JPH0531707A - Preparation of wooden panel - Google Patents
Preparation of wooden panelInfo
- Publication number
- JPH0531707A JPH0531707A JP21450991A JP21450991A JPH0531707A JP H0531707 A JPH0531707 A JP H0531707A JP 21450991 A JP21450991 A JP 21450991A JP 21450991 A JP21450991 A JP 21450991A JP H0531707 A JPH0531707 A JP H0531707A
- Authority
- JP
- Japan
- Prior art keywords
- wood
- wood chips
- board
- aqueous solution
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Dry Formation Of Fiberboard And The Like (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明はプレキュア層の少ない
木質板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wood board having a small amount of precure layer.
【０００２】[0002]
【従来技術】多段プレスを用いて木質板を製造する際、
プレス圧締時に規定厚みにまで木質板を圧締するのに数
十秒の時間を要する。その間木質板の表層部は熱盤と接
触しているため規定の圧力がかかるまでの間に接着剤が
プレキュアしてしまい、木質板の表層部の最外層は接着
不良となる。従って製品にするには表層部を削り取る必
要があるので、木質板製造用素材や接着剤のロスが大き
い。2. Description of the Related Art When manufacturing a wood board using a multi-stage press,
It takes several tens of seconds to press the wood board to the specified thickness during press-pressing. During that time, since the surface layer of the wooden board is in contact with the hot platen, the adhesive agent is pre-cured before the prescribed pressure is applied, and the outermost layer of the surface layer of the wooden board has poor adhesion. Therefore, since it is necessary to scrape off the surface layer to make a product, there is a large loss of the wood board manufacturing material and the adhesive.
【０００３】そのため、木質板のプレキュアを防止する
ため、表層用接着剤にアンモニア水やヘキサメチレンテ
トラミン等のアルカリ物質を添加する方法、特公昭５８
−４５９４６号に見られるように尿素樹脂にアルカリレ
ゾールを添加する方法、硬化剤なしで尿素樹脂系接着剤
を使用して木質板を製造する方法を試みたが、これらの
方法ではプレキュア層を完全になくすことは難しく、少
なくとも０．５〜０．６ｍｍのプレキュア層が発生し
た。なお、硬化剤なしでも尿素樹脂系接着剤が硬化する
のは、熱圧時に木材チップから何らかの酸性物質が遊離
し、これが尿素樹脂系接着剤の硬化剤として働くためと
思われる。Therefore, in order to prevent the pre-cure of the wood board, a method of adding an alkaline substance such as ammonia water or hexamethylenetetramine to the surface layer adhesive, JP-B-58.
No. 45946, a method of adding an alkali resol to a urea resin and a method of manufacturing a wood board using a urea resin adhesive without a curing agent were tried, but in these methods, the precure layer was completely removed. It was difficult to eliminate it, and a precure layer of at least 0.5 to 0.6 mm was generated. The reason why the urea resin-based adhesive cures even without the curing agent is considered to be that some kind of acidic substance is released from the wood chips during hot pressing and this acts as a curing agent for the urea resin-based adhesive.
【０００４】[0004]
【発明が解決しようとする課題】この発明は上述した欠
点を解消し、プレキュア層の少ない木質板を提供するも
のである。SUMMARY OF THE INVENTION The present invention solves the above-mentioned drawbacks and provides a wood board having a small amount of precure layer.
【０００５】[0005]
【課題を解決するための手段】この発明は、木材チッ
プ、木材繊維等の木質板製造用素材に、予めアルカリ水
溶液を塗布した後、アミノ系接着剤を塗布してフォーミ
ングし、その後熱圧成型することを特徴とする木質板の
製造方法、および、木材チップ、木材繊維等の木質板製
造用素材に、予めアルカリ水溶液を塗布した後、アミノ
系接着剤を塗布したものを表層用とし、内層用にはアル
カリ水溶液を塗布せずに直接接着剤を塗布したものを用
いてフォーミングし、その後熱圧成型することを特徴と
する木質板の製造方法に係る。SUMMARY OF THE INVENTION The present invention is to apply a base material for wood board production such as wood chips and wood fibers to an alkaline aqueous solution in advance, and then apply an amino-based adhesive to perform forming, and then hot press molding. A method for manufacturing a wooden board characterized by that, and wood chips, such as wood chips, wood fiber manufacturing materials such as wood fibers, after applying an aqueous alkaline solution in advance, for the surface layer that is applied with an amino-based adhesive, the inner layer The present invention relates to a method for manufacturing a wood board, which is characterized in that forming is performed by using a material to which an adhesive is directly applied without applying an alkaline aqueous solution, and then hot pressing is performed.
