JP2005106857A - Hologram brittle sticker - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a hologram brittle sticker, whose manufacturing process is simple and whose brittle pattern is invisible and a manufacturing method therefor. <P>SOLUTION: The hologram brittle sticker has a base material, a peeling layer formed on the base material, a hologram layer formed on the peeling layer, a reflecting layer formed on the hologram layer, and an adhesive layer formed on the reflecting layer, and is characterized in that the peeling layer and hologram layer has an adhesion part, where the adhesive strength between the base material and peeling layer is large and a peeling part where the adhesive strength between the base material and peeling layer is small, and the total thickness of the peeling layer and hologram layer at the adhesion part is smaller than the total thickness of the peeling layer and hologram layer at the peeling part. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a hologram brittle seal that prevents counterfeiting such as hologram replacement.

  The hologram is recorded on a photosensitive material by causing two light beams (object light and reference light) having the same wavelength to interfere with each other and the wave front of the object light as interference fringes. When light of the same condition as the original reference light is applied to this hologram, a diffraction phenomenon due to interference fringes occurs, and the same wavefront as the original object light can be reproduced.

  In recent years, holograms have been widely used for security applications due to the fact that it is difficult to duplicate the same design. For example, holograms are affixed to parts of plastic cards, mobile phones, cash vouchers, daily necessities or CD-ROM packages. Used as a label or sticker.

  Such hologram seals include brittle seals that break when peeled off, so that they are not abused after being applied to an article. This brittle seal generally has a configuration in which a base material, a release layer, a hologram layer, a reflective layer, and an adhesive layer are sequentially laminated.

  For example, Patent Document 1 or Patent Document 2 discloses a brittle seal that completely destroys the hologram layer itself by providing a brittle layer in addition to the above layer configuration. As shown in FIG. 7, the brittle seal disclosed in Patent Document 1 includes a base material 11, a release layer 12, a hologram layer 13, a reflective layer 14, a patterned brittle layer 15, and an adhesive layer 16 in order. They are laminated and are designed so that the adhesive strength between the reflective layer 14 and the brittle layer 15 is weakened. When this brittle seal is peeled off after being attached to the adherend 17 as shown in FIG. 8, the adhesive strength between the reflective layer 14 and the brittle layer 15 is weak, so that the brittle layer 15 is provided. Peeling occurs between the reflective layer 14 and the brittle layer 15, and the base material 11 and the release layer 12 are peeled off where the brittle layer 15 is not provided. In this way, the brittle seal breaks up and down along the patterned brittle layer. Since such a brittle seal is broken along the pattern of the brittle layer when peeled off, it is difficult to divert it to other adherends, and the authenticity can be confirmed by the brittle pattern.

  However, the brittle seal as described above needs to be provided with a brittle layer in a pattern shape, which not only complicates the manufacturing process, but also the material for forming the brittle layer is different from other layers, so before the brittle seal is peeled off However, there is a problem that a brittle pattern is visible.

  Patent Document 3 discloses a brittle seal in which a base material, a hologram layer, a reflective layer, and an adhesive layer are sequentially laminated, and the surface treatment is performed by performing a surface treatment in a pattern on the base material. In addition, a brittle seal is disclosed that utilizes the difference in peel strength between a treated portion and a non-treated portion that is not subjected to surface treatment. When the brittle seal is peeled off, it is broken along the surface treatment pattern. Since such a brittle seal partially adjusts the peel strength by the surface treatment of the base material, it is difficult to visually observe the brittle pattern and the fraud prevention effect can be improved.

  However, even the brittle seal as described above has a problem that it is necessary to perform a surface treatment on the base material in a pattern, which increases the number of manufacturing steps.

JP-A-8-152842 JP 2000-10458 A Japanese Patent Laid-Open No. 9-244519

  The present invention has been made in view of the above problems, and has as its main object to provide a hologram brittle seal in which the production process is simple and the brittle pattern cannot be visually observed, and a method for producing the same. is there.

In order to achieve the above object, the present invention provides a substrate, a release layer formed on the substrate, a hologram layer formed on the release layer, and a reflective layer formed on the hologram layer. And a hologram brittle seal having an adhesive layer formed on the reflective layer,
The release layer and the hologram layer have an adhesive portion having a strong adhesive strength between the substrate and the release layer, and a release portion having a low adhesive strength between the substrate and the release layer,
The hologram brittle seal is characterized in that the total thickness of the release layer and the hologram layer in the adhesive portion is thinner than the total thickness of the release layer and the hologram layer in the release portion.

  According to the present invention, when the total thickness of the release layer and the hologram layer in the adhesive portion is smaller than the total thickness of the release layer and the hologram layer in the release portion, heat when forming the reflective layer or when forming the hologram layer Since the release layer in the adhesive portion having a thin total thickness is deteriorated or deteriorated by irradiation with ionizing radiation, the adhesive force between the release layer and the substrate is improved. Therefore, when the hologram brittle seal of the present invention is attached to the adherend and peeled off, the adhesive portion peels between the adherend and the adhesive layer because the adhesive strength between the substrate and the release layer is strong. Since the hologram layer is partially destroyed by peeling between the substrate and the release layer because the adhesive strength between the substrate and the release layer is weak, a hologram brittle seal having an anti-counterfeiting effect can be obtained. it can. Further, since the brittle pattern can be easily formed by controlling the total thickness of the release layer and the hologram layer, there is an advantage that the manufacturing process is simple. Further, since the brittle pattern cannot be visually observed, there is an advantage that the effect of preventing forgery is high.

  Moreover, in the said invention, the total thickness of the said peeling layer in the said adhesion part and the said hologram layer is 3.5 micrometers or less, and the total thickness of the said peeling layer in the said peeling part and the said hologram layer is 4.0 micrometers or more. It is preferable. When the total thickness of the peeling layer and the hologram layer in the adhesive portion and the peeling portion is in the above-described range, only the peeling layer in the adhesive portion is heated when forming the reflective layer or when the hologram layer is formed. Because it can be effectively deteriorated or altered by irradiation with ionizing radiation, the adhesive force between the release layer and the substrate at the adhesive portion is improved, and the adhesive force between the release layer and the substrate at the release portion is improved. It is because it can suppress.

  Furthermore, in the said invention, the thickness of the said peeling layer in the said adhesion part may be thinner than the thickness of the said peeling layer in the said peeling part, and the thickness of the said hologram layer in the said adhesion part is the said hologram in the said peeling part. It may be thinner than the thickness of the layer. According to the present invention, since the adhesive strength between the release layer and the substrate can be controlled by adjusting the total thickness of the release layer and the hologram layer, the thickness of at least one of the release layer and the hologram layer is This is because it only has to be adjusted.

The present invention also provides a release layer forming step for forming a release layer on a substrate, a hologram layer forming step for forming a hologram layer on the release layer, and a reflection layer formation for forming a reflection layer on the hologram layer. A method for producing a hologram brittle seal, comprising: a step; and an adhesive layer forming step of forming an adhesive layer on the reflective layer,
In the release layer forming step and the hologram layer forming step, the release layer and the hologram layer have a total thickness of the release layer and the hologram layer in an adhesive portion, and a total thickness of the release layer and the hologram layer in the release portion. It is formed to be thinner,
The hologram is characterized in that an adhesive strength adjustment process is performed such that the adhesive strength between the release layer and the substrate in the adhesive portion is greater than the adhesive strength between the release layer and the substrate in the release portion. A method for manufacturing a brittle seal is provided.

  According to the present invention, the reflective layer in the reflective layer forming step is formed by forming the total thickness of the release layer and the hologram layer in the adhesive portion to be smaller than the total thickness of the release layer and the hologram layer in the release portion. Adhesion force between the release layer and the substrate because the release layer at the thin adhesive portion deteriorates or deteriorates due to the heat generated during irradiation or the irradiation of ionizing radiation when forming the hologram layer in the hologram layer forming process. Will improve. Therefore, when the hologram brittle seal manufactured in accordance with the present invention is attached to an adherend and peeled off, the adhesive portion peels between the adherend and the adhesive layer because the adhesive strength between the substrate and the release layer is strong. The hologram brittle seal having an anti-counterfeiting effect because the hologram layer is partially destroyed by peeling between the substrate and the release layer because the adhesive strength between the substrate and the release layer is weak at the release part can do. Further, since the brittle pattern can be easily formed by controlling the total thickness of the release layer and the hologram layer, there is an advantage that the manufacturing process is simple. Further, since the brittle pattern cannot be visually observed, there is an advantage that the effect of preventing forgery is high.

  In the present invention, the total thickness of the release layer and the hologram layer in the adhesive portion is 3.5 μm or less, and the total thickness of the release layer and the hologram layer in the release portion is 4.0 μm or more. It is preferable to be formed. When the total thickness of the peeling layer and the hologram layer in the adhesive portion and the peeling portion is in the above-described range, only the peeling layer in the adhesive portion is heated when forming the reflective layer or when the hologram layer is formed. Because it can be effectively deteriorated or altered by irradiation with ionizing radiation, the adhesive force between the release layer and the substrate at the adhesive portion is improved, and the adhesive force between the release layer and the substrate at the release portion is improved. It is because it can suppress.

