JPH02246395A - Forming method for wiring pattern to three-dimensional surface - Google Patents
Forming method for wiring pattern to three-dimensional surfaceInfo
- Publication number
- JPH02246395A JPH02246395A JP6826489A JP6826489A JPH02246395A JP H02246395 A JPH02246395 A JP H02246395A JP 6826489 A JP6826489 A JP 6826489A JP 6826489 A JP6826489 A JP 6826489A JP H02246395 A JPH02246395 A JP H02246395A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- wiring pattern
- adhesive
- transfer sheet
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 26
- 239000000853 adhesive Substances 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims abstract description 26
- 239000011888 foil Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000004080 punching Methods 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims abstract description 3
- 238000003825 pressing Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 12
- 239000011889 copper foil Substances 0.000 abstract description 12
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000002023 wood Substances 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 230000004048 modification Effects 0.000 abstract description 2
- 238000012986 modification Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、三次元形状を備えたケース等の表面にプリ
ント配線パターンを形成する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for forming a printed wiring pattern on the surface of a case or the like having a three-dimensional shape.
（従来の技術）
電子装置の筐体となるケース等の基体の三次元の面にプ
リント配線を施す場合、従来は、フレキシブルシートに
所望の配線パターンを形成してフレキシブルシートごと
基体表面に貼り付ける方法や、メツキやスクリーン印刷
によって配線パターンを基体表面に直接形成する方法が
知られている。(Prior art) When printing wiring on the three-dimensional surface of a base such as a case that serves as the housing of an electronic device, conventionally, a desired wiring pattern is formed on a flexible sheet and the flexible sheet is attached to the surface of the base. There are known methods for directly forming a wiring pattern on the surface of a substrate by plating or screen printing.
また、例えば特開昭６３−４４７９３号公報や特表昭６
３−５００７５８号公報に記載されているように、転写
シートに形成した配線パターンを金型に添着して基体を
成形することにより、成形された樹脂基体の表面に配線
パターンを形成する方法も提唱されている。Also, for example, Japanese Patent Application Laid-Open No. 63-44793 and Japanese Patent Application Publication No. 1983
As described in Publication No. 3-500758, a method of forming a wiring pattern on the surface of a molded resin base by attaching a wiring pattern formed on a transfer sheet to a mold and molding the base has also been proposed. has been done.
（発明が解決しようとする課題）
しかしフレキシブルシートを貼り付ける方法は、シート
の基材として高価なポリイミド樹脂等を用いる必要があ
り、特に広い面積の配線が必要な場合等には、コスト高
になる問題があった。また、メツキや印刷による方法は
、メンキレジストの形成や導体インクの印刷を三次元表
面に施すことができる専用の装置を設備しなければなら
ず、小ロフトの生産には適していない問題があった。更
に基体成形時に配線パターンをモールデングする方法は
、基体が射出成形可能な樹脂製品に限定され、木製や紙
製のケースなどには採用できないこと、成形後の配線パ
ターンの修正や変更がきわめて困歎であること、転写シ
ートが射出成形時の熱や圧力に耐え得る材質のものに限
定されるために簡易に実施できないこと、成形時と常温
との大きな温度差のために転写シート、基体樹脂及び銅
箔パターン相互の熱膨張係数の違いに起因して配線パタ
ーンにしわや狂いが発生し、配線パターンの位置精度や
接着強度が低下する等の問題があった。(Problem to be solved by the invention) However, the method of pasting flexible sheets requires the use of expensive polyimide resin as the base material of the sheet, which can lead to high costs, especially when wiring over a large area is required. There was a problem. In addition, methods using plating or printing require the installation of specialized equipment that can form a coating resist and print conductive ink on three-dimensional surfaces, making them unsuitable for small loft production. . Furthermore, the method of molding the wiring pattern during base molding is limited to resin products whose base can be injection molded, and cannot be used for cases made of wood or paper, and it is extremely difficult to modify or change the wiring pattern after molding. The transfer sheet cannot be easily implemented because it is limited to materials that can withstand the heat and pressure during injection molding, and there is a large temperature difference between the transfer sheet and base resin during molding and room temperature. Also, due to differences in thermal expansion coefficients between the copper foil patterns, wrinkles and misalignment occur in the wiring pattern, resulting in problems such as a decrease in positional accuracy and adhesive strength of the wiring pattern.
