (electrode portion 1460) indicated by the hatched portion in the bonding electrode 1410. .

For this reason, it is difficult to measure the voltage with high accuracy because the comparative resistor is greatly affected by the current I flowing through the resistor 1100 when measuring the voltage. Also, as shown in FIG. 6, the influence of the current I flowing through the resistor 1100 on the outside (electrode portions 1430, 1440) and on the inside (electrode portions 1450, 1460) of the bonding electrodes 1410, 1420 is not significantly different. It becomes difficult to measure the voltage with high accuracy even if any of the positions 1420 is used. FIG. 4 illustrates the above.
This is the reason why the voltage fluctuation including the error of ± 10% or more was shown in all four conditions (1) to (4) using the comparison resistor.

As described above, when manufacturing the resistor having the above structure, a material having a specific resistance satisfying the condition of (specific resistance of electrode material / specific resistance of resistor material = 1/150 to 1/2) is used. When a resistor and an electrode are manufactured using the resistor and the thickness ratio of the resistor and the connection electrode is set to 1/10 or more, a resistor that can accurately measure a voltage can be manufactured. Is measured, the voltage can be measured with higher accuracy by connecting the wire connecting position outside the center of the bonding electrode.

[Second Embodiment] Next, the structure and characteristics of a resistor according to a second embodiment will be described below.

[Structure of Second Resistor] FIG.
5 shows a resistor 500 according to a second embodiment soldered on a 0 conductor pattern. The resistor 500 has 510
Metal resistors, electrodes 521 and 522 as connection terminals
It is composed of

In the voltage measurement using the resistor 500, the conductor pattern of the substrate 550 is connected to the electrodes 521 and 522, and the wires are respectively placed at the positions 542 and 543 shown in FIG. Connected and the voltage drop between 542 and 543 is measured.
The width of 542 and 543 shown in FIG.
And 522, which are formed as positions suitable for connecting wires.

The resistor 500 has one rectangular parallelepiped shape.
A rectangular parallelepiped electrode 521 is connected to the resistor 510 shown in FIG.
It is a structure joined as shown in FIG. Thickness of resistor 510
(T _R) Is about 50 to 2000 μm, for example.
The thickness of the poles 521, 522 (t _E) Is, for example, about 10 to 5
The thickness of the electrodes 521 and 522 and the resistance
The thickness ratio of 10 is t_E/ T_R> 1/10 designed
You. The surface of each electrode has a melting point of about 2 to 10 μm.
Solder films 531 and 532 are formed.

The resistor 500 is designed to easily dissipate heat, and is used to mount the resistor 500 on a printed circuit board or the like.
As 50, for example, an aluminum substrate, a glass epoxy substrate, a metal core substrate (a substrate in which a Cu pattern is pasted on a metal such as aluminum via an insulating adhesive layer such as boron nitride), a DBC substrate ( Direct bonding copper substrate, a substrate in which a copper pattern is directly adhered directly to a highly heat-dissipating base material such as alumina or aluminum nitride without using an adhesive layer). The substrate 550 is also connected to a heat sink. It has become.

That is, since the heat generated in the resistor 500 when a high current is measured is transmitted in the direction of the substrate 550, the junction surface between the resistor 500 and the substrate 550 is important. A feature is that a thick copper plate having good heat conductivity is used for the electrodes 521 and 522, which are bonding surfaces with the substrate 550, and the bonding area is large.

Further, the current when measuring a high current is determined by the pattern of the substrate 550 and the one electrode 52 of the resistor 500.
1 flows to the resistor 510, and further flows from the resistor 510 to another electrode 522. Also, the resistor 51
The positions indicated by 542 and 543 on the substrate 0 are connected to a predetermined pattern of the substrate 550 by wire bonding using an aluminum wire or the like, and the voltage drop between the patterns when a high current flows, that is, the voltage drop across the resistor 500 is determined. Measure. Therefore, the resistor 500 having the structure of FIG. 8 can be used at a large current.

In the above description, an example of connection by wire bonding has been described. However, even without wire bonding, a voltage measurement land pattern can be taken out from a substrate land pattern to measure a voltage drop.

