JPH0531671Y2 - - Google Patents

Description

[Detailed description of the invention] (Field of industrial application) This invention is used by pasting it on a part of the surface of a certificate, securities, etc., and if you try to peel it off, the label will break from the adhesive layer. Change the information on the pasted part of the certificate or security, or remove it and attach it to another certificate.
This invention relates to hologram labels that cannot be reattached to securities, etc.

(Prior technology) Holography is a technology that records both the amplitude and phase of light waves in a certain plane, and holograms created using this technology are similar to ordinary photographs (capturing images only from a single point). It is possible to reproduce stereoscopic images viewed from different angles. Furthermore, since holograms require advanced manufacturing technology and manufacturing equipment is complex and expensive, it is generally difficult to counterfeit or alter holograms. Taking advantage of this difficulty, certificates, Attempts are being made to use it as a means to prevent counterfeiting of securities, etc.

(Problem that the invention aims to solve) However, even if a hologram is simply pasted on an adherend, it can be peeled off and replaced with another adherend, or the written information on the peeled part of the adherend surface can be changed. It is not impossible to paste the hologram again, but the difficulty of forging or altering the hologram itself makes it impossible to take advantage of it.

The present invention has been developed in view of the above points, and it has become clear that the above drawbacks can be overcome by forming a hologram label by laminating a brittle adhesive layer on a hologram. It was devised by

(Means for Solving the Problems) The hologram label of the present invention is a hologram label in which a hologram forming layer, a reflective metal thin film layer, and an adhesive layer are sequentially laminated, in which the adhesive layer has adhesive properties. The adhesive layer is characterized by being a brittle adhesive layer consisting of a synthetic resin containing a synthetic resin and an inorganic fine powder that makes the synthetic resin brittle.

The present invention will be explained below based on the drawings.

FIG. 1 is a cross-sectional view showing the basic structure of the hologram label 1 of the present invention, in which from the top side a hologram forming layer 2, a reflective metal thin film layer 3, a brittle adhesive layer 4
are sequentially stacked, and this hologram label 1
The adhesive layer 4 is stacked so as to be in contact with the surface of the adherend, and is attached to the adherend by applying pressure while heating as necessary.

The hologram forming layer 2 can be made of various materials, and materials such as known photographic materials typified by silver salts, photosensitive resins, and thermoplastics can be used. However, all of these materials require exposure and development, and even if this can be done simultaneously using a large number of original plates, they are not necessarily suitable for mass production.

Therefore, the hologram is first expressed in the form of unevenness using photosensitive resin, thermoplastic, etc. to create a relief hologram, and the resulting relief hologram is molded by plating or other methods into a mold or resin mold. By creating and using holograms, it becomes possible to reproduce large quantities of relief holograms using a molding method on synthetic resin. In this sense, it is more preferable that the hologram forming layer 2 is made of a moldable synthetic resin.

Examples of moldable synthetic resins include the following. Thermoplastic resins such as polyvinyl chloride, acrylic (e.g. MMA), polystyrene, polycarbonate, unsaturated polyester, melamine, epoxy, polyester (meth)acrylate, urethane (meth)acrylate, epoxy (meth)acrylate, polyether (meth) ) acrylate, polyol (meth)acrylate,
Cured thermosetting resins such as melamine (meth)acrylate and triazine acrylate,
Alternatively, a mixture of the above thermoplastic resin and thermosetting resin can be used.

Furthermore, thermoformable materials having radically polymerizable unsaturated groups can be used as synthetic resins that can be shaped, and there are two types of these:

(1) Polymers with a glass transition point of 0 to 250°C that have radically polymerizable unsaturated groups. More specifically, the following compounds are used as polymers:
It is possible to use a product obtained by polymerizing or copolymerizing and introducing a radically polymerizable unsaturated group by methods (a) to (d) described below.

Monomers having hydroxyl groups: N-methylolacrylamide, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate,
2-hydroxypropyl methacrylate, 2
-Hydroxybutyl acrylate, 2-hydroxybutyl methacrylate, 2-hydroxy-3-phenoxypropyl methacrylate, 2-hydroxy-3-phenoxypropyl acrylate, etc.