  According to the present invention, when the total thickness of the release layer and the hologram layer in the adhesive portion is smaller than the total thickness of the release layer and the hologram layer in the release portion, heat when forming the reflective layer or when forming the hologram layer By irradiation with ionizing radiation, only the release layer at the adhesive part deteriorates or deteriorates, and the adhesive force between the release layer and the base material is improved. A hologram brittle seal that can be partially broken can be obtained. In addition, since the brittle pattern can be easily formed by controlling the total thickness of the release layer and the hologram layer, the manufacturing process is simple and the brittle pattern cannot be visually observed, so that forgery is prevented. There is also an advantage that the effect is high.

  Hereinafter, the hologram brittle seal of the present invention and the manufacturing method thereof will be described in detail.

A. Hologram Brittle Seal First, the hologram brittle seal of the present invention will be described.

  The hologram brittle seal of the present invention includes a substrate, a release layer formed on the substrate, a hologram layer formed on the release layer, a reflection layer formed on the hologram layer, and the reflection A fragile hologram seal having an adhesive layer formed on the layer, wherein the release layer and the hologram layer include an adhesive portion having a strong adhesive strength between the base material and the release layer, and the base material and the release layer. A peeling portion having a weak adhesive strength with the layer, and the total thickness of the peeling layer and the hologram layer in the bonding portion is thinner than the total thickness of the peeling layer and the hologram layer in the peeling portion. To do.

  The hologram brittle seal of the present invention will be described with reference to the drawings. FIG. 1 is a schematic sectional view showing an example of a hologram brittle seal of the present invention. As shown in FIG. 1, the hologram brittle seal of the present invention comprises a base material 1, a release layer 2 formed on the base material 1, a hologram layer 3 formed on the release layer 2, and the hologram. The reflective layer 4 formed on the layer 3 and the adhesive layer 5 formed on the reflective layer 4 are included. Further, the release layer 2 and the hologram layer 3 have an adhesive portion 6 having a high adhesive strength between the base material 1 and the release layer 2 and a release portion 7 having a low adhesive strength between the base material 1 and the release layer 2. In addition, the total thickness of the release layer 2 and the hologram layer 3 in the adhesive portion 6 is thinner than the total thickness of the release layer 2 and the hologram layer 3 in the release portion 7.

  In manufacturing such a hologram brittle seal, when the reflective layer is formed by, for example, a vapor deposition method, the peeling layer formed under the reflective layer is deteriorated or deteriorated by the heat generated by the vapor generated from the reflective layer forming material. It may change in quality and the adhesive force between the substrate and the release layer may increase. The influence of heat at the time of forming the reflective layer is considered to depend on the thicknesses of the release layer and the hologram layer. That is, if the release layer and the hologram layer are thin, the release layer and the hologram layer are easily affected by the heat generated by the vapor formed from the reflective layer, and the release layer is easily deteriorated or deteriorated, but the release layer and the hologram layer are thick. And it is hard to receive the influence by said heat | fever and can suppress degradation or quality change of a peeling layer.

  In addition, when the material for forming the hologram layer is, for example, an ionizing radiation curable resin, the release layer may be deteriorated or deteriorated by irradiation with ionizing radiation when forming the hologram layer. In this case as well, the effect of irradiation with ionizing radiation during the formation of the hologram layer is considered to depend on the thickness of the release layer and the hologram layer. If the release layer and the hologram layer are thin, they are affected by the irradiation of ionizing radiation. The release layer is easily deteriorated or deteriorated. However, if the release layer and the hologram layer are thick, the release layer is hardly affected by irradiation with ionizing radiation, and deterioration or deterioration of the release layer can be suppressed.

  Since this release layer is a layer provided to easily release the base material and the hologram layer, it has been conventionally considered that it is not preferable that the adhesive force with the base material increases. Focused on the relationship between the thickness of the release layer and the hologram layer as described above and the influence of heat upon formation of the reflective layer or irradiation with ionizing radiation upon formation of the hologram layer. That is, according to the present invention, by partially changing the total thickness of the release layer and the hologram layer, the adhesive force between the release layer and the substrate can be partially increased. It is possible to obtain a hologram brittle seal that can be destroyed.

  Here, a state after the hologram brittle seal of the present invention is attached to an adherend and peeled off will be described with reference to the drawings. FIG. 3 is an explanatory diagram for explaining a state after the adhesive layer 5 of the hologram brittle seal of the present invention is attached to the adherend 8 and peeled off. As described above, in the hologram brittle seal of the present invention, the total thickness of the peeling layer 2 and the hologram layer 3 in the bonding portion 6 is thinner than the total thickness of the peeling layer 2 and the hologram layer 3 in the peeling portion 7. Since the total thickness of the release layer 2 and the hologram layer 3 is thin at the adhesive portion 6, the release layer 2 deteriorates or deteriorates due to heat when the reflective layer 4 is formed on the hologram layer 3, and the release layer 2 and the base material 1. Adhesive strength is improved. On the other hand, since the total thickness of the peeling layer 2 and the hologram layer 3 is thick in the peeling portion 7, the peeling layer 2 is hardly affected by heat when the reflective layer 4 is formed on the hologram layer 3, and the peeling layer 2 is substantially deteriorated or deteriorated. There is no alteration. Therefore, when the hologram brittle seal of the present invention is attached to the adherend 8 and peeled off, the adhesive force between the base material 1 and the release layer 2 is increased at the adhesive portion 6, so that the adherend 8 and the adhesive layer 5 In the peeling portion 7, there is no change in the adhesive force between the base material 1 and the peeling layer 2, and the adhesive strength is weak, so that the peeling occurs between the base material 1 and the peeling layer 2. Thereby, since the hologram layer 3 is partially destroyed, a hologram brittle seal having an anti-counterfeit effect can be obtained.

  Further, according to the present invention, since the brittle pattern can be easily formed by controlling the total thickness of the release layer and the hologram layer, there is an advantage that the manufacturing process is simple. Further, since the brittle pattern cannot be visually observed, there is an advantage that the effect of preventing forgery is high.

  In the present invention, as described above, the total thickness of the release layer and the hologram layer is smaller than the total thickness of the release layer and the hologram layer in the release portion, as described above. It is. Specifically, the total thickness of the release layer and the hologram layer in the bonded portion is in the range of 2.0 μm to 3.5 μm, in particular in the range of 2.5 μm to 3.5 μm, particularly 3.0 μm to 3.5 μm. It is preferable to be within the range. If the total thickness of the release layer and the hologram layer in the adhesive portion is larger than the above range, there is a possibility that it is difficult to be affected by heat or the like during the formation of the reflective layer, thereby improving the adhesive force between the release layer and the substrate. This may be difficult. On the other hand, when the total thickness of the release layer and the hologram layer in the adhesive portion is thinner than the above range, the difference between the total thickness of the release layer and the hologram layer in the adhesive portion and the total thickness of the release layer and the hologram layer in the release portion is This is because the flatness of the hologram layer is impaired and the flatness of the hologram layer is impaired, and therefore, when the diffraction fringes and the interference fringes of the hologram are recorded as irregularities, there is a possibility of adversely affecting the reproduction of the irregularities.

  The total thickness of the release layer and the hologram layer in the release part is within the range of 4.0 μm to 5.5 μm, particularly within the range of 4.0 μm to 5.0 μm, particularly within the range of 4.0 μm to 4.5 μm. Preferably there is. If the total thickness of the release layer and the hologram layer in the release part is thinner than the above range, it may be easily affected by heat or the like during the formation of the reflective layer, and the adhesion between the release layer and the substrate is improved. Because there is a possibility. On the other hand, when the total thickness of the release layer and the hologram layer in the release portion is larger than the above range, the difference between the total thickness of the release layer and the hologram layer in the release portion and the total thickness of the release layer and the hologram layer in the adhesion portion is This is because the flatness of the hologram layer is impaired and the flatness of the hologram layer is impaired, and therefore, when the diffraction fringes and the interference fringes of the hologram are recorded as irregularities, there is a possibility of adversely affecting the reproduction of the irregularities.

  Furthermore, the difference between the total thickness of the release layer and the hologram layer in the adhesive portion and the total thickness of the release layer and the hologram layer in the release portion is in the range of 0.5 μm to 2.0 μm, and more particularly 0.5 μm to It is preferable to be in the range of 1.5 μm, particularly in the range of 0.5 μm to 1.0 μm. The difference in the total thickness of the release layer and the hologram layer in the adhesive portion and the release portion is within the above range, thereby improving the adhesive force between the base material and the release layer in the adhesive portion, and the base material in the release portion. It is because it can suppress that the adhesive force of a peeling layer and a change is possible.