この発明は、上記の問題に鑑みてなされたものであって
、特殊な材料を用いず、ロフト数の少ない製品にも経済
的且つ簡易に実施可能で、基体の材質が樹脂は勿論、木
や紙であっても実施可能で、−旦形成した配線パターン
の修正や変更も比較的容易にできる方法を提供すること
を課題としている。This invention was made in view of the above problems, and can be implemented economically and easily even for products with a small number of lofts without using special materials. It is an object of the present invention to provide a method that can be implemented even on paper and allows relatively easy modification or change of a wiring pattern once formed.
（課題を解決するための手段）
この発明の配線パターンの形成方法は、三次元形状の表
面を備えた基材、例えば電子機器のケースの内表面等に
配線パターンを形成する方法において、まず粘着剤塗布
面を備えた転写シート２の当該粘着面に銅箔やアルミニ
ウム箔等の金属箔３を貼着し、エツチングないしプレス
打ち抜きにより所望のパターン部分以外の部分の金属箔
を除去して転写シート上に金属箔パターン４を形成し、
該パターン形成面に感圧ないし感熱接着剤を塗布し、こ
の接着剤塗布面を配線パターンを形成しようとするケー
スその他の基体ｌの表面に添着して加圧ないし加熱し、
その後転写シートを剥離することを特徴とするものであ
る。(Means for Solving the Problems) The method for forming a wiring pattern of the present invention is a method for forming a wiring pattern on a base material having a three-dimensional surface, such as the inner surface of a case of an electronic device. A metal foil 3 such as copper foil or aluminum foil is pasted on the adhesive surface of the transfer sheet 2 provided with the agent-coated surface, and the metal foil in areas other than the desired pattern area is removed by etching or press punching to form a transfer sheet. forming a metal foil pattern 4 on top;
A pressure-sensitive or heat-sensitive adhesive is applied to the pattern-forming surface, and the adhesive-coated surface is attached to the surface of a case or other substrate l on which a wiring pattern is to be formed and pressurized or heated;
The method is characterized in that the transfer sheet is then peeled off.
上記転写シート２としては、通常使用されている感圧粘
着テープ等と同様な材質のものを用いることができる。The transfer sheet 2 may be made of the same material as commonly used pressure-sensitive adhesive tapes.
転写シート２に貼着した金属箔３にプレス打ち抜きによ
り金属箔パターン４を°形成する実施態様は、大量生産
の場合に適しており、鋭利なカッタにより金属箔のみを
切断して不要部分の金属箔を転写シートから機械的に剥
離する方法である。金属箔パターン４を転写シート２が
ら基体１の表面に転写する際に用いる接着剤としては、
例えばエポキシ樹脂を主成分とする接着剤を用いること
ができ、比較的低温の加熱で金属箔パターン４を基体側
に強固に接着することができる。The embodiment in which the metal foil pattern 4 is formed by press punching on the metal foil 3 attached to the transfer sheet 2 is suitable for mass production, and only the metal foil is cut with a sharp cutter to remove unnecessary parts of the metal. This method involves mechanically peeling the foil from the transfer sheet. The adhesive used when transferring the metal foil pattern 4 from the transfer sheet 2 to the surface of the base 1 is as follows:
For example, an adhesive containing epoxy resin as a main component can be used, and the metal foil pattern 4 can be firmly bonded to the substrate side by heating at a relatively low temperature.