Monomers with carboxyl groups: acrylic acid, methacrylic acid, acryloyloxyethyl monosuccinate, etc.

Monomers with epoxy groups: glycidyl methacrylate, etc.

Monomers having an aziridinyl group: 2-aziridinylethyl methacrylate, allyl 2-aziridinylpropionate, etc.

Monomers with amino groups: acrylamide, methacrylamide, diacetone acrylamide, dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate, etc.

Monomer having a sulfon group: 2-acrylamido-2-methylpropanesulfonic acid, etc.

Monomer having isocyanate group: 2,4
- Adducts of diisocyanates and radically polymerizable monomers having active hydrogen, such as 1 mol to 1 mol adducts of toluene diisocyanate and 2-hydroxyethyl acrylate.

Furthermore, in order to adjust the glass transition point of the above copolymer and the physical properties of the cured film, the above compound is copolymerized with the following monomers that can be copolymerized with this compound. You can also do it. Examples of such copolymerizable monomers include methyl methacrylate,
Methyl acrylate, ethyl acrylate,
Ethyl methacrylate, propyl acrylate, propyl methacrylate, butyl acrylate, butyl methacrylate, isobutyl acrylate, isobutyl methacrylate,
t-butyl acrylate, t-butyl methacrylate, isoamyl acrylate, isoamyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, 2
-ethylhexyl acrylate, 2-ethylhexyl methacrylate, and the like.

Next, the material according to the present invention is obtained by reacting the polymer obtained as described above by methods (a) to (d) described below to introduce a radically polymerizable unsaturated group. Can be done.

(a) In the case of a polymer or copolymer of a monomer having a hydroxyl group, a monomer having a carboxyl group such as acrylic acid or methacrylic acid is subjected to a condensation reaction.

(b) In the case of a polymer or copolymer of monomers having a carboxyl group or a sulfonate group, the aforementioned monomers having a hydroxyl group are subjected to a condensation reaction.

(c) In the case of a polymer or copolymer of a monomer having an epoxy group, an isocyanate group, or an aziridinyl group, the above-mentioned monomer having a hydroxyl group or monomer having a carboxyl group is subjected to an addition reaction.

(d) In the case of a polymer or copolymer of a monomer having a hydroxyl group or a carboxyl group, a monomer having an epoxy group or a monomer having an aziridinyl group or a diisocyanate compound and a hydroxyl group-containing acrylic ester monomer A 1:1 mole ratio of the adducts is subjected to an addition reaction.

In order to carry out the above reaction, it is preferable to add a trace amount of a polymerization inhibitor such as hydroquinone and carry out the reaction while blowing dry air.

(2) A compound having a melting point of 0 to 250°C and having a radically polymerizable unsaturated group. Specific examples include stearyl acrylate, stearyl methacrylate, triacryl isocyanurate, cyclohexanediol diacrylate, cyclohexanediol dimethacrylate, spiroglycol diacrylate, and spiroglycol dimethacrylate.

Furthermore, the above (1) and (2) can be used in combination as a moldable synthetic resin, and a radically polymerizable unsaturated monomer can also be added to them. This radically polymerizable unsaturated monomer improves crosslinking density and heat resistance when irradiated with ionizing radiation, and in addition to the above-mentioned monomers, ethylene glycol diacrylate, ethylene glycol dimethacrylate, Polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, hexanediol diacrylate, hexanediol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, trimethylolpropane diacrylate, trimethylolpropane dimethacrylate, pentaerythritol tetraacrylate, penta Erythritol tetramethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, ethylene glycol diglycidyl ether diacrylate, ethylene glycol diglycidyl ether dimethacrylate, polyethylene glycol diglycidyl ether diacrylate, Polyethylene glycol diglycidyl ether dimethacrylate, propylene glycol diglycidyl ether diacrylate, propylene glycol diglycidyl ether dimethacrylate, polypropylene glycol diglycidyl ether diacrylate, polypropylene glycol diglycidyl ether dimethacrylate, sorbitol tetraglycidyl ether tetraacrylate, sorbitol tetraglycidyl Ether tetramethacrylate etc. can be used, and 0.1 to 100 parts by weight of the solid content of the copolymer mixture described above can be used.
It is preferable to use 100 parts by weight. In addition, although the above materials can be sufficiently cured by electron beams,
In the case of curing by ultraviolet irradiation, sensitizers that generate radicals upon ultraviolet irradiation, such as benzoquinone, benzoin, benzoin ethers such as benzoin methyl ether, halogenated acetophenones, and biacetyls, can also be used.