In the present invention, as described above, it is sufficient that the total thickness of the release layer and the hologram layer is partially different in the adhesive portion and the release portion, and the thickness of the release layer 2 is as shown in FIG. It may be partially different, or the thickness of the hologram layer 3 may be partially different as shown in FIG. Further, both the release layer and the hologram layer may be partially different in thickness.
Hereinafter, each configuration of the hologram brittle seal will be described.

1. Base Material The base material used for the hologram brittle seal of the present invention is not particularly limited as long as a release layer described later can be formed and is usually used for holograms. For example, polyethylene film, polypropylene film, polyethylene fluoride film, polyvinylidene fluoride film, polyvinyl chloride film, polyvinylidene chloride film, ethylene-vinyl alcohol copolymer film, polyvinyl alcohol film, polymethyl methacrylate film, polyether sulfone film Polyether ether ketone film, polyamide film, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer film, polyester film such as polyethylene terephthalate film, transparent resin film such as polyimide film and polyolefin film can be used.

  Further, when thermal transfer is performed from the substrate side when the hologram brittle seal is attached to the adherend, it is preferably resistant to heat and pressure applied during the thermal transfer.

  The thickness of such a substrate is appropriately selected according to the use and type of the hologram brittle seal, and is usually in the range of 2 μm to 200 μm, preferably 6 μm to 50 μm.

2. Release Layer Next, the release layer used in the present invention will be described. In this invention, a peeling layer is formed on the said base material, and has an adhesion part with strong adhesive strength with the said base material, and a peeling part with weak adhesive strength with the said base material. . In addition, the total thickness of the peeling layer and the hologram layer described later in the adhesion part is thinner than the total thickness of the peeling layer and the hologram layer in the peeling part.

  According to the present invention, by making the total thickness of the release layer and the hologram layer different between the adhesive portion and the release portion, only in the adhesive portion having a thin total thickness, for example, by the action of heat when forming the reflective layer, The adhesive force between the release layer and the substrate can be increased. The release layer is bonded to the adherend so that the substrate and the hologram layer are not easily peeled off after the hologram brittle seal is attached to the adherend. Is provided so that smooth peeling can be performed. Therefore, since the total thickness of the peeling layer and the hologram layer is thick at the peeling portion, it is not affected by heat during the formation of the reflective layer, and the adhesive force between the substrate and the peeling layer is not changed. When the material is peeled off, the base material and the release layer are easily peeled off. Therefore, in the present invention, the adherend and the adhesive layer are peeled off at the adhesive portion, and the substrate and the peeling layer are peeled off at the peeled portion, so that the hologram brittleness can be partially destroyed. It can be a seal.

  In the present invention, the total thickness of the peeling layer and the hologram layer in the bonding portion is thinner than the total thickness of the peeling layer and the hologram layer in the peeling portion. Therefore, as the thickness of the release layer, for example, as shown in FIG. 1, the thickness of the release layer 2 in the adhesive portion 6 may be smaller than the thickness of the release layer 2 in the release portion 7, and for example, as shown in FIG. When the thickness of the hologram layer 3 is different between the adhesive portion 6 and the peeling portion 7, the thickness of the peeling layer 2 may be uniform at the adhesive portion 6 and the peeling portion 7.

  As described above, the thickness of the release layer is not particularly limited as long as the total thickness of the release layer and the hologram layer in the bonded portion is thinner than the total thickness of the release layer and the hologram layer in the release portion. However, it is usually in the range of 0.2 μm to 3.0 μm, preferably in the range of 0.5 μm to 2.5 μm, more preferably in the range of 1.0 μm to 2.0 μm. If the release layer is thinner than the above range, the release performance may be impaired. If the release layer is thicker than the above range, the hologram brittle seal of the present invention is attached to the adherend and peeled off. Moreover, it is because the film breakage of the release layer may be deteriorated.

  In the present invention, the adhesive strength between the release layer and the substrate in the adhesive portion is greater than the adhesive strength between the release layer and the substrate in the release portion. In addition, when the hologram brittle seal of the present invention is attached to an adherend, the adhesive strength between the release layer and the substrate in the adhesive portion is particularly limited as long as it is greater than the adhesive strength between the adhesive layer and the adherend. It is not something. For example, as shown in FIG. 3, in the adhesive portion 6, the adhesive strength between the base material 1 and the release layer 2 is larger than the adhesive strength between the adhesive layer 5 and the adherend 8, thereby This is because the body 8 is peeled off. The adhesive strength between the release layer and the base material in such an adhesive part varies depending on the material of the base material and the release layer, but specifically, it is 100 g / inch or more, particularly 150 g / inch or more, particularly 200 g. / Inch or more is preferable.

  On the other hand, as the adhesive strength between the release layer and the substrate in the release portion, when the hologram brittle seal of the present invention is attached to the adherend, the adhesive strength between the release layer and the substrate in the release portion is There is no particular limitation as long as it is lower than the adhesive strength between the adhesive layer and the adherend. For example, as shown in FIG. 3, in the peeling portion 7, the adhesive strength between the base material 1 and the peeling layer 2 is smaller than the adhesive strength between the adhesive layer 5 and the adherend 8, so This is because 2 is peeled off. The adhesive strength between the release layer and the substrate in such an exfoliation part varies depending on the base material and the forming material of the release layer, but specifically, it is 30 g / inch or less, particularly 20 g / inch or less, especially 15 g. / Inch or less is preferable.

  As described above, as described above, the peeling layer is smoothly peeled off from the base material at the peeling portion, and the adhesive portion is deteriorated or deteriorated due to heat at the time of forming the reflective layer or irradiation with ionizing radiation at the time of forming the hologram layer. The material is not particularly limited as long as the material has high adhesive strength with the substrate. For example, from acrylic resin, vinyl chloride-vinyl acetate copolymer resin, polyester resin, polymethacrylate resin, polyvinyl chloride resin, cellulose resin, silicone resin, chlorinated rubber, casein, various surfactants, metal oxides, etc. What mixed 1 type (s) or 2 or more types etc. can be used. Among these, an acrylic resin having a molecular weight of about 20,000 to 100,000, or an acrylic resin and a vinyl chloride-vinyl acetate copolymer resin having a molecular weight of 8000 to 20000, and a polyester resin having a molecular weight of 1,000 to 5,000 as an additive. It is particularly preferable that the composition comprises ˜5% by weight.

  In addition, a stabilizer can be added to the above resin in order to reduce the influence of heat at the time of forming the reflective layer and irradiation of ionizing radiation at the time of forming the hologram layer. Examples of such stabilizers include those that prevent dehydrochlorination of vinyl chloride resins, antioxidants, and light stabilizers.

  Examples of preventing the dehydrochlorination of the vinyl chloride resin include metal soap stabilizers, organotin compound stabilizers, lead compound stabilizers, antimony compound stabilizers, and the like. Moreover, you may use in combination with stabilization adjuvants, such as an epoxy compound, a phosphite ester type compound, and a beta-diketone type compound.

  In addition, as the antioxidant, phenolic antioxidants such as stearyl-β- (3,5-di-t-butyl-4-hydroxyphenyl) propionate (Asahi Denka Kogyo Co., Ltd., ADK STAB AO-50) are used. Agents, organic sulfur compound antioxidants such as dilauryl-3,3'-thiodipropionate, and organic phosphorus compound antioxidants such as trisnonylphenyl phosphite.

  Further, examples of the light stabilizer include ultraviolet absorbers such as benzophenone, benzotriazole, acrylate, salicylate, oxanilide, and hindered amine.

  Such a stabilizer may be added at a ratio of 1/100000 to 1/100, preferably 1/10000 to 1/1000, based on mass, depending on the type of stabilizer.

3. Hologram Layer Next, the hologram layer used in the present invention will be described. In the present invention, the hologram layer is formed on the release layer, and has a strong adhesive strength between the base material and the release layer, and a low adhesive strength between the base material and the release layer. It has a peeling part. Further, the total thickness of the release layer and the hologram layer in the adhesive portion is thinner than the total thickness of the release layer and the hologram layer in the release portion.

  According to the present invention, as described above, by making the total thickness of the release layer and the hologram layer different between the adhesive portion and the release portion, only at the adhesive portion having a thin total thickness, for example, when the reflective layer is formed. The adhesive force between the release layer and the substrate can be increased by the action of heat. In addition, since the total thickness of the release layer and the hologram layer is thick at the release part, it is not affected by heat during the formation of the reflective layer, and the adhesive force between the substrate and the release layer is not changed. When the material is peeled off, the base material and the release layer can be easily peeled off. Therefore, in the present invention, the adherend and the adhesive layer are peeled off at the adhesive portion, and the substrate and the peeling layer are peeled off at the peeled portion, so that the hologram brittleness can be partially destroyed. It can be a seal.