As a material for the resistor 510, for example, C
A u-Ni alloy (such as CN49R), various metal alloys and various noble metal alloys shown in FIG. 4 are used, and a metal alloy or a noble metal that conforms to various characteristics such as specific resistance, TCR, and resistance change determined according to specifications. An alloy or the like is appropriately selected from FIG. 4 and used. Further, other than FIG. 4, for example, a manganese-copper-nickel alloy may be used.

Further, as shown in FIG. 4, when a noble metal alloy is used, a resistor 110 having an extremely low electric resistance of about 2 to about 7 μΩ · cm is obtained. When used as body 510,
The resistance value of the resistor 500 having the structure shown in FIG.
０．１0.15 mΩ.

As a material for the electrodes 521 and 522, a copper material (for example, about 1.6 μΩ · cm) having a lower electric resistance than the resistor 510 is used.
0 and the electrode 521 or the resistor 510 and the electrode 522 are joined by cladding.

The electrode material used for the electrodes 521 and 522 and the resistor material used for the resistor 510 are defined as the specific resistance / resistor of the electrode material whose specific resistance ratio is expressed by the following equation. Specific resistance of material = 1/150 to 1 /
It is more preferable to use a material having a specific resistance satisfying Condition 2.

The electrode surfaces of the two electrodes 521 and 522 are designed to have a large electrode area so that heat is easily transmitted to the substrate 550 in order to easily radiate the heat generated when measuring a high current. It is characterized by using a thick copper plate having good thermal conductivity and having a large bonding area.

On the surfaces of the electrodes 521 and 522,
In order to improve the solderability of the board to the conductor pattern, for example, films 531 and 532 of a molten solder material (Sn: Pb = 9: 1) or a lead-free molten solder material are formed. Since the diffusion layer is formed between the copper electrode 521 or 522 and the conductive pattern of the substrate by using the molten solder material, the bonding strength of the electrode is improved, and the electrical reliability is also improved.

The characteristic of the resistor 500 is that the resistor 51
0 has a simple structure consisting of a flat plate.
Is that there is no cut 1300 as seen in the shunt resistor 1000 in FIG.

That is, in the resistor 500, the resistor 51
The resistance value is adjusted by changing the thickness of the 0 plate (the thickness of the resistor 510 exposed on the electrode side on the upper and lower surfaces of the resistor 500 in FIG. 7). Examples of a method of adjusting the thickness of the resistor 510 include polishing, laser processing, sand blasting, and etching, and the method of adjusting the resistor 510 so that the resistor 500 has a predetermined resistance value by using the above method. Adjust the thickness. When adjusting the thickness of the resistor 510, one or both of the upper surface and the lower surface of the resistor 510 may be processed by the processing method described above.

As described above, in the resistor 500, the resistor 5
10 has no cut, the current path when current flows is stable, and the resistance change (ΔR
/ R) can be reduced to about 1 / several 10 to 1/200.

The resistor 510 has a resistance of about 2 to 7 μΩ · cm.
When a noble metal alloy having an extremely low electric resistance is used, the resistance value of the resistor 500 becomes about 0.04 to 0.15 m.
Therefore, a resistor suitable for measuring a high current can be obtained.

[Measurement of Voltage Using Resistor] FIG. 8 (a)
FIG. 8B shows a resistor 5 manufactured by the above-described manufacturing method.
10 shows the dimensions of each part and the connection positions of the wires when measuring the voltage using the resistor 500. The thickness t _E of the electrode joined to the resistor 510 of the resistor 500 and the substrate is t _E / t.
_R > 1/10.

In FIGS. 8A and 8B, L
_w1 and L _w2 have the same width as the junction electrode electrodes 522 and 521, and the positions given the numbers 1 to 18 described on the left surface portion 542 and the right surface portion 543 of the resistor 510 are as follows:
The position where a wire is connected at the time of voltage measurement is shown. That, L ₁ is the distance from the left outside edge of the resistor 510, L ₂ is the distance from the right outer end of the resistor 510.

The structure of the comparative resistor thus produced is different only in the thickness t _{E of the} electrode joined to the substrate of the resistor 500 (that is, designed so that t _E / t _R <1/10).
All other dimensions are the same as resistor 500.