【０００６】この発明において、木質板とは、パーティ
クルボード、ハードボード、ＭＤＦ（中比重繊維板）等
を指す。In the present invention, the term "wood board" means particle board, hard board, MDF (medium density fiber board) or the like.
【０００７】以下、この発明の木質板の製造方法につい
て詳述する。木材チップ、木材繊維等の木質板製造用素
材に、まずアルカリ水溶液を塗布する。アルカリ水溶液
としては、希苛性ソーダー水・アンモニア水・ヘキサミ
ン水・レゾール型フェノール樹脂の希薄水溶液等アルカ
リ性を呈する水溶液であれば何でもよい。塗布量は木質
板製造用素材の含水率が高くなり過ぎて後で塗布する接
着剤が接着不良を起こすことがないような範囲で決定さ
れる。なお、アルカリ水溶液の浸透性を向上させるため
に一般に知られている界面活性剤を少量添加してもよ
い。The method of manufacturing the wood board of the present invention will be described in detail below. First, an aqueous alkaline solution is applied to a material for producing a wood board such as wood chips and wood fibers. The alkaline aqueous solution may be any aqueous solution exhibiting alkalinity such as dilute caustic soda water, ammonia water, hexamine water, and dilute aqueous solution of resol type phenolic resin. The coating amount is determined in such a range that the water content of the material for manufacturing a wood board becomes too high and the adhesive agent applied later does not cause adhesion failure. A generally known surfactant may be added in a small amount in order to improve the permeability of the alkaline aqueous solution.
【０００８】木材チップ、木材繊維等の木質板製造用素
材にアルカリ水溶液を塗布するとなぜプレキュア層の少
ない木質板が得られるのかはっきりとした理由はわから
ないが、熱圧時に木材チップから遊離する酸性物質を上
記アルカリ水溶液が中和することによって表層部の硬化
時間を遅らせているからではないかと思われる。Although it is not clear why an aqueous alkaline solution is applied to a material for producing a wood board such as wood chips and wood fibers, a wood board having a small precure layer can be obtained, but an acidic substance liberated from the wood chips when hot pressed. It seems that the curing time of the surface layer portion is delayed by neutralizing the above with the alkaline aqueous solution.
【０００９】次に、このアルカリ水溶液を塗布した木材
チップ、木材繊維等の木質板製造用素材にアミノ系接着
剤を塗布する。アミノ系接着剤とは、尿素樹脂接着剤、
メラミン樹脂接着剤、メラミン変性尿素樹脂接着剤、グ
アナミン変性尿素樹脂接着剤、メラミン変性フェノール
樹脂接着剤等を指す。アミノ系接着剤の塗布量は、乾燥
した木材チップに対し樹脂固形分換算で５〜１３％位が
一般的であるが、これに限定されるものではない。Next, an amino-based adhesive is applied to the wood chip manufacturing material such as wood chips and wood fibers coated with the alkaline aqueous solution. Amino adhesives are urea resin adhesives,
A melamine resin adhesive, a melamine modified urea resin adhesive, a guanamine modified urea resin adhesive, a melamine modified phenol resin adhesive, etc. are pointed out. The coating amount of the amino-based adhesive is generally about 5 to 13% in terms of resin solid content with respect to the dried wood chips, but is not limited to this.