  In the present invention, the total thickness of the peeling layer and the hologram layer in the bonding portion is thinner than the total thickness of the peeling layer and the hologram layer in the peeling portion. Therefore, as the thickness of the hologram layer, for example, as shown in FIG. 2, the thickness of the hologram layer 3 in the bonding portion 6 may be smaller than the thickness of the hologram layer 3 in the peeling portion 7, and for example, as shown in FIG. When the thickness of the release layer 2 is different between the adhesive portion 6 and the release portion 7, the thickness of the hologram layer 3 may be uniform.

  As described above, the thickness of the hologram layer in the bonding portion is not particularly limited as long as the total thickness of the peeling layer and the hologram layer in the bonding portion is smaller than the total thickness of the peeling layer and the hologram layer in the peeling portion. However, it is usually in the range of 1.5 μm to 3.3 μm, preferably in the range of 2.0 μm to 3.0 μm, more preferably in the range of 2.5 μm to 3.0 μm. When the thickness of the hologram layer is thinner than the above range, when recording the diffraction grating or the interference fringe of the hologram as the unevenness, there is a possibility that the forming of the unevenness may be insufficient, and the thickness of the hologram layer is within the above range. This is because when the thickness is larger, the hologram brittle seal of the present invention may be affixed to the adherend and peeled off, and the hologram layer may be damaged.

  In the present invention, a hologram is formed by forming fine irregularities on the surface of the hologram layer. Such a hologram may be a surface hologram or a volume hologram. Specifically, relief holograms, Lippmann holograms, Furnell holograms, Fraunhofer holograms, lensless Fourier transform holograms, laser reproduction holograms (image holograms, etc.), white light reproduction holograms (rainbow holograms, etc.), color holograms, computer holograms, Hologram displays, multiplex holograms, holographic stereograms, holographic diffraction gratings, and the like.

  As the material for forming the hologram layer used in the present invention, a thermosetting resin, a thermoplastic resin, an ionizing radiation curable resin, or the like can be used.

  Examples of the thermosetting resin include unsaturated polyester resins, acrylic urethane resins, epoxy-modified acrylic resins, epoxy-modified unsaturated polyester resins, alkyd resins, phenol resins, melamine resins, and acrylate resins. For example, polyester (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, polyether (meth) acrylate, polyol (meth) acrylate, melamine (meth) acrylate, triazine acrylate, and the like can be used.

  Examples of the thermoplastic resin include acrylate resin, acrylamide resin, nitrocellulose resin, polystyrene resin, polyvinyl chloride resin, polycarbonate resin, acrylic resin (PMMA, etc.), and the like.

  These thermosetting resins and thermoplastic resins may be used as a homopolymer or two or more copolymers. Furthermore, a thermoformable substance having a radically polymerizable unsaturated group or a radically polymerizable unsaturated monomer added thereto to form an ionizing radiation curable resin.

  Examples of the ionizing radiation curable resin include epoxy acrylate resins, urethane acrylate resins, acrylic modified polyester resins, and urethane modified acrylate resins described in JP-A No. 2000-272295.

  In the present invention, among the above, it is preferable to use an ionizing radiation curable resin and a thermosetting resin. This is because these are superior in durability compared to thermoplastic resins.

  The above resin may be contained in the hologram layer in the range of 10 to 90% by weight, preferably in the range of 25 to 85% by weight.

  In addition to the above resins, silver salts, dichromated gelatin, thermoplastics, diazo photosensitive materials, photoresists, ferroelectrics, photochromic materials, thermochromic materials, chalcogen glass and other photosensitive materials are also used. can do.

  In the present invention, a thermosetting agent or an ultraviolet curing agent can be blended with the above-described thermosetting resin or ionizing radiation curable resin. Examples of thermosetting or ultraviolet curing agents include isocyanate resins, metal soaps such as cobalt naphthenate and zinc naphthenate, peroxides such as benzoyl peroxide and methyl ethyl ketone peroxide, benzophenone, acetophenone, anthraquinone, naphthoquinone, azobisisobutyro Nitrile, diphenyl sulfide and the like can be mentioned.

  In the present invention, the above-mentioned ionizing radiation curable resin can include monofunctional or polyfunctional monomers, oligomers, polymers, and the like as described below for the purpose of adjusting the cross-linking structure and viscosity. .

  Monofunctional monomers and oligomers include tetrahydrofurfuryl (meth) acrylate, hydroxyethyl (meth) acrylate, vinylpyrrolidone, (meth) acryloyloxyethyl succinate, (meth) acryloyloxyethyl phthalate and other mono (meth) acrylates Etc.

  Moreover, as a polyfunctional monomer, oligomer, and polymer, when classified by a skeleton structure, polyol (meth) acrylate (epoxy-modified polyol (meth) acrylate, lactone-modified polyol (meth) acrylate, etc.), polyester (meth) acrylate, epoxy ( Poly (meth) acrylates with skeletons such as (meth) acrylate, urethane (meth) acrylate, polybutadiene, isocyanuric acid, hydantoin, melamine, phosphoric acid, imide, phosphazene, etc., UV, electron beam Various monomers, oligomers, and polymers that are curable can be used.

  Specifically, as the bifunctional monomer and oligomer, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate Etc. Examples of the trifunctional monomer and oligomer include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, and aliphatic tri (meth) acrylate. Examples of the tetrafunctional monomer and oligomer include pentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, and aliphatic tetra (meth) acrylate. Furthermore, examples of the pentafunctional or higher functional monomer and oligomer include dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, polyester skeleton, urethane skeleton, and (meth) acrylate having a phosphazene skeleton. .

  The number of functional groups of the monofunctional or polyfunctional monomer and oligomer is not particularly limited, but those having 3 to 20 functional groups are preferable. This is because if the number of functional groups is smaller than 3, the heat resistance tends to decrease, and if the number of functional groups exceeds 20, the flexibility tends to decrease.

  In the present invention, when the hologram layer is formed using the ionizing radiation curable resin, the release layer may be deteriorated or altered by irradiation with ionizing radiation when the ionizing radiation curable resin is cured. The total thickness of the release layer and the hologram layer is reduced to a predetermined thickness at the adhesive portion, thereby improving the adhesive force between the release layer and the substrate. In the peeling portion, the total thickness of the peeling layer and the hologram layer is increased to a predetermined thickness to suppress the influence of irradiation with ionizing radiation. Therefore, the irradiation amount of the ionizing radiation may be deteriorated or altered in the peeling layer of the adhesive portion, but is preferably an amount that does not cause deterioration or alteration of the peeling layer in the peeling portion.

  When it is difficult to adjust the irradiation dose of ionizing radiation when recording the interference fringes of the hologram, for example, when an ultraviolet curable resin is used as the ionizing radiation curable resin for the hologram layer, An ultraviolet absorber can be added to control the effect of ultraviolet irradiation on the degradation or alteration of the release layer. In this case, by irradiating ultraviolet rays from the hologram layer side, the ultraviolet absorbers contained in the hologram layer absorb the irradiated ultraviolet rays. Therefore, the peeling layer formed under the hologram layer is less affected by the ultraviolet rays. Become.

  As such an ultraviolet absorber, those described in the column of the release layer can be used.

  When a hologram is formed on the hologram forming layer formed using the above resin, it can be formed by a generally used method. For example, when recording the diffraction fringes and hologram interference fringes as reliefs with surface irregularities, the original plate on which the diffraction gratings and interference fringes are recorded in irregularities is used as a press mold, and the hologram forming layer made of the above resin The concavo-convex pattern of the original plate can be duplicated by stacking the original plate on top and heat-pressing it.

  Here, the hologram forming layer means a layer made of the resin before the diffraction grating and interference fringes are recorded. The hologram layer records the diffraction grating and interference fringes on the hologram forming layer. Then, the above-mentioned resin is cured.

  In the present invention, a release agent can be added in advance to the resin so that the hologram forming layer made of the resin can be easily peeled off from the original. Examples of such a release agent include generally used release agents such as solid waxes such as polyethylene wax, amide wax, and Teflon (registered trademark), fluorine-based and phosphate-based surfactants, silicone, and the like. Can be used. In particular, it is preferable to use a modified silicone as a release agent.

  Examples of the modified silicone include (1) modified silicone oil side chain type, (2) modified silicone oil both end type, (3) modified silicone oil one end type, (4) modified silicone oil side chain both end type, (5 And methyl polysiloxane containing trimethylsiloxysilicate (referred to as silicone resin), (6) silicone graft acrylic resin, and (7) methylphenyl silicone oil.

  The modified silicone oil is classified into a reactive silicone oil and a non-reactive silicone oil. Examples of the reactive silicone oil include amino modification, epoxy modification, carboxyl group modification, carbinol modification, methacryl modification, mercapto modification, phenol modification, one-end reactivity, and different functional group modification. On the other hand, examples of the non-reactive silicone oil include polyether modification, methylstyryl modification, alkyl modification, higher fatty ester modification, hydrophilic special modification, higher alkoxy modification, higher fatty acid modification, and fluorine modification.