The positions of L ₁ and L ₂ illustrated in FIG. 8 (a) indicate the positions where the wires at the time of voltage measurement are connected to the surface of the resistor 510, respectively, where L ₁ / L _w1 = 0.5. ,
L is a ₂ / _L w2 = 0.5.

FIGS. 8A to 8D show combinations of positions where wires are connected to the surface of the resistor 510 at the time of voltage measurement. That is, (1)
The connection position of the wires _{is, L 1 / L w1> 0.5} , L 2
4 shows combinations of wire connection positions when the condition of / L _w2 > 0.5 is satisfied.

Similarly, (2) indicates that L ₁ / L _w1 > 0.5,
A combination of connecting a wire to a position that satisfies the condition of L ₂ / L _w2 <0.5 is shown, and (3) shows L ₁ / L
_{w1 <0.5, L 2 / L} w2> shows a combination of connecting wires to satisfy the position of 0.5, (4)
_Shows a combination of L ₁ / L w1 _<0.5, the condition is satisfied position of _{L 2 / L} w2 <0.5 connecting wire.

FIG. 9 shows the result of voltage measurement by the resistor 500 shown in FIGS. 8A and 8B together with the result of voltage measurement by using a comparative resistor.

The measuring conditions (1) to (4) in FIG. 9 correspond to the measuring conditions (1) to (4) shown in FIG. The voltage V measured with the resistor 500, etc., were organized view with variation ΔV of the voltage shown in the following equation (measured voltage to the reference voltage V _0).

ΔV = (V ₀ −V) / V ₀ × 100 (%) In FIG. 9, the voltage variation (ΔV) under the measurement conditions (1) to (4) is determined by the thickness of the bonding electrode for bonding to the substrate. Ratio (t _E ) to the thickness (t _R ) of the resistor is t _E / t _R > 1
It was displayed separately in the case of / 10 case and _{t E / t R ≦ 1/} 10 of the.

[In the case of the resistor 500] First, in the case of the resistor 500 of the second embodiment (t _E / t _R > 1/10), the effect of the position where the wire is connected on the voltage variation value ΔV Will be described.

FIG. 9 shows that the four conditions (1) to (4) are
By comparison, condition (4) (L₁/ L _w1<0.5, L₂
/ L_w2<0.5) means that the voltage fluctuation (ΔV) is ± 0.1%
Within the minimum and optimum conditions. That is, voltage measurement
When the wire for connection is connected to the surface of the resistor 510, FIG.
542 and 543 (less than 1/2 of the outer edge)
Voltage fluctuation can be minimized by connecting
can do.

The measurement results other than the condition (4) are as follows. That is, in the case of the condition (1), (L ₁ / L
_{w1> 0.5, L 2 / L} w2> 0.5) , the voltage variation ([Delta] V) is the largest and 5 to 10% ±, the condition is not suitable for stable voltage measurement. That is, when the voltage measuring wire is connected to the surface of the resistor 510, the voltage measuring wire 544 of FIG.
And 546 (the surface of the resistor that is larger than か ら from the outer end), the voltage fluctuation is maximized.
Further, in the case of the condition (2) or the condition (3) (one of the two wires is moved from the outer end of the resistor 510 by 1
/ 2, which connects the other wire to a position greater than 1/2, ie, the inner position, from the outer end of resistor 510).
Is ± 3 to 5%, which is an intermediate condition between the conditions (1) and (4).

[Case of Comparison Resistor] Next, in the comparison resistor (t _E / t _R <1/10), the effect of the position where the wire is connected on the voltage variation ΔV will be described.

From FIG. 9, comparing the four conditions (1) to (4), the voltage fluctuation ΔV is ± 10% or more under all the conditions (1) to (4). It is larger than the obtained voltage fluctuation ΔV.

Further, even if the conditions (1) to (4) and the connection position of the wire are changed, the voltage fluctuation ΔV does not change.
At the time of voltage measurement using the comparative resistor, the position where the wire is connected is not affected.

