JPH05315790A - Shield structure for printed circuit board - Google Patents

Shield structure for printed circuit board

Info

Publication number
JPH05315790A
JPH05315790A JP13987692A JP13987692A JPH05315790A JP H05315790 A JPH05315790 A JP H05315790A JP 13987692 A JP13987692 A JP 13987692A JP 13987692 A JP13987692 A JP 13987692A JP H05315790 A JPH05315790 A JP H05315790A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
metal plate
shield case
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13987692A
Other languages
Japanese (ja)
Inventor
Hiroichi Matsushita
博一 松下
Daisuke Koga
大輔 古賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Communication Equipment Co Ltd
Original Assignee
Toyo Communication Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Communication Equipment Co Ltd filed Critical Toyo Communication Equipment Co Ltd
Priority to JP13987692A priority Critical patent/JPH05315790A/en
Publication of JPH05315790A publication Critical patent/JPH05315790A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To protect noise generated by a part of a circuit installed on a printed circuit board from negatively affectiang a circuit installed on another printed circuit board by fixing the open edge of a shield case to the peripheral section of the metal plate protruded from the periphery of the printed circuit board on the surface of which the part of the circuit which generates the noise is installed and by electromagnetically sealing the circuit which generates the noise in the shield case. CONSTITUTION:In a circuit unit for a telecommunication apparatus, in which the first prianted circuit board 4 is loaded with a logic circuit, while the lower surface of the second printed circuit board is loaded with a telecommunication circuit, open edge 7a of a shield case 7 is fixed to the peripheral section of a metal plate 6 in order to cover the whole lower surface of the second printed circuit board 5. Namely, the open edge 7a of the shield case 7 is airtightly fixed onto the peripheral section of the metal plate 6 by soldering, screw fastening, or the like manner. By this, a shield room is formed inside the shield case 7, a noise generated by the telecommunication circuit installed in the shield room can be protected from influencing the logic circuit on the first printed circuit board 4.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はプリント基板上の各種電
子部品から発せられるノイズをシールドして他の回路に
対する干渉を防止し、又は外部のノイズがプリント基板
上の回路に混入することを防止するシールド構造の改良
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention shields noise emitted from various electronic parts on a printed circuit board to prevent interference with other circuits, or prevents external noise from entering the circuit on the printed circuit board. To improve the shield structure.

【0002】[0002]

【従来技術】従来から2枚のプリント基板の背面同士を
接合することにより表裏両面に回路を有するようにした
接合構造のプリント板が広く利用されている。図2は従
来の接合構造のプリント板ユニットを示し、このプリン
ト板ユニットは片面に回路パターンを有するとともに他
面全面に銅箔等の導体層を有した第1及び第2の基板
1、2の銅箔面3同士を接合一体化した構成を有する。
このような接合構造を有したプリント板ユニットを例え
ば通信機器の回路ユニットとして使用する場合には、一
方の基板1上にロジック回路を形成すると共に、他方の
基板2上に無線回路を夫々形成することが行われる。
2. Description of the Related Art Conventionally, a printed board having a joining structure in which two printed boards are joined together at their back surfaces to have circuits on both front and back surfaces has been widely used. FIG. 2 shows a conventional printed circuit board unit having a joint structure. The printed circuit board unit has a circuit pattern on one side and a conductor layer such as copper foil on the other side. It has a configuration in which the copper foil surfaces 3 are joined and integrated.
When a printed circuit board unit having such a joint structure is used as a circuit unit of a communication device, for example, a logic circuit is formed on one substrate 1 and a wireless circuit is formed on the other substrate 2, respectively. Is done.

【0003】ところで、前記無線回路は高周波を発生す
る電子部品及び回路を含み、生成される高周波ノイズが
ロジック回路側に回り込むとこれを誤作動させる原因と
なる。また、逆にロジック回路から発生するパルス雑音
などが高周波回路に混入すると高周波信号のS/Nが悪
化する。このため、従来から回路中の高周波発生部分周
辺にアースパタ−ンを形成しておき、このアースパター
ンを基板を貫通するスルーホールを介して前記銅箔3に
接続すると共に、所要部にシールドケースをかぶせるこ
とによりノイズをシールドする方法が採られている。
By the way, the radio circuit includes an electronic component and a circuit which generate a high frequency, and when the generated high frequency noise enters the logic circuit side, it causes a malfunction. Conversely, if pulse noise or the like generated from the logic circuit mixes into the high frequency circuit, the S / N of the high frequency signal deteriorates. For this reason, a ground pattern has been conventionally formed around the high frequency generating part in the circuit, and this ground pattern is connected to the copper foil 3 through a through hole penetrating the substrate, and a shield case is provided at a required part. The method of shielding noise by covering is adopted.