  Among the above-mentioned modified silicone oils, reactive silicone oils of a type having a group reactive with the above resin react and bond with the resin as the resin is cured, so that hologram formation with irregularities formed later is formed. Characteristic performance can be imparted without bleeding out to the surface of the working layer. In particular, it is effective for improving the adhesion with a deposited film such as a reflective layer formed by a deposition method.

4). Next, the reflective layer used in the present invention will be described. In the present invention, the reflection layer is formed between the hologram layer and an adhesive layer to be described later. When a metal thin film or the like that reflects light is used for the reflection layer, an opaque type hologram is formed. When a transparent substance having a refractive index difference from that of the layer is used, a transparent type hologram is obtained, but any of them can be used in the present invention.

  Examples of the metal thin film that forms such an opaque type hologram include, for example, Cr, Ti, Fe, Co, Ni, Cu, Ag, Au, Ge, Al, Mg, Sb, Pb, Pd, Cd, Bi, and Sn. , Se, In, Ga, Rb, etc., and oxides, nitrides, etc. thereof, or a thin film formed by combining two or more of them. Among the metal thin films, Al, Cr, Ni, Ag, Au and the like are particularly preferable.

On the other hand, as a thin film for forming a transparent type hologram, any material can be used as long as it is light transmissive so as to exhibit the hologram effect. For example, a resin that is a material for forming the hologram layer and a transparent material having a different refractive index can be used. The refractive index in this case may be larger or smaller than the refractive index of the resin that is the material for forming the hologram layer, but the difference in refractive index is preferably 0.3 or more, more preferably 0.5 or more. Yes, 1.0 or more is optimal. Examples of such transparent thin films include metallic reflective films, and transparent type reflective layers that are preferably used include TiO ₂ , ZnS, Al ₂ O ₃ , Sb ₂ S ₃ , SiO, TiO, SiO ₂ , Examples thereof include LiF, MgF ₂ , AlF ₃ , and Cu · Al composite metal oxide.

  Furthermore, as a transparent material used for the transparent type reflective layer, a transparent resin having a refractive index different from that of the resin that forms the hologram layer can be used. For example, polytetrafluoroethylene, polychlorotrifluoroethylene, Examples include polyvinyl acetate, polyethylene, polypropylene, and polymethyl methacrylate.

  When the reflective layer is formed by, for example, a vapor deposition method, the release layer formed under the reflective layer is deteriorated or deteriorated due to heat generated by the vapor generated from the reflective layer forming material. Adhesive strength may increase. The effect of heat during the formation of the reflective layer is thought to depend on the thickness of the release layer and the hologram layer. If the thickness of the release layer and the hologram layer is thin, the effect of heat generated by the vapor generated from the reflective layer forming material is affected. Although it is easy to receive and a peeling layer is easy to deteriorate or change in quality, when the thickness of a peeling layer and a hologram layer is thick, it is hard to receive the influence by said heat and can prevent deterioration or quality change of a peeling layer. Therefore, in the present invention, by reducing the total thickness of the release layer and the hologram layer at the adhesive portion so as to be a predetermined thickness, the release layer is deteriorated or altered, and the adhesive force between the release layer and the substrate is increased. By increasing the total thickness of the release layer and the hologram layer in the release portion so as to be a predetermined thickness, the influence of heat during the formation of the reflective layer is suppressed.

  The influence of heat at the time of forming the reflective layer varies depending on the thickness of the reflective layer. If the thickness of the reflective layer is large, the amount of heat generated by the vapor generated from the material for forming the reflective layer increases, which greatly affects the deterioration or alteration of the release layer. Therefore, the thickness of the reflective layer may be such that the release layer at the adhesive portion is deteriorated or altered, but the thickness is preferably such that the release layer at the release portion is not deteriorated or altered. Specifically, the film thickness of the opaque type reflective layer is preferably in the range of 1 to 10,000 nm, particularly 20 to 200 nm. On the other hand, the film thickness of the transparent type reflective layer may be a transparent region of a transparent material for forming a thin film, and is preferably 10 to 100 nm. Moreover, it is preferable that the film thickness at the time of using a metallic reflective film as a transparent type reflective layer is 20 nm or less.

5). Next, the adhesive layer used for the hologram brittle seal of the present invention will be described. In the present invention, the adhesive layer is a layer formed on the surface opposite to the base material of the hologram brittle seal, and is bonded to the hologram brittle seal when it is stuck on the adherend and heated to cause hologram brittleness. This is a layer for adhering the seal and the adherend.

  The adhesive layer is not particularly limited as long as it is a material that can adhere the hologram brittle seal of the present invention and the adherend, and a material generally used as an adhesive can be used. For example, ethylene-vinyl acetate copolymer resin (EVA), polyamide resin, polyester resin, polyethylene resin, ethylene-isobutyl acrylate copolymer resin, butyral resin, polyvinyl acetate and its copolymer resin, vinyl chloride / vinyl acetate copolymer Resin, cellulose resin, polymethyl methacrylate resin, polyvinyl ether resin, polyurethane resin, polycarbonate resin, polypropylene resin, epoxy resin, phenol resin, styrene butadiene styrene block copolymer (SBS), styrene isoprene styrene block copolymer ( SIS), styrene ethylene butylene styrene block copolymer (SEBS), styrene ethylene propylene styrene block copolymer (SEPS), and other thermoplastic resins can be used.Among these, a layer that can be heat-sealed at a temperature of 180 ° C. or lower is preferable, and an ethylene-vinyl acetate copolymer resin (EVA) having an acetic acid content of 25% or more is preferably used. In addition, the resin may have an adhesive layer colored as necessary.

  In the present invention, characters and images may be formed on the adhesive layer by transfer using a transfer ribbon such as a sublimation transfer ribbon and a thermal head. This is because, when a letter or image is formed on the adhesive layer, the adhesive layer having the letter or image is covered with a reflective layer, a hologram layer, or the like after the hologram brittle seal of the present invention is attached to the adherend. This is because it has an advantage that characters and alteration are difficult. In addition, when forming characters or images on the adhesive layer, it is preferable to add a release agent such as silicone oil or silicone resin to the adhesive layer so that the transfer ribbon and the adhesive layer are not thermally fused.

  The thickness of the adhesive layer is usually preferably in the range of 1 μm to 20 μm.

  In addition, when the hologram brittle seal of the present invention is attached to the adherend, the adhesive strength between the adhesive layer and the adherend is smaller than the adhesive strength between the release layer and the substrate at the adhesive portion, and the peel at the peel portion. It is preferable that it is larger than the adhesive strength between the layer and the substrate. For example, as shown in FIG. 3, in the bonding portion 6, the bonding strength between the bonding layer 5 and the adherend 8 is smaller than the bonding strength between the base material 1 and the peeling layer 2, so The base material 1 and the release layer are peeled off from the body 8, and the adhesive strength between the adhesive layer 5 and the adherend 8 is higher than the adhesive strength between the base material 1 and the release layer 2 in the release portion 7. This is because 2 is peeled off.

  The adhesive strength between the adhesive layer and the adherend varies depending on the adhesive layer, the material of the adherend, and the like. Specifically, the adhesive strength is within the range of 30 to 100 g / inch, particularly 40 to 90 g / inch. It is preferable to be within the range, particularly within the range of 50 to 80 g / inch.

6). Hologram brittle seal When using the hologram brittle seal of the present invention, for example, as shown in FIG. 4, the hologram brittle seal 10 is placed on the adherend 8 so that the adhesive layer 5 is in contact with the adherend 8. Then, the hologram brittle seal 10 is bonded onto the adherend 8 by heating and pressurizing with a flat plate press or roll press. Thereby, the hologram brittle seal 10 can be stuck on the adherend 8.

  FIG. 5 shows an example of a recording medium that can be obtained as described above. A hologram brittle seal 10 is affixed to the right side of the adherend 8 in the form of a card, has a magnetic recording layer 21 slightly inside along the upper side, and in addition, a character 22 is formed.

  The hologram brittle seal of the present invention is used not only for the card as described above but also for various applications. For example, it can be used for an ID (identity confirmation) card, and specifically includes a savings card such as a bank, a credit card, and an identification card. Moreover, it is not always necessary to use it for a card, and an examination ticket, a passport, etc. may be used. Furthermore, it can also be used for banknotes, gift certificates, stock certificates, securities, bankbooks, boarding tickets, air tickets, and the like. It can also be used for prepaid cards for transportation and public telephones, and information such as the amount is recorded in these cards.

  In addition, the hologram brittle seal of the present invention may be used to prove the authenticity of expensive articles. For example, it is used in world-renowned luxury goods called so-called brand goods such as luxury watches, precious metals, jewelry, and their storage boxes and cases. Further, the present invention can also be applied to a storage medium such as a magnetic recording medium in which music software, video software, computer software, game software, or the like is recorded, or a case thereof.