[Comparison between Resistor and Comparative Resistor] Based on the results of the resistor 500 and the comparative resistor, in order to suppress the voltage variation ΔV and measure the voltage with high accuracy, the structure of the resistor must be as follows. In addition, the ratio of the thickness (t _E ) of the junction electrode to the thickness (t _R ) of the resistor must satisfy the condition of t _E / t _R > 1/10 (the structure of the resistor 100).

Further, when measuring the voltage using the resistor 500 satisfying the above conditions, the condition shown in the condition (4), ie, L ₁ / L _w1 <0.5, L ₂ / L _w2 <
When the wires are connected to the positions of the resistors 542 and 543 satisfying the condition of 0.5 (the connection position of the wires with respect to the width of the electrode is a position outside of か ら from the electrode end),
Voltage fluctuation (ΔV) can be suppressed to the minimum fluctuation within ± 0.1%, for example.

The reason will be described with reference to FIGS. 10 and 11.

FIG. 10 shows patterns 551 and 552 of the substrate.
FIG. 11 shows a case where the voltage is measured using the resistor 500 mounted on the top (t _E / t _R > 1/10), and FIG.
When a voltage is measured using a comparative resistor mounted on the patterns 1551 and 1552 of the substrate (t _E / t _R <1
/ 10). When the current I (A) is detected by using a resistor in FIG. 10 or FIG.
Then, a voltage drop V (V) across the resistor when a high current I (A) is applied is measured, and a current value I (A) is calculated using I = V / R.

That is, referring to FIG. 10, for example, the pattern 552 on the substrate is connected to the bonding electrode 522 and the pattern 551 on the substrate is connected to the bonding electrode 521. The voltage between 542 and 543 is measured. Also, referring to FIG. 11, the pattern 1552 on the substrate is connected to the bonding electrode 1522 and the pattern 1551 on the substrate is connected to the bonding electrode 1521. Is measured. 10 and 11 also show the flow of the current I passing through the resistor 510 or 1510.

Incidentally, for example, the resistor surface portions 542 and 543
In order to accurately measure the voltage between
It is desirable to perform the measurement under the condition that almost no current flows between 42 and 543, and if the current flows, an error occurs in the voltage measurement.

First, using the resistor 500 shown in FIG.
Of current I passing through resistor 510 when measuring
This will be described. For the resistor 500, the thickness of the junction electrode
(T _E) Is t_E/ T_RSo that it becomes> 1/10
It is designed to be relatively thick with respect to the resistor 510.
ing. Therefore, the conductor resistance of the bonding electrode must be low.
Current passing through the resistor 510 from the junction electrode 52
1, 522 (the shortest path shown in bold in FIG. 10)
Path), most of the current flows, and the rest of the current
Will flow along the path.

Further, as shown in FIG. 10, the current flowing in a path other than the shortest path decreases as the path becomes farther from the shortest path. Therefore, for example, the resistor surface portion 5
In order to accurately measure the voltage of the resistor 500 between 42 and 543, the voltage can be measured more accurately as the voltage is measured under the condition that almost no current flows between the resistor surface portions 542 and 543.

Also, comparing the effect of the current flowing through the resistor 510 at the wire connection positions 542 and 544 during the voltage measurement shown in FIG. 10, the current 542 flowing through the resistor 510 is smaller in 542 than in 544. Less susceptible. The same can be said for the wire connection positions 543 and 546. That is, 543 is less affected by the current I flowing through the resistor 510 than 546.

From this, it can be seen in FIG. 10 that a voltage can be measured with high accuracy by connecting a wire to a position distant from the current path flowing through the resistor 510. That is, the position where the wire is connected is 54
It can be seen that the combination of 2 and 543 is the optimal position, while the combination of 544 and 546 is the worst. This is the reason why different voltage fluctuations are shown in FIG. 9 using the resistor 500 under the four conditions (1) to (4).