形成した配線パターン５の修正や変更が予想される場合
には、接着剤として比較的強度の小さい感圧型の接着剤
（接着剤は、粘着剤が含を含む意味で用いている。）を
用いるのが好ましい。この場合には、転写シート２に対
する金属箔３の付着力よりも基体ｌに対する付着力のほ
うが大きくなるように転写シートの材質を基体の材質を
勘案して決定するメ・要がある。If it is anticipated that the formed wiring pattern 5 will be modified or changed, a relatively low-strength pressure-sensitive adhesive (the term ``adhesive'' is used to include the term ``adhesive'') is used as the adhesive. is preferable. In this case, it is necessary to determine the material of the transfer sheet in consideration of the material of the substrate so that the adhesive force of the metal foil 3 to the transfer sheet 2 to the substrate 1 is greater than that of the metal foil 3 to the substrate 1.
（作用）
上記方法は、転写シート２に形成した金属箔パターン４
を基体１の表面に転写する方法を採用しているので、高
価な設備を必要とせず、小ロフトの製品にも簡易に実施
できる。また、配線パターン５を接着剤で基体表面に貼
着するものであるから、基体１の材質に合わせて適当な
接着剤を用いることにより、基体１や配線パターン５に
障害を与えるような加熱ないし加圧工程を経ないで任意
の材質の基体表面に配線パターンを形成することができ
、射出成形される樹脂成形品のみでなく、木製や紙製の
基体表面にも容易に配線パターンを形成できる。更に、
転写シートや金属箔や基体に苛酷な熱ストレスを与える
工程を含まないから、−船釣な材質のものを用いること
ができ、汎用性が高く、経済的である。(Function) The above method is based on the metal foil pattern 4 formed on the transfer sheet 2.
Since a method is adopted in which the image is transferred onto the surface of the base 1, expensive equipment is not required and it can be easily applied to products with small lofts. Furthermore, since the wiring pattern 5 is attached to the surface of the substrate with an adhesive, it is possible to avoid heating or damaging the substrate 1 or the wiring pattern 5 by using an appropriate adhesive depending on the material of the substrate 1. A wiring pattern can be formed on the surface of a substrate made of any material without going through a pressure process, and wiring patterns can be easily formed not only on injection molded resin molded products but also on the surface of wooden and paper substrates. . Furthermore,
Since it does not involve a process that applies severe thermal stress to the transfer sheet, metal foil, or substrate, it is possible to use materials made of suitable materials, making it highly versatile and economical.
（実施例）
図はこの発明の一実施例を示したもので、１は電子装置
のケース、即ち配線パターンを形成しようとする基体、
２は転写シート、３は銅箔、４は転写シート上に形成し
たｗ４箔パターン、５はケース１の内表面に形成した配
線パターン、６は配線パターン５にハンダ付けした部品
、１１は挟圧ローラ装置、１２は接着剤塗布用の刷毛で
ある。(Embodiment) The figure shows an embodiment of the present invention, in which 1 is a case of an electronic device, that is, a base on which a wiring pattern is to be formed;
2 is a transfer sheet, 3 is a copper foil, 4 is a W4 foil pattern formed on the transfer sheet, 5 is a wiring pattern formed on the inner surface of the case 1, 6 is a component soldered to the wiring pattern 5, 11 is a clamping pressure The roller device 12 is a brush for applying adhesive.