7). Others (1) Adhesion improving layer In the present invention, an adhesion improving layer may be provided between the release layer and the hologram layer. This adhesion improving layer is a layer for improving the adhesion between the release layer and the hologram layer. As described above, the release layer controls the adhesive strength with the base material, and the adhesive force between the release layer and the hologram layer may be reduced. It is preferable to use a mixture of a resin to be formed and a resin to form a hologram layer. Moreover, it can also form using resin which has a functional group which can react with resin which forms each of a peeling layer and a hologram layer. Furthermore, you may form using resin with good wettability with respect to the surface like a urethane resin and an epoxy resin.

  Further, when the hologram layer is formed, for example, when an ultraviolet curable resin is used for the hologram layer, the release layer may be deteriorated or deteriorated due to ultraviolet irradiation. In the present invention, the total thickness of the release layer and the hologram layer in the bonded portion is reduced to a predetermined thickness, and the release layer is deteriorated or altered by the influence of ultraviolet irradiation or the like, so that the release layer and the substrate On the other hand, by increasing the total thickness of the release layer and the hologram layer at the release part to a predetermined thickness and suppressing the influence of ultraviolet irradiation etc., the deterioration or alteration of the release layer is prevented. ing.

  As described above, in the present invention, the effect on the release layer due to ultraviolet irradiation or the like is utilized, and it is preferable to appropriately select the ultraviolet irradiation amount, but it is difficult to adjust the ultraviolet irradiation amount. In some cases, an ultraviolet absorber can be added to the adhesion improving layer to control the effect of ultraviolet irradiation on the degradation or alteration of the release layer. In this case, by irradiating ultraviolet rays from the hologram layer side, the ultraviolet absorber contained in the adhesion improving layer absorbs the irradiated ultraviolet rays, so that the peeling layer formed under the adhesion improving layer is affected by the ultraviolet rays. Less.

  As such an ultraviolet absorber, those described in the column of the release layer can be used.

(2) Primer layer In the present invention, a primer layer may be provided between the reflective layer and the adhesive layer. This primer layer is a layer for compensating for a decrease in the adhesive force between the reflective layer and the adhesive layer when the reflective layer is a metal or metal oxide.

  The material used for the primer layer is preferably selected in consideration of the materials for the adhesive layer and the reflective layer. For example, a resin having good wettability with respect to the surface, such as a urethane resin or an epoxy resin used for the adhesion improving layer, can be used.

  Further, such a primer layer may be provided between the reflective layer and the hologram layer in order to compensate for a decrease in the adhesive force between the reflective layer and the hologram layer.

B. Method for Producing Hologram Brittle Seal Next, a method for producing the hologram brittle seal of the present invention will be described.

The method for producing a hologram brittle seal of the present invention includes a release layer forming step of forming a release layer on a substrate, a hologram layer forming step of forming a hologram layer on the release layer, and a reflective layer on the hologram layer. A method for producing a hologram brittle seal, comprising: forming a reflective layer; and forming an adhesive layer on the reflective layer.
In the release layer forming step and the hologram layer forming step, the release layer and the hologram layer have a total thickness of the release layer and the hologram layer in an adhesive portion, and a total thickness of the release layer and the hologram layer in the release portion. It is formed to be thinner,
The adhesive strength adjustment process is performed such that the adhesive strength between the release layer and the base material in the adhesive portion is greater than the adhesive strength between the release layer and the base material in the release portion. It is.

  A method for producing the hologram brittle seal of the present invention will be described with reference to the drawings. FIG. 6 is a process diagram showing an example of a method for producing a hologram brittle seal according to the present invention. As shown to Fig.6 (a), the peeling layer 2 is first formed on the base material 1 (peeling layer formation process). Next, the hologram layer 3 is formed on the release layer 2 (FIG. 6B, hologram layer forming step). In the peeling layer forming step and the hologram layer forming step, the peeling layer 2 and the hologram layer 3 are formed such that the total thickness of the peeling layer 2 and the hologram layer 3 in the bonding portion 6 is the same as that of the peeling layer 2 and the hologram layer 3 in the peeling portion 7. It is formed to be thinner than the total thickness. Further, the reflective layer 4 is formed on the hologram layer 3 (FIG. 6C, reflective layer forming step). Finally, an adhesive layer 5 is formed on the reflective layer 4 (FIG. 6D, adhesive layer forming step).

  Moreover, in this invention, in the said hologram layer formation process or the said reflection layer formation process, the adhesive strength of the peeling layer 2 and the base material 1 in the adhesion part 6 is the peeling layer 2 and the base material 1 in the peeling part 7. Adhesive strength adjustment processing is performed so as to be larger than the adhesive strength. This adhesive strength adjustment process will be described below.

  That is, for example, when the reflective layer is formed by a vapor deposition method, the release layer formed under the reflective layer deteriorates or deteriorates due to heat generated by the vapor generated from the reflective layer forming material, and the base material and the release layer In some cases, the adhesive strength of the material increases. In addition, when the material for forming the hologram layer is, for example, an ionizing radiation curable resin, the release layer may be deteriorated or deteriorated by irradiation with ionizing radiation when forming the hologram layer. Such an influence by heat or ionizing radiation is considered to depend on the thickness of the release layer and the hologram layer. Therefore, in the present invention, by making the total thickness of the release layer and the hologram layer different in the adhesive portion and the release portion, the adhesive strength between the release layer and the substrate in the adhesive portion is such that the release layer and the base in the release portion are the same. The adhesive strength can be adjusted so as to be larger than the adhesive strength with the material.

  In the present invention, the partial change in the adhesive strength between the release layer and the substrate by performing the above-described treatment such as heating or ionizing radiation irradiation is referred to as an adhesive strength adjustment treatment.

  Here, a state after the hologram brittle seal of the present invention is attached to an adherend and peeled off will be described with reference to the drawings. FIG. 3 is an explanatory diagram for explaining a state after the adhesive layer 5 of the hologram brittle seal of the present invention is attached to the adherend 8 and peeled off. As described above, in the hologram brittle seal of the present invention, the total thickness of the peeling layer 2 and the hologram layer 3 in the bonding portion 6 is thinner than the total thickness of the peeling layer 2 and the hologram layer 3 in the peeling portion 7. Since the total thickness of the release layer 2 and the hologram layer 3 is thin at the adhesive portion 6, the release layer 2 deteriorates or deteriorates due to heat when the reflective layer 4 is formed on the hologram layer 3, and the release layer 2 and the base material 1. Adhesive strength is improved. On the other hand, since the total thickness of the peeling layer 2 and the hologram layer 3 is thick at the peeling portion 7, the peeling layer 2 is hardly affected by heat when the reflective layer 4 is formed on the hologram layer 3, and the peeling layer 2 is substantially deteriorated or deteriorated. There is no alteration. Therefore, when the hologram brittle seal of the present invention is attached to the adherend 8 and peeled off, the adhesive force between the substrate 1 and the release layer 2 is increased at the adhesive portion 6, and therefore the adherend 8 and the adhesive layer 5 In the peeling portion 7, there is no change in the adhesive force between the base material 1 and the peeling layer 2, and the adhesive strength is weak, so that the peeling occurs between the base material 1 and the peeling layer 2. Thereby, since the hologram layer 3 is partially destroyed, a hologram brittle seal having an anti-counterfeit effect can be obtained.

Further, according to the present invention, since the brittle pattern can be easily formed by controlling the total thickness of the release layer and the hologram layer, there is an advantage that the manufacturing process is simple. Further, since the brittle pattern cannot be visually observed, there is an advantage that the effect of preventing forgery is high.
Hereinafter, each process of the manufacturing method of such a hologram brittle seal will be described.

1. Release layer forming step In the method for producing a hologram brittle seal of the present invention, a release layer forming step of forming a release layer on a substrate is performed.

  In the present invention, in the present step and the hologram layer forming step described later, in the release layer and the hologram layer, the total thickness of the release layer and the hologram layer in the bonded portion is thinner than the total thickness of the release layer and the hologram layer in the release portion. It is formed as follows.

  Note that the material, thickness, and the like of the release layer used in this step are the same as those described in the column of the release layer in “A. Hologram brittle seal” described above, and thus the description thereof is omitted here.

  Examples of the method for forming the release layer include a method in which a release layer-forming coating solution is applied on a substrate and dried.

  When applying the release layer forming coating solution, a solvent can be added as necessary. As such a solvent, the solvent generally used for the material of the peeling layer mentioned above can be used, for example, organic solvents, such as alcohol, and water are mentioned.

  As a coating method, methods such as a spin coater, a gravure coater, a comma coater, and a bar coater can be used.

  In the present invention, when applying the peeling layer forming coating liquid, by partially changing the depth of the coating plate, it is possible to change the thickness of the peeling layer in the adhesive portion and the peeling portion, In the method for producing a hologram brittle seal of the present invention, the hologram brittle seal can be efficiently produced without an increase in production steps. In addition, since the brittle pattern can be formed by changing the thickness of at least one of the release layer and the hologram layer, the brittle pattern is not visible and has an advantage of high anti-counterfeit effect.