The measurement result of the resistor 500 shown in FIG. 9 is almost the same as the measurement result of the resistor 100 shown in FIG. This indicates that, in the voltage measurement, no change occurs in the measurement results of the two even if the bonding electrode is used like the resistor 100 or the bonding electrode is not used like the resistor 500. The reason for this is that the voltage fluctuation during voltage measurement depends on the current path passing through the inside of the resistor. That is, the resistor 10
The current path and the shortest path in 0 and the resistor 500 are exactly the same as shown in FIG. 5 and FIG. If the position where the wire is connected for voltage measurement is the same for both, the current distribution causing voltage fluctuation during voltage measurement is the same.
For this reason, under the conditions (1) to (4) where the positions where the wires are connected are the same as shown in FIGS. No results were obtained.

Next, the flow of the current I passing through the resistor 1510 when measuring the voltage using the comparison resistor of FIG. 11 will be described. In the comparative resistor, the thickness of the junction electrode is designed to be t _E / t _R <1/10. Therefore, since the conductor resistance of the bonding electrode increases, the current I passing through the resistor 1510 is
The shortest distance of 521 (the shortest path shown in bold in FIG. 11)
10 decreases as compared with FIG. 10, and the current flowing through paths other than the shortest path in FIG. 11 increases.

Further, as shown in FIG. 11, the current flowing in the path other than the shortest path decreases as the path is farther from the shortest path, but becomes considerably larger than that in FIG. For this reason, it is difficult to suppress the current flowing through the measuring unit when performing voltage measurement using the comparison resistor, so that the voltage fluctuation becomes large and accurate voltage measurement becomes difficult.

When comparing the effects of the current flowing through the surface portions 1542 and 1544 of the resistor at the time of voltage measurement shown in FIG. 11, there is no significant difference in the effect of the current I flowing between 1542 and 1544. The same is true for the surface portions 1543, 1
546, the effect of the current I flowing through the surface portions 1543 and 1546 of the resistor is not much different.

Therefore, it is difficult to measure the voltage with high accuracy because the comparison resistor is greatly affected by the current I flowing through the resistor 1510 when measuring the voltage. Voltage cannot be measured. This is the reason why the voltage fluctuation including the error of ± 10% or more is shown in FIG. 9 using the comparison resistor under all four conditions (1) to (4).

As described in the first and second embodiments, when manufacturing a resistor having the above-described structure, the ratio of the thickness of the resistor to the connection electrode is reduced to 1/10. By doing so, it is possible to manufacture a resistor that can accurately measure a voltage.

When the voltage is measured using the resistor described in the first embodiment, the position where the voltage measuring wire is connected is located outside the center of the bonding electrode, that is, the current of the electrode is measured. By connecting and using a wire for voltage measurement outside 1/2 of the length along the direction,
The voltage can be measured more accurately.

When measuring the voltage using the resistor described in the second embodiment, the position where the voltage measuring wire is connected to the resistor is indicated by 542 and 54 shown in FIG.
3 (that is, the electrodes 521, 5
A wire for voltage measurement is connected to the second surface of the resistor facing the first surface on which the first electrode 22 is disposed and at a position outside of a half of the length along the direction of the current of the electrode). By using this, the voltage can be measured more accurately.

[Third Embodiment] In the first and second embodiments, the description has been given of the resistor and the method of using the resistor. However, when using the resistor as a component for voltage measurement, the user may use the resistor for voltage measurement as described in the first embodiment and the second embodiment, for example. It is necessary to connect using a wire, and connecting the voltage measurement wire may be troublesome for the user.

As described above, when it is troublesome for the user to connect the wires for voltage measurement, for example, the resistor described above is connected in advance to the optimal position of the dedicated substrate using the voltage measurement wires, and the voltage measurement is performed. It is also possible to provide the user with a modularized electronic component.

When this electronic component is provided, the user can save time and labor for operations such as wire bonding, so that the voltage can be measured more easily.

Therefore, referring to the drawings, the third embodiment and the fourth embodiment will be described using the resistors described in the first embodiment and the second embodiment. The electronic components for voltage measurement and how to use them will be described in detail.

First, the structure and characteristics of the electronic component according to the third embodiment will be described below.

[Structure of Electronic Component for Current Detection] FIG.
2 shows a structure of an electronic component 200 for detecting a current. Electronic component 2
Reference numeral 00 denotes a module in which the resistor 100 is mounted on a dedicated substrate 180 and modularized.
The present invention has been devised so that current detection using the above can be performed more easily.