第１図ないし第６図は、この発明の方法を工程順に示し
ており、まず形成しようとする配線パターンの全体を包
含する形状に転写シート２を切断し、それと略同形の銅
箔３を転写シート２の粘着剤塗布面に添設して、挟着ロ
ーラ装置１１を通過させ、銅箔３を転写シート２に接着
する（第１図）。次に、公知のフォトエツチング法によ
り、転写シート上の銅箔に配線パターンを印写し、不要
の銅箔を溶剤により除去して、所定の銅箔パターン４を
形成する（第２図）。次にこのパターン形成面に接着剤
を刷毛１２で塗布しく第３図）、この接着剤塗布面をケ
ース１の内面の所定箇所に貼り付ける（第４図）。接着
剤が感熱性のものであれば、第４図の状態で加温し、感
圧性のものであれば、転写シート２の背面を万遍なく押
圧してケース１に接着する。その後転写シート２を剥が
してやれば、第５図に示すように、転写シート２上のｗ
４箔パターン４は、ケースｌの表面に転写される。転写
シート２の剥離は、転写シート２に塗布されていた粘着
剤層が眉間剥離することによって行われるから、第３図
の工程で塗布した接着剤が硬化しても、転写シート２の
剥離に障害を起こすことはない。転写シート２を剥離し
た後、必要があれば、ケース内表面や配線パターン５上
に付着している粘着剤を清掃除去し、配線パターン５に
必要な部品６をリフローハンダによりハンダ付けして、
製品を完成する。1 to 6 show the method of the present invention in the order of steps. First, a transfer sheet 2 is cut into a shape that encompasses the entire wiring pattern to be formed, and a copper foil 3 having approximately the same shape is transferred. The copper foil 3 is attached to the adhesive coated surface of the sheet 2 and passed through the nipping roller device 11 to adhere the copper foil 3 to the transfer sheet 2 (FIG. 1). Next, a wiring pattern is printed on the copper foil on the transfer sheet by a known photoetching method, and unnecessary copper foil is removed with a solvent to form a predetermined copper foil pattern 4 (FIG. 2). Next, an adhesive is applied to this pattern-formed surface with a brush 12 (FIG. 3), and this adhesive-coated surface is pasted on a predetermined location on the inner surface of the case 1 (FIG. 4). If the adhesive is heat-sensitive, it is heated in the state shown in FIG. 4, and if it is pressure-sensitive, the back surface of the transfer sheet 2 is evenly pressed to adhere it to the case 1. After that, if the transfer sheet 2 is peeled off, as shown in FIG.
4 The foil pattern 4 is transferred onto the surface of the case l. Peeling of the transfer sheet 2 is performed by the adhesive layer applied to the transfer sheet 2 peeling off between the eyebrows, so even if the adhesive applied in the step of FIG. 3 hardens, the transfer sheet 2 will not peel off. It will not cause any trouble. After peeling off the transfer sheet 2, if necessary, clean and remove the adhesive adhering to the inner surface of the case or on the wiring pattern 5, and solder the parts 6 necessary for the wiring pattern 5 using reflow soldering.
Complete the product.
なお上記各工程における具体的操作は、実施例のものに
限定されないことは勿論であり、例えば転写シート２へ
の接着剤の塗布工程（第３図の工程）をローラによる自
動塗布工程とすることも勿論可能である。Note that the specific operations in each of the above steps are, of course, not limited to those in the examples. For example, the step of applying the adhesive to the transfer sheet 2 (step in FIG. 3) may be an automatic application step using a roller. Of course, it is also possible.
（発明の効果）
以上のこの発明の方法によれば、特別の設備や高価な資
材を用いることなく三次元形状を備えた基体の表面に配
線パターンを形成することができ、基体の材質も樹脂に
限定されることなく、木製や紙製の基体表面にも配線パ
ターンを形成できるから、汎用性が高く、経済的であり
、特に製品のロア）数が少ない場合にきわめて好適な方
法を°提供できる。(Effects of the Invention) According to the method of the present invention described above, a wiring pattern can be formed on the surface of a three-dimensional substrate without using special equipment or expensive materials, and the material of the substrate can also be resin. Since wiring patterns can be formed on the surface of substrates made of wood or paper without being limited to can.
また、この発明の方法により形成された配線パターンは
、基体成形時にモールディングにより形成されたもので
ないから、後で修正や変更を行うことも比較的容易であ
り、基体と転写シートとを個別に製作できるので、回路
の変更や改良等にも柔軟に対処でき、特に試作品や頻繁
に仕様変更が要求される電子装置に採用される方法とし
てきわめて有用である。Furthermore, since the wiring pattern formed by the method of the present invention is not formed by molding at the time of forming the base, it is relatively easy to modify or change it later, and the base and the transfer sheet are manufactured separately. Therefore, it is possible to flexibly deal with circuit changes and improvements, and is extremely useful as a method for use in prototypes and electronic devices that require frequent specification changes.