A conventionally known method can be used to provide a relief hologram in the hologram forming layer 2 using the above-described moldable synthetic resin. The molds for forming relief holograms include: (1) The hologram's interference fringes are formed in the form of unevenness on the photoresist by exposure and development, and (2) The uneven side of (1) above is used. A mold in which the unevenness of (1) above is duplicated by silver plating or nickel plating on the (mold surface), and (3) the unevenness of the mold surface of the mold of (1) or (2) above. It is possible to use any resin mold made by duplicating the above using synthetic resin, and these molds can be made into a composite mold by duplicating them in large numbers using appropriate means and arranging them in an appropriate manner.
It is preferable that many relief holograms can be reproduced in one molding process. When making molds from synthetic resins, thermosetting or ionizing radiation-curable synthetic resins are used in the molds to improve the wear resistance of the molds, and to improve the heat resistance of the molds when hot pressing. Good to use as a material.

Note that the holograms provided in the hologram forming layer 2 in the form of unevenness include those based on principles such as Fresnel holograms, Fourier transform holograms, and Fraunhofer holograms, excluding Lipman holograms, and image holograms using these principles. , rainbow hologram, holographic stereogram, holographic diffraction grating, etc. are used.

This hologram forming layer needs to be easily broken together with the brittle adhesive layer when the label is peeled off, and its thickness is preferably about 0.4 to 4 μm.

The reflective metal thin film layer 3 imparts reflectivity to the hologram of the hologram forming layer 2, and is made of Cr,
Ti, Fe, Co, Ni, Cu, Ag, Au, Ge, Al,
Mg, Sb, Pb, Pd, Cd, Bi, Sn, Se, In, Ga,
It is formed using a metal such as Rb, its oxide, nitride, etc. alone or in combination of two or more. Among these metals, Al, Cr, Ni, Ag, Au
etc. are particularly preferred.

The reflective metal thin film layer 3 is formed by vapor deposition, sputtering,
It can be formed by methods such as ion plating, CVD, or plating, and its thickness is 200 to 1000 Å.
It is preferable that

Alternatively, even if a continuous thin film of a substance having a refractive index different from that of the hologram forming layer 2 is provided in addition to the above thin film of metal, metal oxide, or metal nitride alone or in combination, such a film itself Despite being transparent, it can be used as a reflective metal thin film layer.

Among these, those whose refractive index is larger than the hologram forming layer (hereinafter, refractive index: n is added in a box to the right of the material name) are Sb ₂ S ₃ (n = 3.0), Fe ₂
O ₃ (n=2.7), TiO ₂ (n=2.6), CbS (n=2.6),
CeO ₂ (n=2.3), ZnS (n=2.3), PbCl ₂ (n=
2.3), CdO (n=2.2), Sb ₂ O ₃ (n=2.0), WO ₃ (n
= 2.0), SiO (n = 2.0), Bi ₂ O ₃ (n = 2.5), In ₂ O ₃
(n=2.0), PbO (n=2.6), Ta ₂ O ₅ (n=2.4),
ZnO (n=2.1), ZrO ₂ (n=2.0), Cd ₂ O ₃ (n=
1.8), Al ₂ O ₃ (n=1.6), CaO・SiO ₂ (n=1.8),
Examples include.

The continuous thin film preferably has a refractive index greater than the refractive index of the hologram forming layer 2 by 0.3 or more, more preferably by 0.5 or more. According to experiments conducted by the inventors of the present invention, a value larger than 1.0 is optimal.