【００１０】厚みの薄い木質板であれば、アルカリ水溶
液を塗布した木材チップ、木材繊維等の木質板製造用素
材にアミノ系接着剤を塗布したもののみで木質板を製造
してもよいが、厚みのある木質板であれば、アルカリ水
溶液を塗布した木材チップ、木材繊維等の木質板製造用
素材は表層用として用い、内層にはアルカリ水溶液を塗
布せずに直接アミノ系接着剤を塗布したものを用いる。As far as the wood board is thin, the wood board may be manufactured only by applying an amino-based adhesive to a wood board manufacturing material such as wood chips and wood fibers coated with an alkaline aqueous solution. If it is a thick wooden board, wood chips, wood fibers, etc. coated with an alkaline aqueous solution are used for the surface layer, and the inner layer is directly coated with the amino adhesive without coating the alkaline aqueous solution. Use one.
【００１１】[0011]
【実施例１】表層用木材チップに、１％アルカリレゾ−
ル水溶液を８重量％（乾燥した木材チップに対し）添加
した後、尿素樹脂接着剤を樹脂固形分換算で９．５重量
％（乾燥した木材チップに対し）塗布した。内層用木材
チップには尿素樹脂接着剤を樹脂固形分換算で６重量％
（乾燥した木材チップに対し）塗布した。これ等の木材
チップをフォーミングした後、プレス温度１６０℃，プ
レス圧力２５ｋｇ／ｃｍ2 で４分間熱圧して、比重０．
６４、厚さ１５ｍｍのパ−ティクルボ−ドを製造した。Example 1 A wood chip for surface layer has a 1% alkaline solution.
8% by weight (based on the dried wood chips) of the aqueous solution of urea, and then 9.5% by weight (based on the dried wood chips) of urea resin adhesive was applied in terms of resin solid content. 6% by weight of urea resin adhesive in terms of resin solid content for wood chips for the inner layer
Applied (to dried wood chips). After forming these wood chips, they are hot pressed at a press temperature of 160 ° C. and a press pressure of 25 kg / cm 2 for 4 minutes to give a specific gravity of 0.
A particle board having a thickness of 64 and a thickness of 15 mm was manufactured.
【００１２】[0012]
【実施例２】表層用木材チップに、１％ヘキサミン水溶
液を９重量％（乾燥した木材チップに対し）添加した
後、尿素樹脂接着剤を樹脂固形分換算で１０重量％（乾
燥した木材チップに対し）塗布した。内層用木材チップ
には尿素樹脂接着剤を樹脂固形分換算で６重量％（乾燥
した木材チップに対し）塗布した。これ等の木材チップ
をフォーミングした後、プレス温度１６０℃，プレス圧
力２５ｋｇ／ｃｍ2 で４分間熱圧して、比重０．６４、
厚さ１５ｍｍのパ−ティクルボ−ドを製造した。[Example 2] 9% by weight of a 1% aqueous solution of hexamine (based on dried wood chips) was added to the surface wood chips, and then 10% by weight of urea resin adhesive was calculated as resin solids (on dried wood chips). Applied). A urea resin adhesive was applied to the inner layer wood chips in an amount of 6% by weight (based on the dried wood chips) in terms of resin solid content. After forming these wood chips, they are hot pressed at a press temperature of 160 ° C. and a press pressure of 25 kg / cm 2 for 4 minutes to give a specific gravity of 0.64,
A particle board having a thickness of 15 mm was manufactured.
【００１３】[0013]
【比較例】１％のアルカリレゾ−ル水の代わりに水を使
用すること以外は実施例１と同様にして比重０．６４、
厚さ１５ｍｍのパ−ティクルボ−ドを製造した。[Comparative Example] A specific gravity of 0.64 was obtained in the same manner as in Example 1 except that water was used instead of 1% of alkaline resole water.
A particle board having a thickness of 15 mm was manufactured.
【００１４】[0014]
【表１】 [Table 1]
【００１５】[0015]
【実施例３】木材チップに、１％アルカリレゾ−ル水溶
液を８重量％（乾燥した木材チップに対し）添加した
後、尿素樹脂接着剤を樹脂固形分換算で９．５重量％
（乾燥した木材チップに対し）塗布した。この木材チッ
プをフォーミングした後、プレス温度１６０℃，プレス
圧力２５ｋｇ／ｃｍ2 で４分間熱圧して、比重０．６
４、厚さ５ｍｍのパ−ティクルボ−ドを製造した。[Example 3] To a wood chip was added 8% by weight of an aqueous 1% alkaline resole solution (based on dried wood chip), and then a urea resin adhesive was added in an amount of 9.5% by weight in terms of resin solid content.