2. Hologram Layer Formation Step Next, the hologram layer formation step in the present invention will be described. In the hologram brittle seal manufacturing method of the present invention, a hologram layer forming step of forming a hologram layer on the release layer is performed.

  In the present invention, in the release layer forming step and the present step, the release layer and the hologram layer are such that the total thickness of the release layer and the hologram layer in the bonded portion is thinner than the total thickness of the release layer and the hologram layer in the release portion. Is formed.

  In addition, since the formation material, thickness, etc. of the hologram layer used in this step are the same as those described in the column of the hologram layer of “A. Hologram brittle seal” described above, description thereof is omitted here.

  In the present invention, the hologram layer is formed by first applying a coating solution for forming a hologram layer having a resin, an additive, or the like described in the column of the hologram layer of “A. It is applied by a general coating means and dried as necessary to form a hologram forming layer. Moreover, the layer for hologram formation may be formed by inject | pouring a resin composition between base materials, such as two glass plates, for example. Next, for example, an original plate on which irregularities are formed is used as a press die, and this original plate is pressure-bonded to the hologram forming layer, irregularities are formed on the surface of the hologram forming layer, and interference fringes are recorded. Further, the hologram layer is formed by curing the hologram forming layer.

  Thus, the method of recording the interference fringes of the hologram as a relief with surface irregularities is particularly preferable in that it is mass-productive and the cost can be reduced.

  In addition to the above method, the photosensitive material described in the column of hologram layer of “A. Hologram brittle seal” described above is applied onto a substrate, the original is overlaid, and the photosensitive material is irradiated with ultraviolet rays or the like. Can be cured to form a hologram layer.

  The above-mentioned hologram layer forming coating solution may use a solvent as necessary at the time of coating. Examples of such solvents include acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, benzene, toluene, xylene, chlorobenzene, tetrahydrofuran, methyl cellosolve, ethyl cellosolve, methyl cellosolve acetate, ethyl cellosolve acetate, ethyl acetate, 1,4- Dioxane, 1,2-dichloroethane, dichloromethane, chloroform, methanol, ethanol, isopropanol and the like can be used. These solvents may be used alone or in combination of two or more.

  In addition, as a method for applying the hologram layer forming coating solution, methods such as a spin coater, a gravure coater, a comma coater, and a bar coater can be used.

  In the present invention, when applying the hologram layer forming coating solution, as described above, the depth of the coating plate is partially changed to change the thickness of the hologram layer at the bonded portion and the peeled portion. Therefore, the hologram brittle seal can be efficiently produced without increasing the number of production steps in the method for producing the hologram brittle seal of the present invention. In addition, since the brittle pattern can be formed by changing the thickness of at least one of the release layer and the hologram layer, the brittle pattern is not visible and has an advantage of high anti-counterfeit effect.

Although is appropriately selected depending on the application and type of hologram layer, the coating amount of the hologram layer forming coating solution is in the range of usually ^{1g / m 2 ~100g / m 2} .

  Here, as described above, the relief hologram is used, for example, as an original press mold having irregularities formed thereon, and this original plate is pressure-bonded to the hologram forming layer, and irregularities are formed on the surface of the hologram forming layer. Is to be recorded. As a method of recording such interference fringes, a generally used method can be used. For example, an original plate made of fine irregularities having specific information is produced by an optical projection method, and a nickel press plate duplicated from the original plate is used. A so-called embossing method can be used in which the press plate is heated and pressed against the hologram forming layer to replicate the unevenness.

  When producing the original plate, the laser light normally used in a holographic exposure apparatus records the desired irregularities by exposure with light having excellent coherence (for example, light having a wavelength of 300 nm to 1200 nm). As the laser beam, a visible laser, for example, an argon ion laser (458 nm, 488 nm, 514.5 nm), a krypton ion laser (647.1 nm), a helium-neon laser (633 nm), a YAG laser (532 nm), or the like is used. Can do.

  In addition, when the hologram layer contains an ionizing radiation curable resin, a method of irradiating and curing ionizing radiation such as ultraviolet rays at the time of embossing and / or after embossing can be used in order to maintain the uneven shape. .

  In the present invention, in this step, an adhesive strength adjustment treatment may be performed such that the adhesive strength between the release layer and the substrate in the adhesive portion is greater than the adhesive strength between the release layer and the substrate in the release portion. . For example, when an ionizing radiation curable resin is used as the material for forming the hologram layer, the adhesive strength between the release layer and the substrate at the bonded portion is peeled off by irradiation with ionizing radiation when the ionizing radiation curable resin is cured. It can process so that it may become larger than the adhesive strength of the peeling layer and base material in a part. That is, since the total thickness of the release layer and the hologram layer is thin at the adhesive portion by irradiation with ionizing radiation, the release layer is deteriorated or deteriorated, and the adhesive force between the release layer and the substrate can be improved. Moreover, since the total thickness of the peeling layer and the hologram layer is thick at the peeling portion, the influence of irradiation with ionizing radiation can be suppressed. Thereby, the adhesive strength of the base material and peeling layer in an adhesion part and a peeling part can be adjusted.

  Moreover, as the irradiation amount when irradiating with ionizing radiation, the release layer of the adhesive portion may be deteriorated or altered, but it is preferable that the release layer in the release portion is not deteriorated or altered.

3. Next, the reflective layer forming step in the present invention will be described. In the hologram brittle seal manufacturing method of the present invention, a reflection layer forming step of forming a reflection layer on the hologram layer is performed.

  In the present invention, as a method for forming the reflective layer, generally used methods such as sublimation, vacuum deposition, sputtering, reactive sputtering, ion plating, and electroplating can be used.

  In the present invention, in this step, the adhesive strength between the release layer and the base material in the adhesive portion becomes larger than the adhesive strength between the release layer and the base material in the adhesive portion due to heat at the time of forming the reflective layer. An adhesive strength adjustment process may be performed.

  For example, when the reflective layer is formed by a vapor deposition method such as vacuum deposition or sputtering, the release layer formed under the reflective layer deteriorates or deteriorates due to heat generated by the vapor generated from the reflective layer forming material, and the base material In some cases, the adhesive strength between the adhesive layer and the release layer increases. The effect of heat during the formation of the reflective layer is thought to depend on the thickness of the release layer and the hologram layer. If the thickness of the release layer and the hologram layer is thin, the effect of heat generated by the vapor generated from the reflective layer forming material is affected. Although it is easy to receive and a peeling layer is easy to deteriorate or change in quality, when the thickness of a peeling layer and a hologram layer is thick, it is hard to receive the influence by said heat and can suppress deterioration or quality change of a peeling layer. Therefore, in the present invention, by reducing the total thickness of the release layer and the hologram layer at the adhesive portion to a predetermined thickness, the adhesive force between the release layer and the substrate is improved, and the release layer at the release portion and By increasing the total thickness of the hologram layer to a predetermined thickness, the influence of heat during formation of the reflective layer is suppressed. Thereby, the adhesive strength of the base material and peeling layer in an adhesion part and a peeling part can be adjusted.

  The heat generated by the vapor generated from the material for forming the reflective layer during the formation of the reflective layer varies depending on the material, but is usually about 800 ° C to 1200 ° C.

  Further, the influence of heat at the time of forming the reflective layer also varies depending on the thickness of the reflective layer. If the thickness of the reflective layer is large, the amount of heat generated by the vapor generated from the material for forming the reflective layer increases, which greatly affects the deterioration or alteration of the release layer. Therefore, the thickness of the reflective layer may be such that the release layer at the adhesive portion is deteriorated or altered, but the thickness is preferably such that the release layer at the release portion is not deteriorated or altered.

  The formation material, film thickness, and the like of the reflective layer are the same as those described in the column of the reflective layer in “A. Hologram brittle seal” described above, and thus the description thereof is omitted here.

4). Next, the adhesive layer forming step in the present invention will be described. In the method for producing a hologram brittle seal according to the present invention, an adhesive layer forming step of forming an adhesive layer on the reflective layer is performed.

  Examples of the method for forming the adhesive layer include a method in which an adhesive layer-forming coating solution is applied on the reflective layer and dried.

  When applying the adhesive layer-forming coating solution, a solvent can be added as necessary. As such a solvent, the solvent generally used for the formation material of an adhesive layer can be used, for example, organic solvents, such as alcohol, and water are mentioned.

  As a coating method, methods such as a spin coater, a gravure coater, a comma coater, and a bar coater can be used.

  In addition, since it is the same as that of what was described in the column of the adhesive layer of "A. hologram brittle seal" mentioned above about the formation material of an adhesive layer, description here is abbreviate | omitted.

5). Others The hologram brittle seal of the present invention may be produced by sequentially laminating the base material, the hologram layer, the reflective layer and the adhesive layer, respectively, but each member is prepared by an independent process, It may be manufactured by laminating these.

  For example, a method of preparing a hologram layer in which interference fringes are recorded, a base material on which a release layer is formed, a reflective layer and an adhesive layer, and laminating them are listed. When each member is prepared by an independent process, for example, a release layer can be formed on a substrate by a dry process, etc., which is preferable in terms of using various materials and manufacturing efficiency. It can be.