The thickness of the continuous thin film may be within the transparent region of the material forming the thin film, but is usually preferably 100 to 10,000 Å. As a method for forming a continuous thin film on the relief forming surface of the hologram forming layer, general thin film forming methods such as vacuum evaporation, sputtering, reactive sputtering, and ion plating can be employed.

When a continuous thin film with a high refractive index is provided in this way, due to the angular dependence of reproduction, which is a characteristic of holograms, it appears as a mere transparent body outside the angular range where the hologram can be reproduced; , the reflectance of light is maximum,
The effect as a reflection hologram appears.

The continuous thin film described above may have a refractive index smaller than that of the hologram forming layer, and LiF (n=
1.4), MgF ₂ (n=1.4), 3NaF・AlF ₃ (n=1.4 or 1.2), AlF ₃ (n=1.4), CaF ₂ (n=1.3 or 1.4), NaF (n=1.3), etc. be done.

Alternatively, a transparent ferroconductor with a higher refractive index than the hologram forming layer can be used as well, CuCl (n=
2.0), CuBr (n=2.2), _CaAs (n=3.3-3.6),
GaP (n=3.3-3.5), _N4 ( _CH2 ) ₆ (n=1.6), _Bi4
(GeO ₄ ) ₃ (n=2.1), KH ₂ PO ₄ (KDP) (n=1.5),
KD ₂ PO ₅ (n=1.5), NH ₄ H ₂ PO ₄ (n=1.5), KH ₂
A _S O ₄ (n=1.6), RbH ₂ A _S O ₄ (n=1.6), BaTiO ₃
(n=2.4), KTa _0.65 Nb _0.35 O ₃ (n=2.3), K _0.6 Li _0.4
NbO ₃ (n=2.3), KSR ₂ Nb ₅ O ₁₅ (n=2.3), _Sr
Ba _1-X Nb ₂ O ₆ (n=2.3), Ba ₂ NaNbO ₁₅ (n=2.3),
_LiNbO3 (n=2.3), _LiTaO3 (n=2.4), _SrTiO3
(n=2.4), KTaO ₃ (n=2.2), etc.

Furthermore, even if the reflective metal thin film layer mentioned above has a thickness of 200 Å or less, the refractive index will be the complex refractive index n ^* (n ^*
= n−iκ), and since the transmittance is quite low, it can be used as a reflective metal thin film layer even though it is transparent. Specifically, Be (n = 2.7, κ = 0.9, hereinafter written in the order of n and κ), Mg (0.6, 0.1), Ca (0.3,
8.1), Sr (0.6, 3.2), Ba (0.9, 1.7), La (1.8,
1.9), Ce (1.7, 1.4), Cr (3.3, 1.3), Mn (2.5,
1.3), Cu (0.7, 2.4), Ag (0.1, 3.3), Au (0.3,
2.4), Al (0.8, 5.3), Sb (3.0, 1.6), Pb (1.9,
), Ni (1.8, ), and others such as Su, In, and Te.

Further, a layer of transparent synthetic resin having a different refractive index from that of the hologram forming layer 2 may be substituted for the reflective metal thin film layer 3. Specific synthetic resins that can be used are as follows.

Polytetrafluoroethylene (refractive index; n=
1.35), polychlorotrifluoro (n=1.43), polyvinyl acetate (n=1.45-1.47), polyethylene (n
= 1.50-1.54), polypropylene (n = 1.49), polymethyl methacrylate (n = 1.49), polystyrene (n = 1.60), polyvinylidene chloride (n =
1.60-1.63), polyvinyl butyral (n=1.48),
Polyvinyl formal (n=1.50), polyvinyl chloride (n=1.52-1.55), polyester (n=1.52)
~1.57).

Note that the hologram is visible even when the hologram forming layer 2 is used alone without the reflective metal thin film layer 3, so the reflective metal thin film layer 3 can be omitted.

The hologram in the present invention has a hologram forming layer 2 having hologram irregularities on the lower surface as described above.
In principle, it has a reflective metal thin film layer 3 on the lower surface of the hologram forming layer, but the hologram forming layer has the unevenness of the hologram on the upper surface, and the hologram forming layer is in contact with the unevenness of the hologram, or is in contact with the unevenness of the hologram. It may also consist of a reflective metal thin film layer provided in contact with the side without the reflective metal layer.

