JP2620168B2 - Wood board manufacturing method - Google Patents
Wood board manufacturing methodInfo
- Publication number
- JP2620168B2 JP2620168B2 JP21450991A JP21450991A JP2620168B2 JP 2620168 B2 JP2620168 B2 JP 2620168B2 JP 21450991 A JP21450991 A JP 21450991A JP 21450991 A JP21450991 A JP 21450991A JP 2620168 B2 JP2620168 B2 JP 2620168B2
- Authority
- JP
- Japan
- Prior art keywords
- wood
- board
- adhesive
- applying
- aqueous solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】この発明はプレキュア層の少ない
木質板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a wooden board having a small number of precured layers.
【０００２】[0002]
【従来技術】多段プレスを用いて木質板を製造する際、
プレス圧締時に規定厚みにまで木質板を圧締するのに数
十秒の時間を要する。その間木質板の表層部は熱盤と接
触しているため規定の圧力がかかるまでの間に接着剤が
プレキュアしてしまい、木質板の表層部の最外層は接着
不良となる。従って製品にするには表層部を削り取る必
要があるので、木質板製造用素材や接着剤のロスが大き
い。2. Description of the Related Art When manufacturing a wooden board using a multi-stage press,
It takes several tens of seconds to press the wooden board to the specified thickness during press pressing. During this time, the surface layer of the wooden board is in contact with the hot platen, so that the adhesive is pre-cured until a prescribed pressure is applied, and the outermost layer of the surface layer of the wooden board has poor adhesion. Therefore, since it is necessary to scrape off the surface layer in order to produce a product, there is a large loss of the wood board production material and the adhesive.
【０００３】そのため、木質板のプレキュアを防止する
ため、表層用接着剤にアンモニア水やヘキサメチレンテ
トラミン等のアルカリ物質を添加する方法、特公昭５８
−４５９４６号に見られるように尿素樹脂にアルカリレ
ゾールを添加する方法、硬化剤なしで尿素樹脂系接着剤
を使用して木質板を製造する方法を試みたが、これらの
方法ではプレキュア層を完全になくすことは難しく、少
なくとも０．５〜０．６ｍｍのプレキュア層が発生し
た。なお、硬化剤なしでも尿素樹脂系接着剤が硬化する
のは、熱圧時に木材チップから何らかの酸性物質が遊離
し、これが尿素樹脂系接着剤の硬化剤として働くためと
思われる。[0003] Therefore, in order to prevent pre-curing of a wooden board, a method of adding an alkaline substance such as aqueous ammonia or hexamethylenetetramine to a surface layer adhesive is disclosed in
No. 45946, a method of adding an alkali resol to a urea resin and a method of manufacturing a wooden board using a urea resin-based adhesive without a curing agent have been tried. It was difficult to eliminate the precured layer, and a precured layer of at least 0.5 to 0.6 mm was generated. The reason that the urea resin-based adhesive cures even without a curing agent is presumably because some acidic substance is released from the wood chip when heated and pressurized, and this acts as a curing agent for the urea resin-based adhesive.
【０００４】[0004]
【発明が解決しようとする課題】この発明は上述した欠
点を解消し、プレキュア層の少ない木質板を提供するも
のである。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks and to provide a wooden board having a small number of precured layers.
【０００５】[0005]
【課題を解決するための手段】この発明は、木材チッ
プ、木材繊維等の木質板製造用素材に、予めアルカリ水
溶液を塗布した後、アミノ系接着剤を塗布してフォーミ
ングし、その後熱圧成型することを特徴とする木質板の
製造方法、および、木材チップ、木材繊維等の木質板製
造用素材に、予めアルカリ水溶液を塗布した後、アミノ
系接着剤を塗布したものを表層用とし、内層用にはアル
カリ水溶液を塗布せずに直接接着剤を塗布したものを用
いてフォーミングし、その後熱圧成型することを特徴と
する木質板の製造方法に係る。SUMMARY OF THE INVENTION According to the present invention, a material for producing a wood board such as wood chips and wood fibers is applied in advance with an aqueous alkali solution, then an amino-based adhesive is applied and forming is performed, followed by hot pressing. A method for manufacturing a wooden board, characterized in that, after applying an aqueous alkaline solution to a wood board manufacturing material such as wood chips and wood fibers, and then applying an amino-based adhesive for the surface layer, the inner layer The present invention relates to a method for producing a wooden board, wherein forming is performed using an adhesive directly applied without applying an alkaline aqueous solution, followed by hot pressing.