That is, on the substrate 180, the electrodes 121,
A plurality of wiring patterns 161 and 16 made of a copper material or the like are formed on an insulator 183 having a resistivity higher than 122.
2, 171 and 172 are formed. In addition, resistor 1
00 electrodes 121 and 122 are directly mounted on the respective wiring patterns 161 and 162 at the respective opposing positions,
The bonding electrodes 141 and 142 are connected to the respective wiring patterns 171 and 172 of the substrate 180 via wires 181 and 182 for voltage measurement.

The connection position of the wires 181 and 182 on each of the bonding electrodes 141 and 142 is, as shown in FIG. Are formed at positions 143 and 144 suitable for wire connection, which are outside the half of the electrode length.

Therefore, the user can use the electronic component 200 to connect the voltage measuring wire 1 to the resistor 100.
The work of bonding and connecting 81 and 182 can be omitted. Further, since the electronic component 200 has a small and space-saving structure, the user can use the electronic component 2.
00 can be attached to any position of the substrate 150 shown in FIG. 1, for example. In FIG. 13, all of the resistance value 100, all of the wires 181 and 182, and a part of each of the wiring patterns 161, 162, 171, and 172 may be molded with resin.

Fourth Embodiment [Structure of Electronic Component for Current Detection] Next, the structure and characteristics of an electronic component according to a fourth embodiment will be described below. FIG. 14 shows the structure of an electronic component 600 for current detection. The electronic component 600 is a module in which the resistor 500 shown in FIG. 7 is mounted on a dedicated substrate 580 and is modularized. The electronic component 600 is designed so that a user can more easily perform current detection using the resistor 500. is there.

That is, the electrode 521,
A plurality of wiring patterns 561 and 56 made of a copper material or the like are formed on an insulator 583 having a specific resistance higher than 522.
2, 571 and 572 are formed. In addition, resistor 5
00 electrodes 521 and 522 are directly connected to the respective wiring patterns 561 and 562 at the opposing positions, and further, at the positions of the resistors 542 and 543,
Substrate 580 via wires 581 and 582 for voltage measurement
Are connected to the respective wiring patterns 571 and 572.

Note that the positions of 542 and 543 for connecting wires to the resistor 510 in FIG. 14 are on the second surface of the resistor opposite to the first surface on which the electrodes 521 and 522 are arranged at both ends of the resistor. And the length of the electrode along the direction of current
The voltage can be measured with higher accuracy by connecting the voltage measuring wires 581 and 582 at the positions 542 and 543 outside the position 2.

Therefore, by using the electronic component 600, the user can save the trouble of bonding and connecting the voltage measuring wire to the resistor 500. In addition, since the electronic component 600 has a small size and a structure that does not take up space, the user can use the electronic component 600, for example,
It is also possible to attach to an arbitrary position of the substrate 550 shown in FIG.

In FIG. 14, all of the resistor 500, all of the wires 581 and 582, and the wiring pattern 56 are shown.
Each of the parts 1, 562, 571, and 572 may be modularized and integrated by molding resin molding or other methods.

[0143]

As described above, according to the present invention, a resistor suitable for current measurement and a method of using the same can be provided.

Further, according to the present invention, it is possible to provide an electronic component using a resistor suitable for the above-described current measurement and a method of using the same.

[Brief description of the drawings]

FIG. 1 is a schematic structural diagram of a resistor according to a first embodiment of the present invention.

FIG. 2 is a diagram showing types of resistors.

FIG. 3 is a diagram showing dimensions and wire connection positions of a resistor according to the first embodiment of the present invention.

FIG. 4 is a diagram comparing a voltage variation value depending on a wire connection position to a resistor and a thickness of a junction electrode / thickness of a resistor according to the first embodiment of the present invention.

FIG. 5 is a diagram for explaining an effect of a thickness of a junction electrode / a thickness of a resistor on a current flow.

FIG. 6 is a diagram for explaining the effect of the thickness of the junction electrode / the thickness of the resistor on the current flow.

FIG. 7 is a schematic structural view of a resistor according to a second embodiment of the present invention.