In the present invention, a brittle adhesive layer 4 is provided below the hologram. The brittle adhesive layer 4 has the role of pasting the hologram onto the surface of the object to which it is adhered, but when trying to peel off the hologram from the object, the peeling between the brittle adhesive layers occurs. This is the trigger for the destruction of the hologram.

The brittle adhesive layer 4 is typically made of a composition in which a filler that makes the synthetic resin brittle is added to a synthetic resin having adhesive properties.

Various types of synthetic resins can be used as the synthetic resin constituting the brittle adhesive layer 4, and various types of adhesives can be used to form this layer, and the following adhesives are exemplified. Ru. phenolic resin,
Phenol resin, furan resin, urea resin,
Melamine resin, polyester resin, polyurethane resin, epoxy resin or other thermosetting resin, polyvinyl acetate resin, polyvinyl alcohol resin, polyvinyl chloride resin, polyvinyl butyral resin, poly(meth)acrylic resin,
One or two of nitrocellulose, polyamide or other thermoplastic resin, butadiene-acrylonitrile rubber, neoprene rubber or other rubber, or glue, natural resin, casein, sodium silicate, dextrin, starch, gum arabic, etc. Adhesives containing the above as main components can be used. Further, these adhesives may be of any type such as solution type, emulsion type, powder type, or film type, and may also be of any type such as room temperature solidification type, solvent volatilization type, melting and solidification type, etc.

Furthermore, in the present invention, materials constituting the adhesive layer include what is called an adhesive, such as acrylic resin, acrylic acid ester resin, or a copolymer thereof, styrene-butadiene copolymer, natural rubber, casein, Gelatin, rosin ester, terpene resin, phenolic resin, styrene resin, chromanindene resin, xylene, aliphatic hydrocarbon, polyvinyl alcohol, polyethylene oxide, polymethylene oxide, polyethylene sulfonic acid, etc. can be used, and they can be bonded by heating. It is also possible to use a heat-sensitive adhesive (in other words, a heat-sealing agent) to which properties are imparted. Materials constituting the heat-sensitive adhesive include polyethylene, polyvinyl acetate, or a copolymer thereof, acrylic resin or ethylene-acrylic acid copolymer, polyvinyl butyral, polyamide, polyester, plasticized chloroprene, polypropylene, polyvinyl alcohol, Examples include thermoplastic resins such as polycarbonate, polyvinyl ether, polyurethane, cellulose resins, waxes, paraffins, rosins, asphalts, and uncured thermosetting resins such as epoxy resins and phenolic resins.

The brittle adhesive layer 4 is preferably provided to have a thickness of about 20 to 50 μm.

The brittle adhesive layer further contains fillers such as charcoal, talc, china clay, kaolin, microsilica, TiO ₂ , glass flakes, asbestos,
Silica powder, silica powder (stone powder), barium sulfate,
By adding 80 to 200 parts by weight of an inorganic fine powder such as Sielben or Siamoto to 100 parts by weight of the synthetic resin, it becomes even more brittle, so that peeling between the layers becomes even more reliable.

Although the present invention has the basic configuration described above, the following modifications can be made as necessary.

Figure 2 shows a reflective metal thin film layer 3 and a brittle adhesive layer 4.
An anchor layer 5 is formed between the two. The anchor layer 5 firmly adheres the upper surface of the brittle layer 4 to the reflective metal thin film layer 3, and the brittle adhesive layer 4 adheres to the label 1.
Make sure that the reflective metal thin film layer 3 adheres to the reflective metal thin film layer 3 when it is peeled off from the adherend. Specific constituent materials for the anchor layer 5 include vinyl chloride, vinyl acetate, polyvinyl alcohol, copolymers thereof, urethane resins, epoxy resins, polyester resins, and other materials known as conventional anchor layers. can be widely used.

An adhesive layer can also be used in place of the anchor layer 5 in the same sense as the anchor layer 5, and the thickness of this adhesive layer is about 4 to 20 μm.