【０００６】この発明において、木質板とは、パーティ
クルボード、ハードボード、ＭＤＦ（中比重繊維板）等
を指す。In the present invention, the wood board refers to a particle board, a hard board, an MDF (medium specific gravity fiber board) or the like.
【０００７】以下、この発明の木質板の製造方法につい
て詳述する。木材チップ、木材繊維等の木質板製造用素
材に、まずアルカリ水溶液を塗布する。アルカリ水溶液
としては、希苛性ソーダー水・アンモニア水・ヘキサミ
ン水・レゾール型フェノール樹脂の希薄水溶液等アルカ
リ性を呈する水溶液であれば何でもよい。塗布量は木質
板製造用素材の含水率が高くなり過ぎて後で塗布する接
着剤が接着不良を起こすことがないような範囲で決定さ
れる。なお、アルカリ水溶液の浸透性を向上させるため
に一般に知られている界面活性剤を少量添加してもよ
い。Hereinafter, a method for producing a wooden board of the present invention will be described in detail. First, an alkaline aqueous solution is applied to a material for manufacturing a wood board such as wood chips and wood fibers. The alkaline aqueous solution may be any aqueous solution exhibiting alkalinity, such as diluted caustic soda water, ammonia water, hexamine water, and a dilute aqueous solution of a resol-type phenol resin. The amount to be applied is determined in such a range that the moisture content of the material for producing a wooden board does not become too high and the adhesive to be applied later does not cause poor adhesion. A small amount of a generally known surfactant may be added to improve the permeability of the aqueous alkali solution.
【０００８】木材チップ、木材繊維等の木質板製造用素
材にアルカリ水溶液を塗布するとなぜプレキュア層の少
ない木質板が得られるのかはっきりとした理由はわから
ないが、熱圧時に木材チップから遊離する酸性物質を上
記アルカリ水溶液が中和することによって表層部の硬化
時間を遅らせているからではないかと思われる。Although it is not clear why an alkaline aqueous solution is applied to a material for producing a wood board such as wood chips and wood fibers to obtain a wood board having a small pre-cured layer, it is not clear why acidic substances released from the wood chip when heated and pressed. This is probably because the alkali aqueous solution neutralizes the acid to delay the curing time of the surface layer.
【０００９】次に、このアルカリ水溶液を塗布した木材
チップ、木材繊維等の木質板製造用素材にアミノ系接着
剤を塗布する。アミノ系接着剤とは、尿素樹脂接着剤、
メラミン樹脂接着剤、メラミン変性尿素樹脂接着剤、グ
アナミン変性尿素樹脂接着剤、メラミン変性フェノール
樹脂接着剤等を指す。アミノ系接着剤の塗布量は、乾燥
した木材チップに対し樹脂固形分換算で５〜１３％位が
一般的であるが、これに限定されるものではない。Next, an amino-based adhesive is applied to a wood chip, wood fiber, or other material for producing a wood board to which the alkaline aqueous solution has been applied. Amino adhesives are urea resin adhesives,
It refers to a melamine resin adhesive, a melamine-modified urea resin adhesive, a guanamine-modified urea resin adhesive, a melamine-modified phenol resin adhesive, and the like. The amount of the amino-based adhesive applied is generally about 5 to 13% in terms of resin solid content with respect to the dried wood chips, but is not limited thereto.
