JPH0752112A - Manufacture of wooden plate - Google Patents

Manufacture of wooden plate

Info

Publication number
JPH0752112A
JPH0752112A JP22796093A JP22796093A JPH0752112A JP H0752112 A JPH0752112 A JP H0752112A JP 22796093 A JP22796093 A JP 22796093A JP 22796093 A JP22796093 A JP 22796093A JP H0752112 A JPH0752112 A JP H0752112A
Authority
JP
Japan
Prior art keywords
chips
wooden chips
wooden
resin
wood chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22796093A
Other languages
Japanese (ja)
Other versions
JP3120167B2 (en
Inventor
Koji Ishimoto
康治 石本
Eiji Ito
英二 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dantani Plywood Co Ltd
Original Assignee
Dantani Plywood Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dantani Plywood Co Ltd filed Critical Dantani Plywood Co Ltd
Priority to JP05227960A priority Critical patent/JP3120167B2/en
Publication of JPH0752112A publication Critical patent/JPH0752112A/en
Application granted granted Critical
Publication of JP3120167B2 publication Critical patent/JP3120167B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the invasion of moisture into wooden chips by a method wherein the whole surfaces of wooden chips are plasticated so as to have bonding property and the wooden chips are bonded mutually and strongly while the wooden chips are coated by resin films. CONSTITUTION:Mixed solution of phenol and sulfuric acid is poured onto wooden chips 1 to plasticize the wooden chips thermally. Next, the water solution of sodium hydroxide is poured and mixed under heating in order to provide the heat-plasticized wooden chips 1 with alkalified nature. Then, the chips are heated utilizing thermal inertia whereby the surfaces of the wooden chips 1 are alkalified. Next, formaldehyde solution is added to the alkalified wooden chips to make resol resin on the surfaces of the wooden chips 1. Then, the wooden chips 1, whose surfaces are changed into resol resin, are foamed by a foaming machine, then, hot pressing is effected by a hot press to obtain an objective plate type body. Accordingly, the whole surfaces of the wooden chips are changed into adhesive agent whereby the wooden chips are bonded mutually and strongly while the wooden chips 1 are coated by resin whereby moisture can not invade easily into the chips.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、木質板の寸法安定性
や表面の平滑性を向上させる技術に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for improving dimensional stability and surface smoothness of a wooden board.

【0002】[0002]

【従来の技術】パーティクルボードなどの木質板は、木
材をチップ化、または木粉に近い状態まで機械的に破砕
した後、ユリア・ホルムアルデヒドやメラミン・ホルム
アルデヒド等の接着剤をスプレー噴霧してフォーミング
し、ホットプレスで熱圧成型する方法で製造されてい
た。
2. Description of the Related Art A wood board such as particle board is formed by chipping wood or mechanically crushing it to a state close to wood powder and then spraying an adhesive such as urea formaldehyde or melamine formaldehyde. It was manufactured by hot pressing with a hot press.

【0003】[0003]

【発明が解決すべき課題】しかし、このような方法では
木材チップの表面に接着剤をスプレー、または散布する
為、図2に示すように接着剤の付着が部分的で不均一に
なり、木材チップ同志の接着が弱くなるとともに接着剤
で被覆されていない木材チップ内や木材チップ間の隙間
に水分が容易に入り込むようになり、木質板は著しい寸
法変化を伴っていた。また、木材チップに対する接着剤
の塗布が不均一になることにより、熱圧締成型した後、
木質板の表面が平滑になっていない為、サンディングす
る必要があり、材料の歩留りも低下させていた。
However, in such a method, since the adhesive is sprayed or sprayed on the surface of the wood chips, the adhesion of the adhesive becomes partial and non-uniform as shown in FIG. As the adhesion between the chips weakened, moisture easily entered into the wood chips not covered with the adhesive and into the gaps between the wood chips, and the wood board was accompanied by a significant dimensional change. Also, due to the uneven application of the adhesive to the wood chips, after hot pressing molding,
Since the surface of the wooden board was not smooth, it was necessary to sand it, and the yield of the material was also reduced.