【0004】しかしながらこのような従来のシールド方
法によれば、高周波発生部分周辺に予めアースパターン
を形成しておくことが必要となるため、パターン構成を
複雑化するとともに電子部品の実装密度を低下させる原
因となる。更に、部分的にスルーホールを介して微小厚
の銅箔と接地しているに過ぎないため、シールド効果が
十分でない場合が多かった。
However, according to such a conventional shielding method, it is necessary to previously form a ground pattern around the high frequency generating portion, which complicates the pattern configuration and reduces the mounting density of electronic components. Cause. Further, since it is only partially grounded to the copper foil having a small thickness through the through hole, the shield effect is often insufficient.

【0005】[0005]

【発明の目的】本発明は上記に鑑みてなされたものであ
り、複数のプリント基板を背合わせで接合したプリント
板ユニットにおいて、一方の基板上の搭載部品が生成す
るノイズが他方の基板上の回路に悪影響を及ぼすことを
防止できるシールド構造であって比較的簡単な構造によ
り高いシールド効果を得ることができるプリント基板の
シールド構造を提供することを目的としている。
SUMMARY OF THE INVENTION The present invention has been made in view of the above, and in a printed circuit board unit in which a plurality of printed circuit boards are joined back to back, noise generated by a mounting component on one substrate is generated on the other substrate. It is an object of the present invention to provide a shield structure for a printed circuit board, which can prevent a bad influence on a circuit and can obtain a high shield effect by a relatively simple structure.

【0006】[0006]

【発明の概要】上記目的を達成するため本発明は、片面
に夫々回路パターンを有した2枚のプリント基板の他面
同士を、剛性を有しかつシールド効果を備えた広面積の
金属板を挟んで一体化すると共に、プリント基板周縁か
ら金属板の一部を突出させこの部分にシールドケースの
開口縁を固定することにより、シールドケース内に基板
上の回路を密封してノイズが外部へ出ることを防止した
ことを特徴とする。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a wide area metal plate having rigidity and a shield effect on the other surfaces of two printed boards each having a circuit pattern on one surface. By sandwiching and integrating, and by protruding part of the metal plate from the peripheral edge of the printed circuit board and fixing the opening edge of the shield case to this part, the circuit on the board is sealed in the shield case and noise is emitted to the outside. It is characterized by preventing this.

【0007】[0007]

【発明の実施例】以下、添付図面に示した実施例により
本発明を詳細に説明する。図1(a) 及び(b) は本発明の
プリント板ユニットの一例の構成を示す分解断面図及び
シールドケース装着状態を示す断面図であり、このプリ
ント板ユニットは上面4aに回路パターンを有した第1
のプリント基板4の非パターン面4bと、下面5aに回
路パターンを有した第2のプリント基板5の非パターン
面5bを、シールド効果が高く剛性を有した金属板6を
介して接着剤等により接合一体化したものである。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings. 1 (a) and 1 (b) are an exploded sectional view showing an example of the structure of a printed board unit of the present invention and a sectional view showing a state in which a shield case is mounted. This printed board unit has a circuit pattern on an upper surface 4a. First
The non-patterned surface 4b of the printed circuit board 4 and the non-patterned surface 5b of the second printed circuit board 5 having the circuit pattern on the lower surface 5a are bonded by an adhesive or the like via a metal plate 6 having a high shield effect and rigidity. It is one that is joined and integrated.