【００１０】厚みの薄い木質板であれば、アルカリ水溶
液を塗布した木材チップ、木材繊維等の木質板製造用素
材にアミノ系接着剤を塗布したもののみで木質板を製造
してもよいが、厚みのある木質板であれば、アルカリ水
溶液を塗布した木材チップ、木材繊維等の木質板製造用
素材は表層用として用い、内層にはアルカリ水溶液を塗
布せずに直接アミノ系接着剤を塗布したものを用いる。In the case of a thin wooden board, the wooden board may be manufactured only by applying an amino-based adhesive to a material for manufacturing a wooden board, such as a wood chip or a wood fiber, to which an alkaline aqueous solution has been applied. In the case of a thick wooden board, a material for manufacturing a wood board such as a wood chip and a wood fiber coated with an aqueous alkali solution was used as a surface layer, and an amino-based adhesive was directly applied to the inner layer without applying the aqueous alkali solution. Use something.
【００１１】[0011]
【実施例１】表層用木材チップに、１％アルカリレゾ−
ル水溶液を８重量％（乾燥した木材チップに対し）添加
した後、尿素樹脂接着剤を樹脂固形分換算で９．５重量
％（乾燥した木材チップに対し）塗布した。内層用木材
チップには尿素樹脂接着剤を樹脂固形分換算で６重量％
（乾燥した木材チップに対し）塗布した。これ等の木材
チップをフォーミングした後、プレス温度１６０℃，プ
レス圧力２５ｋｇ／ｃｍ2 で４分間熱圧して、比重０．
６４、厚さ１５ｍｍのパ−ティクルボ−ドを製造した。Example 1 1% alkaline resin was used for surface wood chips.
After adding an aqueous solution of 8% by weight (based on dried wood chips), a urea resin adhesive was applied at 9.5% by weight (based on dried wood chips) in terms of resin solid content. For wood chips for inner layer, urea resin adhesive is 6% by weight in terms of resin solid content.
(On dry wood chips). After these wood chips are formed, they are hot-pressed at a pressing temperature of 160 ° C. and a pressing pressure of 25 kg / cm 2 for 4 minutes to obtain a specific gravity of 0.1.
A particle board having a thickness of 64 mm and a thickness of 15 mm was manufactured.
【００１２】[0012]
【実施例２】表層用木材チップに、１％ヘキサミン水溶
液を９重量％（乾燥した木材チップに対し）添加した
後、尿素樹脂接着剤を樹脂固形分換算で１０重量％（乾
燥した木材チップに対し）塗布した。内層用木材チップ
には尿素樹脂接着剤を樹脂固形分換算で６重量％（乾燥
した木材チップに対し）塗布した。これ等の木材チップ
をフォーミングした後、プレス温度１６０℃，プレス圧
力２５ｋｇ／ｃｍ2 で４分間熱圧して、比重０．６４、
厚さ１５ｍｍのパ−ティクルボ−ドを製造した。Example 2 After adding 9% by weight of a 1% aqueous solution of hexamine (based on dried wood chips) to a surface wood chip, a urea resin adhesive was added at 10% by weight in terms of resin solids (to dried wood chips). On the other hand) was applied. The inner layer wood chip was coated with a urea resin adhesive at a resin solid content of 6% by weight (based on the dried wood chip). After these wood chips are formed, they are hot-pressed at a press temperature of 160 ° C. and a press pressure of 25 kg / cm 2 for 4 minutes to obtain a specific gravity of 0.64.
A particle board having a thickness of 15 mm was manufactured.
【００１３】[0013]
【比較例】１％のアルカリレゾ−ル水の代わりに水を使
用すること以外は実施例１と同様にして比重０．６４、
厚さ１５ｍｍのパ−ティクルボ−ドを製造した。Comparative Example A specific gravity of 0.64 was obtained in the same manner as in Example 1 except that water was used instead of 1% alkaline resorl water.
A particle board having a thickness of 15 mm was manufactured.