【0004】[0004]

【課題を解決するための手段】そこで、この発明は上記
の問題点を解決する為、木材チップに、フェノールと
硫酸の混合液を添加、撹拌して加熱する工程、ついで
水酸化ナトリウム水溶液を添加、撹拌して加熱する工
程、ついでホルムアルデヒド水溶液を添加、撹拌して
加熱する工程、ついでフォーミングしてホットプレス
で成型する工程、を順に行う方法を採用した。
In order to solve the above problems, the present invention is directed to a step of adding a mixed solution of phenol and sulfuric acid to wood chips, stirring and heating, and then adding an aqueous sodium hydroxide solution. A method of sequentially performing a step of stirring and heating, a step of adding an aqueous formaldehyde solution, stirring and heating, and a step of forming and molding with a hot press were adopted.

【0005】以下、上記の手段を詳しく説明する。The above means will be described in detail below.

【0006】まず、木材チップを得る。木材チップとし
ては、一般に製材工場や合板工場から出る広葉樹や針葉
樹の廃材が主として用いられる。大きさとしては、破砕
機で厚さ0.1〜0.5mm、長さ10〜20mm前
後、幅1.0〜3.0mm程度のチップ状に形成され
る。得られた木材チップは容器に入れて、後述するフェ
ノールと硫酸の混合液が木材チップの表面に均一に付着
するように含水率を30〜40%程度に調整しておく。
First, wood chips are obtained. As the wood chips, generally used waste materials of hardwoods and conifers from lumber factories and plywood factories are mainly used. As a size, it is formed into a chip shape with a thickness of 0.1 to 0.5 mm, a length of about 10 to 20 mm and a width of about 1.0 to 3.0 mm by a crusher. The obtained wood chips are placed in a container, and the water content thereof is adjusted to about 30 to 40% so that a mixed solution of phenol and sulfuric acid described later is uniformly attached to the surface of the wood chips.

【0007】つぎに、木材チップにフェノールと硫酸の
混合液を添加して木材チップを熱可塑性化する。フェノ
ールと硫酸の混合比は1:0.03〜0.10(重量
比)、フェノールと硫酸の混合液の添加比率は、木材チ
ップ10に対し0.5〜1.5(重量比)で、添加した
後、撹拌して加熱する。加熱温度は90〜100℃で時
間は30分前後である。
Next, a mixed liquid of phenol and sulfuric acid is added to the wood chips to make the wood chips thermoplastic. The mixing ratio of phenol and sulfuric acid is 1: 0.03 to 0.10 (weight ratio), and the addition ratio of the mixing liquid of phenol and sulfuric acid is 0.5 to 1.5 (weight ratio) with respect to the wood chips 10. After addition, stir and heat. The heating temperature is 90 to 100 ° C. and the time is about 30 minutes.

【0008】つぎに、熱可塑性化(酸性)された木材チ
ップをアルカリ性にする為、水酸化ナトリウム水溶液を
添加して撹拌し加熱する。水酸化ナトリウム水溶液の添
加比率は木材チップ10に対し0.5〜1.5(重量
比)である。そして、前記工程による余熱(80〜9
0℃)を利用して30分程度加熱する。これにより木材
チップの表面がアルカリ性となる。
Next, in order to make the thermoplastic (acidic) wood chips alkaline, an aqueous sodium hydroxide solution is added and stirred and heated. The addition ratio of the sodium hydroxide aqueous solution is 0.5 to 1.5 (weight ratio) with respect to the wood chips 10. Then, the residual heat (80-9
It heats for about 30 minutes using (0 degreeC). This makes the surface of the wood chips alkaline.

【0009】つぎに、アルカリ性とした木片にホルムア
ルデヒド水溶液を添加して木材チップの表面をレゾール
樹脂化(接着剤化)する。37%のホルムアルデヒド水
溶液の添加比率は、木材チップ10に対し1.0〜1.
5(重量比)である。加熱温度は80〜90℃で時間は
30分程度である。これにより木材チップの表面が熱硬
化性レゾール樹脂化される。
Next, an aqueous formaldehyde solution is added to the wood pieces made alkaline to convert the surface of the wood chips into a resole resin (adhesive). The addition ratio of the 37% formaldehyde aqueous solution was 1.0 to 1.
5 (weight ratio). The heating temperature is 80 to 90 ° C. and the time is about 30 minutes. As a result, the surface of the wood chips is made into a thermosetting resol resin.