FIG. 8 is a diagram showing the dimensions and wire connection positions of a resistor.

FIG. 9 is a diagram comparing voltage fluctuation values depending on the position of wire connection to a resistor and the thickness of a junction electrode / thickness of a resistor.

FIG. 10 is a diagram for explaining the effect of the thickness of the junction electrode / the thickness of the resistor on the flow of current.

FIG. 11 is a diagram for explaining an effect of a thickness of a bonding electrode / a thickness of a resistor on a current flow.

FIG. 12 is a schematic structural view of a conventional shunt resistor.

FIG. 13 is a schematic structural view of a current measuring electronic component according to a third embodiment of the present invention.

FIG. 14 is a schematic structural view of a current measuring electronic component according to a fourth embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 resistor 110 resistor 121 bonding electrode 122 bonding electrode 131 molten solder material 132 molten solder material 141 bonding electrode 142 bonding electrode 143 position suitable for connection of voltage measurement wire 144 position suitable for connection of voltage measurement wire 200 Electronic component 161 Wiring pattern 162 Wiring pattern 171 Wiring pattern 172 Wiring pattern 180 Substrate 181 Voltage measuring wire 182 Voltage measuring wire 183 Insulator

Claims (28)

[Claims] 1. A resistor comprising a substantially plate-shaped resistor alloy, at least two first electrodes made of a metal having high conductivity, and at least two second electrodes made of a metal, The first electrode is on a first surface of the resistor and at both ends of the resistor, and the second electrode is on a second surface and both ends of the resistor facing the first surface. The first and second electrodes are arranged so as to sandwich the resistor, and the thickness of the first electrode is larger than 1/10 of the thickness of the resistor. 2. The resistor according to claim 1, wherein the surface of the first electrode is coated with a molten solder material or a lead-free molten solder material. 3. The resistor according to claim 1, wherein a position to which a voltage measuring wire is connected is formed in the resistor. 4. The resistance of the electrode material used for the first electrode is 1 to the specific resistance of the resistor material used for the resistor.
The resistor according to any one of claims 1 to 3, wherein the resistance is larger than / 150 and smaller than 1/2. 5. The resistor material is made of an Fe—Cr alloy, C
u-Ni alloy, Ni-Cr alloy, 6-element alloy, 7-element alloy, 8-element alloy, 9-element alloy, Pd-Pt alloy,
The resistor according to claim 4, wherein the resistor is selected from an Au-Ag alloy and an Au-Pt-Ag alloy. 6. The resistor according to claim 1, wherein the thickness of the resistor is adjusted to have a predetermined resistance value by any one of a polishing process, a laser process, a sand blast process, and an etching process. A resistor according to claim 5. 7. An electrode comprising at least two electrodes made of a metal having high conductivity and separated from each other, and a resistor made of a substantially plate-shaped resistance alloy electrically and mechanically coupled to the electrodes, The thickness of the electrode is larger than 1/10 of the thickness of the resistor. 8. The resistor according to claim 7, wherein the surface of the electrode is coated with a molten solder material or a lead-free molten solder material. 9. The resistor according to claim 7, wherein a position to which a voltage measuring wire is to be connected is formed in said resistor. 10. The specific resistance of an electrode material used for said electrode is:
1/1 relative to the specific resistance of the resistor material used for the resistor
The resistor according to any one of claims 7 to 9, wherein the resistor is larger than 50 and smaller than 1/2. 11. The resistor material is an Fe—Cr alloy,
Cu-Ni alloy, Ni-Cr alloy, 6-element alloy, 7
The resistor according to claim 10, wherein the resistor is selected from a binary alloy, an 8-ary alloy, a 9-ary alloy, a Pd-Pt-based alloy, an Au-Ag alloy, and an Au-Pt-Ag alloy. 12. The resistor according to claim 7, wherein the thickness of the resistor is adjusted to have a predetermined resistance value by any one of polishing, laser processing, sandblasting and etching. The resistor according to claim 11. 13. The method of using a resistor according to claim 1, wherein the length of the resistor on the second electrode and the length of the resistor along the current direction of the second electrode are smaller than ２. A method for using a resistor, characterized in that a wire for voltage measurement is connected to the outside. 