JPH0530381B2 - - Google Patents

Info

Publication number
JPH0530381B2
JPH0530381B2 JP62271688A JP27168887A JPH0530381B2 JP H0530381 B2 JPH0530381 B2 JP H0530381B2 JP 62271688 A JP62271688 A JP 62271688A JP 27168887 A JP27168887 A JP 27168887A JP H0530381 B2 JPH0530381 B2 JP H0530381B2
Authority
JP
Japan
Prior art keywords
laminate
heat
weight
parts
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62271688A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01114433A (ja
Inventor
Takeo Kimura
Shunji Chikamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON KODOSHI KOGYO KK
Original Assignee
NIPPON KODOSHI KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON KODOSHI KOGYO KK filed Critical NIPPON KODOSHI KOGYO KK
Priority to JP27168887A priority Critical patent/JPH01114433A/ja
Publication of JPH01114433A publication Critical patent/JPH01114433A/ja
Publication of JPH0530381B2 publication Critical patent/JPH0530381B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
JP27168887A 1987-10-29 1987-10-29 耐熱積層体 Granted JPH01114433A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27168887A JPH01114433A (ja) 1987-10-29 1987-10-29 耐熱積層体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27168887A JPH01114433A (ja) 1987-10-29 1987-10-29 耐熱積層体

Publications (2)

Publication Number Publication Date
JPH01114433A JPH01114433A (ja) 1989-05-08
JPH0530381B2 true JPH0530381B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-05-07

Family

ID=17503464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27168887A Granted JPH01114433A (ja) 1987-10-29 1987-10-29 耐熱積層体

Country Status (1)

Country Link
JP (1) JPH01114433A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2797044B2 (ja) * 1992-04-20 1998-09-17 ニッポン高度紙工業 株式会社 接着方法及び接着性部材
DE102009041574A1 (de) * 2008-10-29 2010-05-12 Electrovac Ag Verbundmaterial, Verfahren zum Herstellen eines Verbundmaterials sowie Kleber oder Bondmaterial

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0665697B2 (ja) * 1986-02-27 1994-08-24 ニッポン高度紙工業株式会社 フレキシブルな耐熱性樹脂組成物

Also Published As

Publication number Publication date
JPH01114433A (ja) 1989-05-08

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