【0010】なお、上記工程中の撹拌作業はスク
リューフィーダー等で連続的に行うと、処理効率が向上
して好ましい。
It is preferable that the stirring operation in the above steps is continuously carried out by a screw feeder or the like because the processing efficiency is improved.

【0011】そして、上記工程でレゾール樹脂化され
た木材チップをフォーミングマシンでフォーミングし、
ホットプレスで熱圧締成型して目的とする板状体にす
る。ホットプレスの条件は温度150〜170℃、圧力
20〜30kg/cm2 、時間10〜15分程度であ
る。
Then, the wood chips, which have been made into a resole resin in the above process, are formed by a forming machine,
Hot press molding is performed with a hot press to obtain the desired plate-shaped body. The hot press conditions are a temperature of 150 to 170 ° C., a pressure of 20 to 30 kg / cm 2 , and a time of 10 to 15 minutes.

【0012】[0012]

【作用】この発明において、前記の方法を採用するの
は、図1に示すように木材チップの全表面を樹脂化して
接着性を持たせ、木材チップ同志を強固に接着させると
ともに樹脂被膜で被覆し、木材チップ中への水の侵入を
防止する為である。
In the present invention, the above-mentioned method is adopted in order to make the entire surface of the wood chips resinous so as to have an adhesive property as shown in FIG. However, this is to prevent water from entering the wood chips.

【0013】以下、この発明の実施例を示す。Examples of the present invention will be shown below.

【0014】[0014]

【実施例】含水率40%に調整された木材チップ中に混
合比1:0.03のフェノールと硫酸の混合液を添加
し、撹拌して90℃に加熱した。つづいて水酸化ナトリ
ウム水溶液を木材チップ10に対し1の割合で添加し、
撹拌して前記工程の余熱を利用して80℃に加熱した。
つづいて37%ホルムアルデヒド水溶液を木材チップ1
0に対し1の割合で添加し、撹拌して80℃に加熱し
た。つづいて木材チップをフォーミングして160℃、
20kg/cm2 、10分の条件でホットプレスで熱圧
締した。以上の方法により、木材チップに対する樹脂率
15%、20%(それぞれ厚さ9mm)の木質板をそれ
ぞれ製造した。
EXAMPLE A mixed solution of phenol and sulfuric acid having a mixing ratio of 1: 0.03 was added to wood chips adjusted to have a water content of 40%, stirred and heated to 90 ° C. Subsequently, an aqueous sodium hydroxide solution was added at a ratio of 1 to 10 wood chips,
The mixture was stirred and heated to 80 ° C. using the residual heat of the above process.
Next, add 37% formaldehyde solution to wood chips 1
It was added at a ratio of 1 to 0, stirred and heated to 80 ° C. Next, forming wood chips at 160 ℃,
Hot pressing was performed with a hot press under the conditions of 20 kg / cm 2 and 10 minutes. By the above method, wood boards having resin rates of 15% and 20% (each having a thickness of 9 mm) with respect to wood chips were manufactured.

【0015】比較例として、従来の方法で製造された厚
さ12mmのメラミン樹脂タイプ3層パーティクルボー
ド(Mタイプ)、厚さ9mmのフェノール樹脂タイプ単
層パーティクルボード(Pタイプ)の2種類を用意して
以下のような比較試験を行った。
As comparative examples, two types of 12 mm thick melamine resin type three-layer particle board (M type) and 9 mm thick phenol resin type single layer particle board (P type) manufactured by the conventional method are prepared. Then, the following comparative test was performed.

【0016】[0016]

【表1】 [Table 1]

【0017】なお、寸法変化率の算定は、まず60℃で
24時間乾燥した木質板の寸法Loを測定した後、その
木質板を40℃、湿度90%の状況下で6日間放置して
寸法Lg を測定し、(Lg −Lo )/Lo ×100の算
定式で求めた。
The dimensional change rate was calculated by first measuring the dimension L o of a wood board dried at 60 ° C. for 24 hours and then leaving the wood board at 40 ° C. and a humidity of 90% for 6 days. The dimension L g was measured and determined by the formula of (L g −L o ) / L o × 100.

【0018】上記結果から、この発明により製造された
木質板(特に樹脂率20%タイプ)は寸法変化が少な
く、曲げ強度も厚さ12mmの3層パーティクルボード
に匹敵する性能を有することがわかる。
From the above results, it can be seen that the wood board manufactured according to the present invention (especially 20% resin rate type) has a small dimensional change and a bending strength comparable to that of a three-layer particle board having a thickness of 12 mm.