  Further, for example, a member in which a release layer is formed on the base material and interference fringes are recorded on the hologram layer, a reflective layer, and an adhesive layer are prepared and laminated. In this case, the hologram layer-forming coating solution for forming the hologram layer described above is applied onto the support, and is cured by, for example, overlaying the original plate and irradiating ultraviolet rays or the like to record the unevenness, and the substrate and the peeling Laminate with layers. Then, the said support body is peeled, a reflection layer is formed, Furthermore, it can be set as the method of laminating | stacking, for example, heating an adhesive layer at 100 to 180 degreeC.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

  Hereinafter, the present invention will be specifically described using examples and comparative examples.

[Example 1]
Using a 25 μm thick polyethylene terephthalate (PET) film (manufactured by Toray Industries, Inc., Lumirror) as a base material, a release layer, a hologram layer, a reflective layer, and an adhesive layer were sequentially formed on one side of the PET film under the following conditions. And a hologram brittle seal was produced.

(Formation of release layer)
On the PET film, the coating liquid having the following composition is subjected to gravure coating, and the thickness of the adhesive part when dried is 0.5 μm, and the peeled part is dried when the gravure plate has a different number of lines (depth). The film was applied to a film thickness of 1.2 μm and dried to form a release layer.
Norbornene resin (manufactured by Nippon Synthetic Rubber Co., Ltd., Arton G) 40 parts by weight Acrylic polyol resin 10 parts by weight Methyl ethyl ketone / toluene (mass ratio 2/8) 50 parts by weight

(Formation of hologram layer)
On the release layer, a coating solution having the following composition was applied by gravure coating so that the film thickness at the time of drying was 3.0 μm and dried to form a hologram forming layer. The nickel press plate on which the concavo-convex pattern of the hologram was formed and the hologram forming layer were overlapped and heated and pressed to form concavo-convex portions on the hologram forming layer to form a hologram layer.
Acrylic resin 100 parts by weight Urethane acrylate 25 parts by weight Silicone 1 part by weight Photopolymerization initiator 5 parts by weight Methyl ethyl ketone 100 parts by weight

(Formation of reflective layer)
On the hologram layer, TiO ₂ was deposited by vacuum deposition to form a reflective layer having a thickness of 50 nm.

(Formation of adhesive layer)
On the reflective layer, an adhesive having the following composition was applied in a dry state so that the coating amount was 15 g / m ² to form an adhesive layer.
Acrylic copolymer (manufactured by Soken Chemical Co., Ltd., SK Dyne 1310L) 48 parts by weight Epoxy resin (manufactured by Soken Chemical Co., Ltd., curing agent E-AX) 0.36 parts by weight Ethyl acetate 51.64 parts by weight

  Furthermore, a release sheet (release layer) shown below was laminated on the surface of the adhesive layer so as to face each other, thereby producing a hologram brittle seal.

<Release sheet>
As the substrate, a biaxially stretched polyethylene terephthalate film subjected to surface corona treatment, a film having microvoids inside the substrate, a film made by Toyobo Co., Ltd., Crisper G2311, and a thickness of 38 μm was used. On this substrate, a release layer having the following composition was formed by gravure printing using a cell plate at a coating amount of 0.1 g / m ^{2 in} a dry state, and a smoothing roll having a flat surface in front of a drying hood was formed. It was applied to the surface of the release layer.
Addition polymerization type silicone (manufactured by Shin-Etsu Chemical Co., Ltd., KS847H) 100 parts by weight Toluene 200 parts by weight

[Example 2]
(Formation of release layer)
On a 25 μm-thick PET film (manufactured by Toray Industries, Inc., Lumirror), a coating liquid having the same composition as in Example 1 was applied by gravure coating so that the film thickness upon drying would be 1.0 μm. And dried to form a release layer.

(Formation of hologram layer)
A coating liquid having the same composition as that of Example 1 was applied on the release layer by gravure coating, and the thickness of the adhesive portion when dried was 2.4 μm depending on the number of lines (depth) of the gravure plate. The coating was applied so that the film thickness at drying was 3.2 μm, and dried to form a hologram forming layer. The nickel press plate on which the concavo-convex pattern of the hologram was formed and the hologram forming layer were overlapped and heated and pressed to form concavo-convex portions on the hologram forming layer to form a hologram layer.

(Production of hologram brittle seal)
A reflective layer and an adhesive layer were sequentially formed on the hologram layer in the same manner as in Example 1 to produce a hologram brittle seal.

[Comparative Example 1]
A hologram brittle seal was produced in the same manner as in Example 1 except that the thickness of the release layer at the adhesive portion was 1.0 μm and the thickness of the release layer at the release portion was 1.2 μm.

[Comparative Example 2]
The hologram brittle seal was obtained in the same manner as in Example 1 except that the thickness of the release layer at the adhesive portion was 0.4 μm, the thickness of the release layer at the release portion was 0.9 μm, and the thickness of the hologram layer was 2.5 μm. Produced.

[Evaluation]
Table 1 shows the observation results of the brittleness of the hologram brittle seals of Examples 1 and 2 and Comparative Examples 1 and 2.

(Brittleness)
○: When the hologram brittle seal is attached to the adherend and peeled off, the hologram layer is destroyed.
X: Even if the hologram brittle seal is attached to the adherend and peeled off, the hologram layer is not destroyed.

  When the hologram brittle seals of Examples 1 and 2 were attached to an adherend and peeled off, the hologram layer was destroyed, so that the hologram brittle seal could not be replaced. On the other hand, when the hologram brittle seal of Comparative Example 1 was applied to the adherend and peeled off, it was peeled off entirely between the release layer and the substrate, and the fraud prevention effect was not obtained. Further, when the hologram brittle seal of Comparative Example 2 was applied to the adherend and peeled off, the hologram brittle seal was totally peeled between the adhesive layer and the adherend, and the fraud prevention effect was not obtained.

It is a schematic sectional drawing which shows an example of the hologram brittle seal of this invention. It is a schematic sectional drawing which shows the other example of the hologram brittle seal of this invention. It is explanatory drawing explaining the state after affixing and peeling the hologram brittle seal of this invention on a to-be-adhered body. It is a schematic sectional drawing which shows an example of the state which affixed the hologram brittle seal of this invention on the to-be-adhered body. It is a schematic sectional drawing which shows the other example of the state which affixed the hologram brittle seal of this invention on the to-be-adhered body. It is process drawing which shows an example of the manufacturing method of the hologram brittle seal of this invention. It is a schematic sectional drawing which shows an example of the conventional hologram brittle seal. It is explanatory drawing explaining the state after affixing and peeling the conventional hologram brittle seal on a to-be-adhered body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Base material 2 ... Release layer 3 ... Hologram layer 4 ... Reflective layer 5 ... Adhesion layer 6 ... Adhesion part 7 ... Release part

Claims (6)

A base material, a release layer formed on the base material, a hologram layer formed on the release layer, a reflective layer formed on the hologram layer, and an adhesive layer formed on the reflective layer A hologram brittle seal having
The release layer and the hologram layer have an adhesive portion having a strong adhesive strength between the substrate and the release layer, and a release portion having a low adhesive strength between the substrate and the release layer,
A hologram brittle seal, wherein a total thickness of the peeling layer and the hologram layer in the adhesive portion is thinner than a total thickness of the peeling layer and the hologram layer in the peeling portion.   The total thickness of the release layer and the hologram layer in the adhesive portion is 3.5 μm or less, and the total thickness of the release layer and the hologram layer in the release portion is 4.0 μm or more. The hologram brittle seal according to 1.   3. The hologram brittle seal according to claim 1, wherein a thickness of the release layer in the adhesion portion is smaller than a thickness of the release layer in the release portion.   4. The hologram brittle seal according to claim 1, wherein a thickness of the hologram layer in the adhesion portion is smaller than a thickness of the hologram layer in the peeling portion. 5. A peeling layer forming step for forming a peeling layer on a substrate, a hologram layer forming step for forming a hologram layer on the peeling layer, a reflecting layer forming step for forming a reflecting layer on the hologram layer, and the reflecting layer An adhesive layer forming step of forming an adhesive layer on the hologram brittle seal manufacturing method,
In the release layer forming step and the hologram layer forming step, the release layer and the hologram layer have a total thickness of the release layer and the hologram layer in an adhesive portion, and a total thickness of the release layer and the hologram layer in the release portion. It is formed to be thinner,
The hologram is characterized in that an adhesive strength adjustment process is performed such that an adhesive strength between the release layer and the base material in the adhesive portion is larger than an adhesive strength between the release layer and the base material in the peel portion. A method of manufacturing a brittle seal. The total thickness of the release layer and the hologram layer in the adhesive portion is 3.5 μm or less, and the total thickness of the release layer and the hologram layer in the release portion is 4.0 μm or more. The method for producing a hologram brittle seal according to claim 5.

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