【0008】この金属板6はその上下面に接合した第1
及び第2のプリント基板4、5よりも広い面積を有し、
その周縁部6aが各プリント基板4、5の全周縁から所
定幅フランジ状に突出するよう構成する。金属板6の材
質としては銅、アルミなどが高周波信号に対してはシー
ルド効果が高く、また、鉄、リン青銅等は電磁シールド
効果が高い。従って、必要に応じて両者を使い分ける
が、両者を積層したものとしても良い。両者を積層する
に当っては、例えば銅板に鉄系のクロムメッキを施す、
或は逆に鉄板に銅をメッキする等が考えられる。
The metal plate 6 has the first and second upper and lower surfaces joined together.
And has a larger area than the second printed circuit boards 4 and 5,
The peripheral portion 6a is configured to protrude like a flange with a predetermined width from the entire peripheral edge of each printed circuit board 4, 5. As the material of the metal plate 6, copper, aluminum or the like has a high shielding effect against high frequency signals, and iron, phosphor bronze or the like has a high electromagnetic shielding effect. Therefore, both of them may be used as necessary, but they may be laminated. When laminating the two, for example, iron-based chrome plating is applied to a copper plate,
On the contrary, it is conceivable to plate an iron plate with copper.

【0009】この実施例では第1のプリント基板4上に
ロジック回路を搭載すると共に、第2のプリント基板5
の下面に無線回路を搭載した通信機器用の回路ユニット
を例示しており、第2のプリント基板5の下面全体を覆
うために金属板6の周縁部6aにシールドケース7の開
口縁7aを固定し、基板5の下面全体を完全密封してい
る。即ち、シールドケース7はハンダ付け或はネジ止め
等の固定方法によりその開口縁7aを金属板6の周縁部
6a上に気密的に固定されることにより、シールドケー
ス7内部にシールドルームを形成し、ルーム内の無線回
路が生成するノイズを外部、特に第1のプリント基板上
のロジック回路に及ぼさないようにしている。
In this embodiment, the logic circuit is mounted on the first printed circuit board 4 and the second printed circuit board 5 is used.
2 illustrates an example of a circuit unit for communication equipment in which a wireless circuit is mounted on the lower surface of the second printed circuit board 5. The opening edge 7a of the shield case 7 is fixed to the peripheral edge portion 6a of the metal plate 6 to cover the entire lower surface of the second printed circuit board 5. Then, the entire lower surface of the substrate 5 is completely sealed. That is, the shield case 7 is hermetically fixed on the peripheral edge 6a of the metal plate 6 by the fixing method such as soldering or screwing to form a shield room inside the shield case 7. The noise generated by the wireless circuit in the room is prevented from reaching the outside, particularly the logic circuit on the first printed board.

【0010】なお、上記実施例では各プリント基板4、
5として単層構造のものを例示したが、各プリント基板
自体が複数層のプリント基板から成るものであってもよ
い。このように本発明のシールド構造においては、2枚
のプリント基板の背面(パターン非形成面)同士を、剛
性を有しかつシールド効果を備えた金属板6を介して接
続一体化すると共に、プリント基板から突出した金属板
の周縁部を利用してシールドケースを固定することによ
り、シールドケース内に密封された回路で生成されたノ
イズが外部へ出ることを防止している。このため、従来
のように高周波発生部分周辺に予めアースパターンを形
成しておく必要がなくなるため、パターン構成を簡潔化
するとともに電子部品の実装密度を向上できる。更に、
シールドケースはその開口周縁部全体で金属板と密着固
定されるため、シールド効果が十分なものとなる。
In the above embodiment, each printed circuit board 4,
Although a single-layer structure is illustrated as 5, the printed circuit board itself may be composed of a plurality of layers. As described above, in the shield structure of the present invention, the back surfaces (pattern non-formation surfaces) of the two printed circuit boards are connected and integrated via the metal plate 6 having rigidity and the shield effect, By fixing the shield case using the peripheral portion of the metal plate protruding from the substrate, noise generated by the circuit sealed in the shield case is prevented from being emitted to the outside. Therefore, it is not necessary to previously form a ground pattern around the high frequency generating portion as in the conventional case, so that the pattern configuration can be simplified and the mounting density of electronic components can be improved. Furthermore,
Since the shield case is tightly fixed to the metal plate at the entire peripheral portion of the opening, the shield effect becomes sufficient.