If the anchor layer or adhesive layer is provided, even if the label 1 is carefully peeled off from the adherend, the brittle adhesive layer 4 will always be attached to the reflective metal thin film layer 3.
The surface of the brittle adhesive layer 4 remaining on the reflective metal thin film layer 3 becomes brittle. Uneven adhesive strength of the adhesive layer exposes unevenness, which impedes reuse.

FIG. 3 shows an example in which the hologram forming layer 2 is a laminate of a support 6 and a hologram forming resin layer 7.

Since the relief hologram has very fine irregularities, the hologram forming layer itself can be composed of a very thin synthetic resin layer. However, it is generally difficult to handle extremely thin synthetic resin films, and even after processing, the extremely thin synthetic resin layer must be reinforced by some means before it reaches the user. Good.

One effective means here is to configure the hologram forming layer not as a single layer but as a laminate in which a hologram forming resin layer is laminated on a transparent support. For example, a synthetic resin may be coated on the transparent support 6, laminated by a laminating method such as melt coating, or lamination, and then a hologram may be formed.
Alternatively, by forming a hologram along with lamination, it becomes easy to form a relief hologram and the handling becomes easy, and the support 6 can serve as a protective layer for the hologram-forming resin layer 7 when used as a label.

The support 6 may be any material as long as it has the above-mentioned functions, but it is usually preferable to use a transparent plastic film, such as polyethylene, polypropylene, polyethylene terephthalate, polyvinyl chloride, or vinyl chloride. /vinyl acetate copolymer, polyvinylidene chloride,
Polymer films such as polymethyl methacrylate, polystyrene, polyvinyl butyral, polycarbonate, polyamide, cellulose resin, nylon, acrylic resin, fluororesin, etc. can also be used. In particular, polyethylene terephthalate film having high tensile strength and heat resistance is preferred.

The one shown in FIG. 4 is a modification of the one shown in FIG. 3, and has a peeling layer 8 between the support 6 and the hologram forming resin layer 7. After laminating, the support 6 is peeled off, and the effect of the hologram can be prevented from being slightly reduced by the support 6.

Here, the peeling layer 8 may be attached to either the layer 6 side or the layer 7 side during peeling, or may be peeled off between the layers 8. When attached to the layer 7 side, the peeling layer 8 can also be used as a protective layer for the hologram-forming resin layer. Note that if the support 6 originally has releasability, the release layer 8 can be omitted.

When using the support 6 by peeling it off, it is desirable that the peel strength between the support 6 and the lower layer be weaker than the interlayer strength of the brittle adhesive layer 4 or the peel strength with the adherend. This prevents the hologram from being peeled off when the support 6 is peeled off.

In addition, when the support body 6 is to be peeled off, it is effective to provide a protective layer in contact with the hologram-forming resin layer in any of the above cases.

Protective layers include mixtures of polymethyl methacrylate resin and other thermoplastics, such as vinyl chloride/vinyl acetate copolymers or nitrocellulose resins, or mixtures of polymethyl methacrylate resin and polyethylene wax, etc.
Desirable examples include mixtures of cellulose acetate resin and thermosetting resins such as epoxy resins, phenolic resins, thermosetting acrylic resins, or melamine resins.

In the present invention, the thickness of each layer is not particularly limited, but it is not preferable to use an excessively thick label when attached to the surface of the adherend. When the support is peeled off after the adhesion, the total thickness of each layer to remain on the adherend is 2 to 10 microns, preferably 2 to 6 microns.

(Function/Effects) Since the hologram label of the present invention has the configuration described above, it can be cut into the required size and shape before use, and can be used to prevent forgery or alteration, such as certificates or identification cards. It is attached to an adherend by applying pressure and heating if necessary.
After pasting, the support may be peeled off in some cases.