Applied (to dried wood chips). After forming this wood chip, it was hot pressed at a press temperature of 160 ° C. and a press pressure of 25 kg / cm 2 for 4 minutes to give a specific gravity of 0.6.
4. A particle board having a thickness of 5 mm was manufactured.
【００１６】[0016]
【実施例４】木材繊維に、１％ヘキサミン水溶液を７重
量％（乾燥した木材繊維に対し）添加した後、尿素樹脂
接着剤を樹脂固形分換算で１０重量％（乾燥した木材繊
維に対し）塗布した。この木材繊維をフォーミングした
後、プレス温度１６０℃，プレス圧力１０ｋｇ／ｃｍ2
で４分間熱圧して、比重０．５５、厚さ３ｍｍのＭＤＦ
を製造した。Example 4 7% by weight of a 1% aqueous solution of hexamine (based on dry wood fiber) was added to wood fiber, and then 10% by weight of urea resin adhesive was calculated as resin solid content (based on dry wood fiber). Applied. After forming this wood fiber, press temperature 160 ° C., press pressure 10 kg / cm 2
MDF with specific gravity of 0.55 and thickness of 3mm
Was manufactured.
【００１７】[0017]
【発明の効果】この発明は上述したように構成されてい
るので、プレキュア層の少ない木質板を製造することが
できる。Since the present invention is constructed as described above, it is possible to manufacture a wood board having a small number of precure layers.
Claims (2)
素材に、予めアルカリ水溶液を塗布した後、アミノ系接
着剤を塗布してフォーミングし、その後熱圧成型するこ
とを特徴とする木質板の製造方法。1. A wood board characterized in that a wood board manufacturing material such as wood chips and wood fibers is previously coated with an alkaline aqueous solution, then an amino-based adhesive is coated and formed, and then hot-pressed. Manufacturing method.
素材に、予めアルカリ水溶液を塗布した後、アミノ系接
着剤を塗布したものを表層用とし、内層用にはアルカリ
水溶液を塗布せずに直接接着剤を塗布したものを用いて
フォーミングし、その後熱圧成型することを特徴とする
木質板の製造方法。2. A material for wood board production, such as wood chips and wood fibers, which has been previously coated with an alkaline aqueous solution and then coated with an amino-based adhesive is used for the surface layer, and the inner layer is not coated with the alkaline aqueous solution. A method for manufacturing a wood board, which comprises forming by directly applying an adhesive to a sheet, followed by hot pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21450991A JP2620168B2 (en) | 1991-07-30 | 1991-07-30 | Wood board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21450991A JP2620168B2 (en) | 1991-07-30 | 1991-07-30 | Wood board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0531707A true JPH0531707A (en) | 1993-02-09 |
| JP2620168B2 JP2620168B2 (en) | 1997-06-11 |
Family
ID=16656900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21450991A Expired - Fee Related JP2620168B2 (en) | 1991-07-30 | 1991-07-30 | Wood board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2620168B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005014250A1 (en) * | 2003-08-08 | 2005-02-17 | Ripetech Pty Limited | Method for reducing precure during the curing of thermosetting resins |
| CN104760094A (en) * | 2015-03-23 | 2015-07-08 | 南京林业大学 | Functional wood-based composite material and manufacture method thereof |
-
1991
- 1991-07-30 JP JP21450991A patent/JP2620168B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005014250A1 (en) * | 2003-08-08 | 2005-02-17 | Ripetech Pty Limited | Method for reducing precure during the curing of thermosetting resins |
| CN104760094A (en) * | 2015-03-23 | 2015-07-08 | 南京林业大学 | Functional wood-based composite material and manufacture method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2620168B2 (en) | 1997-06-11 |
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