【0011】また、金属板をはさんだ状態で2枚の基板
を接合するため、基板全体としての強度が向上し、反り
等の発生を防止でき、また金属板は基板上の発熱部品か
らの熱を放熱する効果を有する。
Further, since the two substrates are joined together with the metal plate sandwiched therebetween, the strength of the entire substrate is improved and warpage and the like can be prevented, and the metal plate is heated by the heat-generating components on the substrate. Has the effect of radiating heat.

【0012】[0012]

【発明の効果】このように本発明によれば、複数のプリ
ント基板を背合わせで接合したプリント板ユニットにお
いて、一方の基板上の搭載部品が生成するノイズが他方
の基板上の回路に悪影響を及ぼすことを防止できるシー
ルド構造であって比較的簡単な構造により高いシールド
効果を得ることができる。
As described above, according to the present invention, in a printed circuit board unit in which a plurality of printed circuit boards are joined back to back, noise generated by a mounting component on one of the substrates adversely affects a circuit on the other substrate. It is possible to obtain a high shielding effect with a relatively simple structure that can prevent the influence.

【図面の簡単な説明】[Brief description of drawings]

【図1】(a) 及び(b) は本発明のプリント板ユニットの
一例の構成を示す分解断面図及びシールドケース装着状
態を示す断面図である。
1A and 1B are an exploded sectional view showing a configuration of an example of a printed board unit of the present invention and a sectional view showing a shield case mounted state.

【図2】従来例の説明図である。FIG. 2 is an explanatory diagram of a conventional example.

【符号の説明】[Explanation of symbols]

1、4 第1の基板、2、5 第2の基板、3 銅箔
面、4a,5a 回路パターン面、4b,5b 非パタ
ーン面、6 金属板、6a 周縁部、7 シールドケー
1, 4 First substrate, 2, 5 Second substrate, 3 Copper foil surface, 4a, 5a Circuit pattern surface, 4b, 5b Non-pattern surface, 6 Metal plate, 6a Peripheral part, 7 Shield case

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも片面に回路パターンを有した
2枚のプリント基板を金属板の両面に添着すると共に、
該金属板の一部がプリント基板周縁から突出したもので
あって、該プリント基板周縁から突出した金属板周縁部
にシールドケースの開口縁を固定することにより、シー
ルドケース内に基板上の回路を密封したことを特徴とす
るプリント基板のシールド構造。
1. Two printed circuit boards having a circuit pattern on at least one side are attached to both sides of a metal plate, and
A part of the metal plate protrudes from the peripheral edge of the printed circuit board, and by fixing the opening edge of the shield case to the peripheral edge of the metal plate protruding from the peripheral edge of the printed circuit board, the circuit on the circuit board can be installed in the shield case. A shielded structure for printed circuit boards that is hermetically sealed.
【請求項2】 前記金属板は銅板にクロムメッキを施し
たもの、又は鉄系金属板に銅或はアルミニウムをメッキ
したものであることを特徴とする請求項1記載のプリン
ト基板のシールド構造。
2. The shield structure for a printed circuit board according to claim 1, wherein the metal plate is a copper plate plated with chromium, or an iron-based metal plate plated with copper or aluminum.
JP13987692A 1992-05-01 1992-05-01 Shield structure for printed circuit board Pending JPH05315790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13987692A JPH05315790A (en) 1992-05-01 1992-05-01 Shield structure for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13987692A JPH05315790A (en) 1992-05-01 1992-05-01 Shield structure for printed circuit board

Publications (1)

Publication Number Publication Date
JPH05315790A true JPH05315790A (en) 1993-11-26

Family

ID=15255629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13987692A Pending JPH05315790A (en) 1992-05-01 1992-05-01 Shield structure for printed circuit board

Country Status (1)

Country Link
JP (1) JPH05315790A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009088390A (en) * 2007-10-02 2009-04-23 Denso Corp Printed circuit board, method for manufacturing the printed circuit board, and electronic apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009088390A (en) * 2007-10-02 2009-04-23 Denso Corp Printed circuit board, method for manufacturing the printed circuit board, and electronic apparatus
US8139372B2 (en) 2007-10-02 2012-03-20 Denso Corporation Printed circuit board, method for manufacturing printed circuit board and electronic apparatus

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