【００１４】[0014]
【表１】 [Table 1]
【００１５】[0015]
【実施例３】木材チップに、１％アルカリレゾ−ル水溶
液を８重量％（乾燥した木材チップに対し）添加した
後、尿素樹脂接着剤を樹脂固形分換算で９．５重量％
（乾燥した木材チップに対し）塗布した。この木材チッ
プをフォーミングした後、プレス温度１６０℃，プレス
圧力２５ｋｇ／ｃｍ2 で４分間熱圧して、比重０．６
４、厚さ５ｍｍのパ−ティクルボ−ドを製造した。Example 3 After adding 8% by weight (based on dried wood chips) of a 1% aqueous alkaline solution to wood chips, the urea resin adhesive was added to 9.5% by weight in terms of resin solids.
(On dry wood chips). After forming the wood chip, the wood chip was heated and pressed at a pressing temperature of 160 ° C. and a pressing pressure of 25 kg / cm 2 for 4 minutes to obtain a specific gravity of 0.6.
4. A particle board having a thickness of 5 mm was manufactured.
【００１６】[0016]
【実施例４】木材繊維に、１％ヘキサミン水溶液を７重
量％（乾燥した木材繊維に対し）添加した後、尿素樹脂
接着剤を樹脂固形分換算で１０重量％（乾燥した木材繊
維に対し）塗布した。この木材繊維をフォーミングした
後、プレス温度１６０℃，プレス圧力１０ｋｇ／ｃｍ2
で４分間熱圧して、比重０．５５、厚さ３ｍｍのＭＤＦ
を製造した。Example 4 After adding 7% by weight (based on dried wood fiber) of a 1% aqueous solution of hexamine to wood fiber, a urea resin adhesive was added at 10% by weight (based on dried wood fiber) in terms of resin solid content. Applied. After forming the wood fiber, the pressing temperature is 160 ° C. and the pressing pressure is 10 kg / cm 2.
MDF with specific gravity of 0.55 and thickness of 3mm
Was manufactured.
【００１７】[0017]
【発明の効果】この発明は上述したように構成されてい
るので、プレキュア層の少ない木質板を製造することが
できる。Since the present invention is configured as described above, it is possible to manufacture a wooden board having a small number of precure layers.
Claims (2)
素材に、予めアルカリ水溶液を塗布した後、アミノ系接
着剤を塗布してフォーミングし、その後熱圧成型するこ
とを特徴とする木質板の製造方法。1. A wood board characterized by applying an alkaline aqueous solution to a material for manufacturing wood board such as wood chips and wood fibers in advance, applying an amino-based adhesive and then forming by hot pressing. Manufacturing method.
素材に、予めアルカリ水溶液を塗布した後、アミノ系接
着剤を塗布したものを表層用とし、内層用にはアルカリ
水溶液を塗布せずに直接接着剤を塗布したものを用いて
フォーミングし、その後熱圧成型することを特徴とする
木質板の製造方法。2. A material obtained by applying an alkaline aqueous solution to a material for producing a wood board such as wood chips and wood fibers in advance, and then applying an amino-based adhesive to the surface layer, and applying no aqueous alkaline solution to the inner layer. A method for producing a wooden board, comprising forming a sheet using an adhesive directly applied thereto, followed by hot pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21450991A JP2620168B2 (en) | 1991-07-30 | 1991-07-30 | Wood board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21450991A JP2620168B2 (en) | 1991-07-30 | 1991-07-30 | Wood board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0531707A JPH0531707A (en) | 1993-02-09 |
| JP2620168B2 true JP2620168B2 (en) | 1997-06-11 |
Family
ID=16656900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21450991A Expired - Fee Related JP2620168B2 (en) | 1991-07-30 | 1991-07-30 | Wood board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2620168B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003904225A0 (en) * | 2003-08-08 | 2003-08-21 | Ripetech Pty Limited | Method for reducing precure during the curing of thermosetting resins |
| CN104760094B (en) * | 2015-03-23 | 2016-08-24 | 南京林业大学 | Functional wood-based composites and manufacture method thereof |
-
1991
- 1991-07-30 JP JP21450991A patent/JP2620168B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0531707A (en) | 1993-02-09 |
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