【0019】[0019]

【発明の効果】この発明によれば、木材チップの全表面
が接着剤化され、木材チップ同志が強固に接着されると
ともに木材チップは樹脂で被覆され、水分が容易に入り
込まないようになる為、水分に対する寸法安定性がきわ
めて優れた木質板が得られる。また、木材チップの表面
が完全に樹脂で被覆される為、従来の3層や多層パーテ
ィクルボードを製造する為に用いる芯層用チップを用い
ているにもかかわらず、熱圧締成型した後、木質板の表
面はプラスチック板状に平滑に仕上がり、サンディング
する必要がなく材料の歩留りも向上する。
According to the present invention, the entire surface of the wood chips is made into an adhesive agent, the wood chips are firmly adhered to each other, and the wood chips are covered with the resin so that water cannot easily enter. A wood board with excellent dimensional stability against moisture can be obtained. In addition, since the surface of the wood chips is completely covered with resin, even though the chips for the core layer used for manufacturing the conventional three-layer or multilayer particle board are used, The surface of the wood board is finished in a smooth shape like a plastic board, and it is not necessary to sand, and the material yield is improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】従来の木材チップ表面の接着剤の付着状態を示
す図。
FIG. 1 is a view showing a state of adhesion of an adhesive on the surface of a conventional wood chip.

【図2】この発明の木材チップ表面の接着剤の付着状態
を示す図。
FIG. 2 is a diagram showing a state of adhesion of an adhesive agent on the surface of the wood chip of the present invention.

【符号の説明】[Explanation of symbols]

1 木材チップ 2 接着剤 1 Wood chip 2 Adhesive

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 木材チップに、フェノールと硫酸の混
合液を添加、撹拌して加熱する工程、ついで水酸化ナ
トリウム水溶液を添加、撹拌して加熱する工程、ついで
ホルムアルデヒド水溶液を添加、撹拌して加熱する工
程、ついでフォーミングしてホットプレスで成型する
工程、を順に行うことを特徴とする木質板の製造方法。
1. A step of adding a mixed solution of phenol and sulfuric acid to wood chips, stirring and heating, then adding an aqueous sodium hydroxide solution, stirring and heating, and then adding an aqueous formaldehyde solution, stirring and heating A method of manufacturing a wood board, which comprises sequentially performing the step of forming, and then forming and hot-pressing.
JP05227960A 1993-08-20 1993-08-20 Wood board manufacturing method Expired - Fee Related JP3120167B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05227960A JP3120167B2 (en) 1993-08-20 1993-08-20 Wood board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05227960A JP3120167B2 (en) 1993-08-20 1993-08-20 Wood board manufacturing method

Publications (2)

Publication Number Publication Date
JPH0752112A true JPH0752112A (en) 1995-02-28
JP3120167B2 JP3120167B2 (en) 2000-12-25

Family

ID=16868959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05227960A Expired - Fee Related JP3120167B2 (en) 1993-08-20 1993-08-20 Wood board manufacturing method

Country Status (1)

Country Link
JP (1) JP3120167B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1852231A3 (en) * 2006-05-02 2007-12-05 Kronotec Ag Method for manufacturing wooden materials with reduced emission of volatile organic compounds, wooden materials manufactured thus and the use of certain additives to inhibit the release of volatile organic compounds from wooden materials and wood chipping products made of ligno-cellulose

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5350598B2 (en) 2007-03-28 2013-11-27 東京エレクトロン株式会社 Exhaust pump, communication pipe, exhaust system, and substrate processing apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1852231A3 (en) * 2006-05-02 2007-12-05 Kronotec Ag Method for manufacturing wooden materials with reduced emission of volatile organic compounds, wooden materials manufactured thus and the use of certain additives to inhibit the release of volatile organic compounds from wooden materials and wood chipping products made of ligno-cellulose
EP1852231B2 (en) 2006-05-02 2017-05-03 SWISS KRONO Tec AG Use of certain additives to inhibit the release of volatile organic compounds from wooden materials and wood chipping products made of ligno-cellulose

Also Published As

Publication number Publication date
JP3120167B2 (en) 2000-12-25

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