14. The method of using a resistor according to claim 7, wherein the electrode is disposed on a first surface of the resistor and at both ends of the resistor. A voltage measuring wire connected to a second surface opposite to the first surface of the first electrode and outside a half of a length of the electrode along a current direction, and used. How to use 15. A resistor comprising a substantially plate-shaped resistor alloy, wherein at least two first electrodes are provided near a first surface and both ends of the resistor, and opposed to the first surface. A resistor having at least two second electrodes near a second surface and both end portions to be formed; at least two first substrate electrodes connected to the second electrode of the resistor; and the resistor An insulating substrate having at least two second substrate electrodes connected to the first electrode via a metal wire, wherein the second electrode of the resistor is made of a metal having a high conductivity. An electronic component, wherein the electronic component is formed to be at least 1/10 the thickness of the resistor. 16. The surface of the first electrode is coated with a molten solder material or a lead-free molten solder material, and the first electrode is connected to the insulating substrate via the molten solder material or the lead-free molten solder material. The electronic component according to claim 15, wherein the electronic component is connected. 17. The first electrode and the metal wire,
17. The electronic component according to claim 15, wherein the electronic component is connected outside the half of the length of the first electrode along the direction of the current flowing through the resistor. 18. 18. The semiconductor device according to claim 18, wherein a specific resistance of an electrode material used for said first electrode is larger than 1/150 and smaller than 1/2 with respect to a specific resistance of a resistor material used for said resistor. The electronic component according to any one of claims 15 to 17. 19. The resistance body material is an Fe—Cr alloy,
Cu-Ni alloy, Ni-Cr alloy, 6-element alloy, 7
The electronic component according to claim 18, wherein the electronic component is selected from a binary alloy, an 8-ary alloy, a 9-ary alloy, a Pd-Pt-based alloy, an Au-Ag alloy, and an Au-Pt-Ag alloy. 20. The resistor according to claim 15, wherein the thickness of said resistor is adjusted to have a predetermined resistance value by any one of polishing, laser processing, sandblasting and etching. To claim 19
Electronic components according to the above. 21. A resistor made of a substantially plate-shaped alloy for a resistor, the resistor having at least two electrodes near a first surface and both end portions of the resistor; At least two first substrate electrodes connected to the electrodes, and at least two second substrates connected via a metal wire to a second surface opposite to the first surface of the resistor and near both ends; An electronic component, comprising: an insulating substrate having a substrate electrode of (1), wherein the electrode of the resistor is formed of a metal having high conductivity to a thickness of 1/10 or more of the thickness of the resistor. 22. The resistor and the metal wire have a length of one of the electrodes along a direction of a current flowing through the resistor.
22. The electronic component according to claim 21, wherein the electronic component is connected outside // 2. 23. A method according to claim 23, wherein the surface of the electrode is coated with a molten solder material or a lead-free molten solder material, and the electrode is connected to the insulating substrate via the molten solder material or the lead-free molten solder material. The electronic component according to claim 21, wherein: 24. The specific resistance of the material used for the electrode of the resistor is 1/150 to 1/2 of the specific resistance of the alloy for the resistor.
21. The method according to claim 19, wherein:
4. The electronic component according to any one of 3. 25. An alloy for a resistor, comprising: an Fe—Cr alloy, a Cu—Ni alloy, a Ni—Cr alloy, a ternary alloy, a ternary alloy, an octal alloy, a ninary alloy, Pd-Pt
22. The electronic component according to claim 21, wherein the electronic component is selected from a system alloy, an Au-Ag alloy, and an Au-Pt-Ag alloy. 26. The resistor according to claim 21, wherein the thickness of the resistor is adjusted to have a predetermined resistance value by any one of polishing, laser processing, sandblasting, and etching. To claim 25
Electronic components according to the above. 27. The method of using an electronic component according to claim 15, wherein the measurement of a current flowing through the at least two first substrate electrodes includes: The use method characterized in that a second substrate electrode is used. 28. The method of using an electronic component according to claim 21, wherein the measurement of a current flowing through the at least two first substrate electrodes includes: The use method characterized in that a second substrate electrode is used.