If you try to peel off a hologram label that has been attached to an adherend in this way, it may come off between the brittle adhesive layers, or the entire label may break from the brittle adhesive layer. Since the label is stored away, it is not possible to make the label and peel it off. Therefore, in order to correct the printed/written content, stamp photograph, etc. where the label was pasted, it is necessary to remove the remaining label and the brittle adhesive layer, making counterfeiting difficult. Furthermore, it is difficult to peel off these layers without breaking the coating, such as the hologram forming layer, and since what is peeled off is part of the label, part of the brittle adhesive layer may be removed. Since it has already been lost, it cannot be attached to another adherend,
Furthermore, the surface of the brittle adhesive layer is uneven due to the inorganic fine powder, and even if it is reattached to another adherend, the surface unevenness of the brittle adhesive layer will cause the hologram forming layer and the reflective metal thin film to become uneven. This causes distortion in the layer and the reproduced image of the hologram becomes unclear, making it easy to distinguish whether it is a legitimately pasted hologram or a hologram that has been peeled off and reapplied, and has a counterfeit prevention function. It can be used.

Therefore, the hologram label of the present invention can be applied not only to adherends that do not want to be forged, such as certificates and identification cards, but also as a seal for envelopes, packages, etc., and also for decorative purposes to articles, etc. It is also useful for applications in

The present invention will be described in more detail below with reference to specific examples.

Example 1 A polyester film with a thickness of 25 μm was used as the base material, and the following (1), (2), (3),
Using each of the compositions (4) and (5), a peeling protective layer (thickness (0.5 μ), a hologram forming layer (thickness 2.5 μ), a metal reflective layer (500 to 1000 Å), a brittle adhesive layer ( A transfer sheet was prepared by sequentially applying and forming 20μ).

Note that the metal reflective layer was laminated using a vacuum deposition method rather than coating.

(1) Composition for peelable protective layer Cellulose acetate resin...5 parts by weight Methanol...25 parts by weight MEK...45 parts by weight Toluene...25 parts by weight Methylolated melamine resin...0.5 parts by weight Para-toluenesulfonic acid ...0.05 parts by weight (2) Composition for hologram forming layer Acrylic resin ...40 parts by weight Melamine resin ...10 parts by weight Anon ...50 parts by weight MEK ...50 parts by weight (3) Material for metal reflective layer Aluminum ( 4) Composition for brittle adhesive layer Acrylic acid ester resin...20 parts by weight Toluene...40 Ethyl acetate...40 Polyisocyanate crosslinking agent...0.5 Microsilica...40 Obtained hologram label was pasted onto the entry column of the certificate using a heat press.

Even if an attempt was made to carefully remove the affixed hologram label, the hologram was destroyed due to delamination of the brittle adhesive layer, and it was impossible to remove the hologram in its original form.

[Brief explanation of the drawing]

1 and 2 are cross-sectional views showing an embodiment of the present invention, and FIGS. 3 and 4 are cross-sectional views showing other aspects of the hologram portion used in the present invention. DESCRIPTION OF SYMBOLS 1... Hologram label, 2... Hologram forming layer, 3... Reflective metal thin film layer, 4... Brittle adhesive layer, 5... Anchor layer, 6... Support, 7...
Hologram forming resin layer, 8...Peeling layer.

Claims (1)

[Claims for Utility Model Registration] (1) A hologram label in which a hologram forming layer, a reflective metal thin film layer, and an adhesive layer are sequentially laminated, wherein the adhesive layer is made of a synthetic resin having adhesive properties; A hologram label characterized by a brittle adhesive layer made of inorganic fine powder that makes synthetic resin brittle. (2) The hologram label according to claim (1) of the utility model registration, characterized in that a reflective metal thin film layer and a brittle adhesive layer are laminated with an anchor layer interposed therebetween. (3) The hologram label according to claim (1) of the utility model registration, characterized in that a reflective metal thin film layer and a brittle adhesive layer are laminated with an adhesive layer interposed therebetween. (4) The hologram label according to claim (1) of the utility model registration, characterized in that the hologram forming layer consists of a single layer. (5) Utility model registration claim No. (1) characterized in that the hologram forming layer is a laminate of a hologram forming resin layer and a hologram forming resin layer support.
Holographic label for the term. (6) Utility model registration claim No. 1, characterized in that the hologram-forming resin layer and the hologram-forming resin layer support are a laminate that is removably laminated.
Hologram label in section (5).