第１図ないし第６図は、この発明の方法を工程順に模式
的に示した説明図である。
図中、
にケース ２：転写シート
３：銅箔 ４：銅箔パターン５：配線パタ
ーン
第１図
第５図1 to 6 are explanatory diagrams schematically showing the method of the present invention in the order of steps. In the figure, Case 2: Transfer sheet 3: Copper foil 4: Copper foil pattern 5: Wiring pattern Figure 1 Figure 5
Claims (1)
（３）を貼着する工程と、エッチングないしプレス打ち
抜きにより所望のパターン部分以外の部分の金属箔を除
去する工程と、該工程により金属箔パターン（４）を形
成した面に感圧ないし感熱接着剤を塗布する工程と、該
接着剤塗布面を配線パターンを形成しようとするケース
その他の基材（１）の表面に向けて転写シート（２）を
添着する工程と、添着した転写シートを加圧ないし加熱
する工程と、基材表面から転写シート（２）を剥離する
工程とを上記順序で含んでなる、三次元表面への配線パ
ターンの形成方法。A process of pasting a metal foil (3) on the adhesive surface of a transfer sheet (2) coated with an adhesive, a process of removing the metal foil in areas other than the desired pattern area by etching or press punching, and A process of applying pressure-sensitive or heat-sensitive adhesive to the surface on which the metal foil pattern (4) is formed, and transferring the adhesive-coated surface to the surface of the case or other base material (1) on which the wiring pattern is to be formed. A method of applying a sheet (2) to a three-dimensional surface, comprising the steps of applying pressure or heating to the attached transfer sheet, and peeling off the transfer sheet (2) from the surface of the base material in the above order. How to form a wiring pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6826489A JPH02246395A (en) | 1989-03-20 | 1989-03-20 | Forming method for wiring pattern to three-dimensional surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6826489A JPH02246395A (en) | 1989-03-20 | 1989-03-20 | Forming method for wiring pattern to three-dimensional surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02246395A true JPH02246395A (en) | 1990-10-02 |
Family
ID=13368720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6826489A Pending JPH02246395A (en) | 1989-03-20 | 1989-03-20 | Forming method for wiring pattern to three-dimensional surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02246395A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012164912A (en) * | 2011-02-09 | 2012-08-30 | Toppan Printing Co Ltd | Wiring sheet for solar cell and manufacturing method of the wiring sheet for the solar cell, and solar cell module using the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5610995A (en) * | 1979-07-06 | 1981-02-03 | Alps Electric Co Ltd | Method of forming circuit board |
| JPS58115886A (en) * | 1981-12-29 | 1983-07-09 | 三菱電機株式会社 | Method of producing printed circuit board |
| JPS6034880A (en) * | 1983-05-13 | 1985-02-22 | イング・チイ・オリベツチ・アンド・チイ・エス・ピー・ア | Printer |
-
1989
- 1989-03-20 JP JP6826489A patent/JPH02246395A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5610995A (en) * | 1979-07-06 | 1981-02-03 | Alps Electric Co Ltd | Method of forming circuit board |
| JPS58115886A (en) * | 1981-12-29 | 1983-07-09 | 三菱電機株式会社 | Method of producing printed circuit board |
| JPS6034880A (en) * | 1983-05-13 | 1985-02-22 | イング・チイ・オリベツチ・アンド・チイ・エス・ピー・ア | Printer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012164912A (en) * | 2011-02-09 | 2012-08-30 | Toppan Printing Co Ltd | Wiring sheet for solar cell and manufacturing method of the wiring sheet for the solar cell, and solar cell module using the same |
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