JPH05315793A - Carrier tape - Google Patents

Abstract

PURPOSE:To form storage parts with high-precision and to carry members simultaneously with their manufacture, by attaching a bottom-attaching-material film to the rear of a tape board having parts corresponding to the shape of members to be carried at specified intervals, and closing each punched part on its rear side and forming carrier member storage parts of depth corresponding to the thickness of a base material tape. CONSTITUTION:An adhesive tape 5 is attached to the rear of a biaxially- stretched polyester film having a release agent coated on one side as tape base material 1, excluding sprocket-hole-boring scheduled positions on longitudinal-direction both sides. The sprocket holes 4 and the storage parts 2 of carrier members are punched by a cutting die 12 and a sprocket cutting die 14. When the adhesive tape 5 is removed following that, the adhesive agent 5a is transferred to the rear of the tape base material 1 excluding punched-off parts by the cutting die 12. Then, a 2-axis drawn polyester film tape is attached as bottom attaching material 3. Consequently, it becomes possible to form thin recession with high-precision, and carry members of thin material thickness to a mounting machine precisely.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape for mounting members, and more particularly to a carrier tape suitable for manufacturing and supplying ultrathin members.

[0002]

2. Description of the Related Art Conventionally, when assembling a printed circuit board and other electronic parts, a carrier for continuously supplying each member to a mounting machine, which is an apparatus for disposing and mounting required members at predetermined positions, is a synthetic resin. A tape-shaped base material made of a material is used in which a recessed portion for accommodating a predetermined member is formed by embossing.

[0003] However, it is difficult to form a highly accurate dimension in the depression by molding, and it is difficult to accurately form a shallow depression. In addition, recently used members include those having an extremely small thickness, for example, solder chips and insulating films having a thickness of several tens of μm to 1 mm, which are supplied to a mounting machine so that the functions of the mounting machine can be sufficiently fulfilled. In order to achieve this, the storage portion of the carrier is also required to be extremely thin and highly accurate according to the shape and thickness of the member or chip to be conveyed. There was a problem that it was not possible to follow such demands. Further, the work of forming an ultrathin member and loading it on a carrier tape has a problem that the member is broken or damaged.

[0004]

The problem to be solved by the present invention is that the conventional carrier tape cannot provide a highly accurate member accommodating portion in order to supply an extremely thin member to the mounting machine. The point is that it cannot respond to the function of the mounting machine. Therefore, it is an object of the present invention to provide a carrier tape which solves this problem, a method for manufacturing the same, and a carrier tape on which an ultrathin member can be mounted at the same time as the manufacturing. ..

[0005]

In order to achieve the above object, the carrier tape of the present invention is formed by punching a tape base material into a shape corresponding to the shape of a conveying member and attaching a bottom sticking material to the back surface of the carrier tape. By forming the storage portion for the member to be formed, a highly accurate storage portion can be obtained for the transport member having an extremely thin thickness, and the solution or fluid material raw material is coated on the entire surface of the carrier tape, By removing the raw materials other than the member storage portion with a doctor or a squeegee and performing dry molding, it is possible to manufacture the member and mount it on the carrier tape at the same time.

As a method of manufacturing such a carrier tape, an adhesive tape having a pressure-sensitive adhesive layer formed on the peeled film or sheet surface is attached to the back surface of the tape base material, and necessary punching is performed in that state. After that, the method of peeling the adhesive tape and then applying the bottom patch using the adhesive transferred to the back surface of the tape substrate is preferable. In addition,
Various films such as biaxially oriented polyester, polycarbonate, biaxially oriented polypropylene, polyvinyl chloride, polyimide, polyfluoroethylene, and polyethylene sulfide can be used as the tape base material and the bottom sticking material.
Further, it is preferable that one surface of the tape base material is subjected to a peeling process.

[0007]

Example 1 As a tape substrate 1, a biaxially stretched polyester film 25 μm coated on one side with a release agent of 1 μm was removed, and the adhesive tape 5 was attached to the back side of the longitudinal sprocket holes on both side edges. The storage member 2 for the conveying member and the sprocket hole 4 are punched by the punching die 12 and the sprocket punch 14 for punching the storing member 2 for the conveying member. Next, when the adhesive tape 5 is peeled off, the adhesive 5a is transferred to the back surface of the tape substrate 1 except for the portion punched out by the die 12. Then, a tape of 25 μm biaxially stretched polyester film is stuck as the bottom sticking material 3 to obtain the carrier tape of the present invention.

[0008]

Example 2 Solder paste 6 was applied on the carrier tape of Example 1 in a width of 100 according to the film width of the bottom patch 3.
Coat to a thickness of μm. Next, the doctor paste 7 is applied from above the carrier tape coated with the solder paste so that the solder paste leaves a thickness corresponding to the thickness of the tape base material and the thickness of the adhesive in the recess of the transport member storage unit 2, Mold the solder paste according to the shape of 2. Next, the carrier tape on which the solder paste was mounted was passed through an oven 8 at 60 ° C. and dried for 1 minute, whereby solder chips 6a could be manufactured on the carrier tape.

[0009]

As described above, in the carrier tape of the present invention, since the extremely thin recessed portion is formed with high precision, it is possible to accurately convey the thin member to the mounting machine. Further, according to the method of the present invention, an extremely thin dented portion of about several tens of μm to 1 mm can be obtained by selecting the thickness of the tape base material, and the shape and the size can also meet severe requirements by integrally punching with the adhesive tape. Moreover, by manufacturing the member on the carrier tape, the labor of manufacturing the member in a separate step and setting it on the carrier tape can be omitted.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a carrier tape of the present invention.

FIG. 2 is an enlarged cross-sectional view taken along the line AA ′ of FIG.

FIG. 3 is an explanatory diagram of a manufacturing process viewed from the direction of FIG.

FIG. 4 is an explanatory diagram of a manufacturing process viewed from the direction of FIG.

FIG. 5 is an explanatory view of the manufacturing process viewed from the direction of FIG.

FIG. 6 is an explanatory view of the manufacturing process viewed from the direction of FIG.

FIG. 7 is an explanatory diagram of the manufacturing process viewed from the direction of FIG. 2;

FIG. 8 is an explanatory diagram of forming and loading a conveying member.

[Explanation of symbols]

 1 Tape substrate 2 Conveying member storage part 3 Bottom adhesive 4 Sprocket hole 5 Adhesive tape 6 Solder paste 7 Doctor

Front page continued (72) Inventor Yoshiaki Kawazoe 1-4-16 Nihonbashi Bakurocho, Chuo-ku, Tokyo Fujimori Industry Co., Ltd.

Claims (3)

[Claims] 1. A base patch film is attached to the back surface of a tape base material provided with punching portions corresponding to the shapes of members conveyed at predetermined intervals, and each punching portion is closed on the back surface side to form a base. A carrier tape formed by forming a carrying member storage portion having a depth corresponding to the thickness of the material tape. 2. An adhesive tape having an adhesive layer formed on the surface of a release-processed film or sheet is attached to the back surface of a tape base material, leaving sprocket hole formation portions on both sides, and in that state, a sprocket hole is placed at a predetermined position. And punching a predetermined shape, peeling off the adhesive tape to transfer the adhesive layer to the back surface of the tape substrate, and then applying a bottom adhesive to the adhesive layer surface. A method for producing the carrier tape as described above. 3. A carrier tape on which a member to be conveyed is formed on the carrier tape according to claim 1 by mounting.